K.L. Tai
Impact in
- Hardware and Architecture top 10%
- VLSI and Analog Circuit Testing
-
- Radio Frequency Integrated Circuit Design
- Electromagnetic Compatibility and Noise Suppression
- 3D IC and TSV technologies
- Microwave Engineering and Waveguides
- Semiconductor materials and devices
- Electronic Packaging and Soldering Technologies
- Advancements in Semiconductor Devices and Circuit Design
Papers in
-
- 3D IC and TSV technologies 11
- Semiconductor materials and devices 10
- Radio Frequency Integrated Circuit Design 9
- Electromagnetic Compatibility and Noise Suppression 6
- Advancements in Semiconductor Devices and Circuit Design 5
- Electronic Packaging and Soldering Technologies 5
- Photonic and Optical Devices 4
- Microwave Engineering and Waveguides 4
- Co-authors
- R.C. Frye (22 shared papers)M.Y. Lau (14 shared papers)Jenshan Lin (5 shared papers)D. Kossives (5 shared papers)T. Gabara (6 shared papers)W.W.-M. Dai (3 shared papers)Young-Kai Chen (2 shared papers)Huan-Shang Tsai (1 shared paper)
- Journals
- Electronics Letters (1 paper)IEEE Transactions on Components Packaging and Manufacturing Technology Part B (2 papers)International Journal of High Speed Electronics and Systems (1 paper)IEEE Transactions on Components Hybrids and Manufacturing Technology (1 paper)Electrical Performance of Electronic Packaging (1 paper)
- Partner nations
- United StatesTaiwan
In The Last Decade
K.L. Tai
25 papers receiving 183 citations
Peers
Comparison fields: 5 of 17
- Hardware and Architecture 33
- Electrical and Electronic Engineering 195
- Condensed Matter Physics 10
- Computer Networks and Communications 18
- Biomedical Engineering 23
Countries citing papers authored by K.L. Tai
This map shows the geographic impact of K.L. Tai's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by K.L. Tai with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites K.L. Tai more than expected).
Fields of papers citing papers by K.L. Tai
This network shows the impact of papers produced by K.L. Tai. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by K.L. Tai. The network helps show where K.L. Tai may publish in the future.
Co-authors
The 25 scholars most cited alongside K.L. Tai, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 30 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 1997 | 28 | |
| 2 | 1996 | 22 | |
| 3 | 2002 | 22 | |
| 4 | 1992 | 18 | |
| 5 | System-In-Package (SIP): Challenges and Opportunities | 2000 | 16 |
| 6 | 2002 | 12 | |
| 7 | 2002 | 12 | |
| 8 | 2002 | 11 | |
| 9 | 1993 | 11 | |
| 10 | 2003 | 7 | |
| 11 | 2002 | 7 | |
| 12 | 2002 | 6 | |
| 13 | 2002 | 5 | |
| 14 | 2002 | 4 | |
| 15 | 1991 | 4 | |
| 16 | 2002 | 3 | |
| 17 | 2003 | 2 | |
| 18 | 2002 | 2 | |
| 19 | 2002 | 2 | |
| 20 | 1990 | 2 |
About K.L. Tai
K.L. Tai is a scholar working on Electrical and Electronic Engineering, Hardware and Architecture, Biomedical Engineering, Computer Networks and Communications and Condensed Matter Physics, having authored 30 papers that have together received 207 indexed citations. Recurring topics across this work include 3D IC and TSV technologies (11 papers), Semiconductor materials and devices (10 papers), Radio Frequency Integrated Circuit Design (9 papers), Electromagnetic Compatibility and Noise Suppression (6 papers), Advancements in Semiconductor Devices and Circuit Design (5 papers), Electronic Packaging and Soldering Technologies (5 papers), Photonic and Optical Devices (4 papers) and Microwave Engineering and Waveguides (4 papers). The work is most often cited by research in Hardware and Architecture (33 citations), Electrical and Electronic Engineering (195 citations), Condensed Matter Physics (10 citations), Computer Networks and Communications (18 citations) and Biomedical Engineering (23 citations). K.L. Tai has collaborated with scholars based in United States and Taiwan. Frequent co-authors include R.C. Frye, M.Y. Lau, Jenshan Lin, D. Kossives, T. Gabara, W.W.-M. Dai, Young-Kai Chen, Huan-Shang Tsai, Yicheng Lu and P. A. Sullivan. Their work appears in journals such as Electronics Letters, IEEE Transactions on Components Packaging and Manufacturing Technology Part B, International Journal of High Speed Electronics and Systems, IEEE Transactions on Components Hybrids and Manufacturing Technology and Electrical Performance of Electronic Packaging.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.