Jinwon Joo

434 total citations
31 papers, 331 citations indexed

About

Jinwon Joo is a scholar working on Mechanics of Materials, Electrical and Electronic Engineering and Mechanical Engineering. According to data from OpenAlex, Jinwon Joo has authored 31 papers receiving a total of 331 indexed citations (citations by other indexed papers that have themselves been cited), including 16 papers in Mechanics of Materials, 14 papers in Electrical and Electronic Engineering and 12 papers in Mechanical Engineering. Recurrent topics in Jinwon Joo's work include Adhesion, Friction, and Surface Interactions (12 papers), Electronic Packaging and Soldering Technologies (10 papers) and Advanced Measurement and Metrology Techniques (6 papers). Jinwon Joo is often cited by papers focused on Adhesion, Friction, and Surface Interactions (12 papers), Electronic Packaging and Soldering Technologies (10 papers) and Advanced Measurement and Metrology Techniques (6 papers). Jinwon Joo collaborates with scholars based in South Korea, United States and Germany. Jinwon Joo's co-authors include R.B. Poeppel, Sung‐Hoon Choa, J. P. Singh, Bongtae Han, Nan Chen, D. Singh, K. C. Goretta, M. E. Loomans, Jin Yong Lee and S.W. Byun and has published in prestigious journals such as Journal of Materials Processing Technology, Journal of materials research/Pratt's guide to venture capital sources and Synthetic Metals.

In The Last Decade

Jinwon Joo

26 papers receiving 307 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Jinwon Joo South Korea 10 137 116 115 63 60 31 331
H. Ishigaki Japan 10 57 0.4× 124 1.1× 188 1.6× 145 2.3× 109 1.8× 38 480
J. P. Charlesworth United Kingdom 9 137 1.0× 77 0.7× 146 1.3× 33 0.5× 106 1.8× 20 395
M. Takahashi Japan 13 158 1.2× 78 0.7× 69 0.6× 202 3.2× 23 0.4× 41 403
Laurent Béchou France 12 51 0.4× 282 2.4× 80 0.7× 9 0.1× 75 1.3× 67 405
K. Matsunaga Japan 10 135 1.0× 165 1.4× 70 0.6× 55 0.9× 32 0.5× 22 349
Bruce Geil United States 15 48 0.4× 360 3.1× 34 0.3× 30 0.5× 42 0.7× 41 492
Meredith Wetzel United States 13 240 1.8× 361 3.1× 49 0.4× 50 0.8× 126 2.1× 23 528
D M McRae United States 13 426 3.1× 263 2.3× 476 4.1× 60 1.0× 45 0.8× 22 640
Lihong Zhu China 12 172 1.3× 195 1.7× 74 0.6× 46 0.7× 10 0.2× 54 347

Countries citing papers authored by Jinwon Joo

Since Specialization
Citations

This map shows the geographic impact of Jinwon Joo's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Jinwon Joo with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Jinwon Joo more than expected).

Fields of papers citing papers by Jinwon Joo

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Jinwon Joo. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Jinwon Joo. The network helps show where Jinwon Joo may publish in the future.

Co-authorship network of co-authors of Jinwon Joo

This figure shows the co-authorship network connecting the top 25 collaborators of Jinwon Joo. A scholar is included among the top collaborators of Jinwon Joo based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Jinwon Joo. Jinwon Joo is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Joo, Jinwon. (2024). Thermo‐mechanical behavior of ball grid packages with different solder ball grid patterns investigated through moiré interferometry. Materialwissenschaft und Werkstofftechnik. 55(5). 598–609. 1 indexed citations
2.
Kang, Min‐Jung, et al.. (2019). Effects of a compaction method for powder compacts on the critical current density of MgB2 bulk superconductors. Progress in Superconductivity and Cryogenics. 21(2). 40–44. 1 indexed citations
3.
Lee, Bong‐Hee & Jinwon Joo. (2011). Assessment of Viscoplastic Deformation Behavior of Eutectic Solder and Lead-free Solder. Journal of the Microelectronics and Packaging Society. 18(2). 17–27. 1 indexed citations
4.
Choi, Joo-Ho, et al.. (2010). Bayesian Approach for Parameter Estimation in the Structural Analysis and Prognosis. Annual Conference of the PHM Society. 2(1). 6 indexed citations
5.
Lee, Bong‐Hee, et al.. (2010). Thermo-mechanical Behavior of WB-PBGA Packages with Pb-Sn Solder and Lead-free Solder Using Moire Interferometry. Journal of the Microelectronics and Packaging Society. 17(3). 17–26. 2 indexed citations
6.
7.
Joo, Jinwon, et al.. (2009). The Effect of Finite Element Models in Thermal Analysis of Electronic Packages. Transactions of the Korean Society of Mechanical Engineers A. 33(4). 380–387. 5 indexed citations
8.
Choi, Joo-Ho, et al.. (2007). A study on robust optimization of layered plates bonding process based on inverse analysis. Journal of Materials Processing Technology. 201(1-3). 261–266. 1 indexed citations
9.
Joo, Jinwon, et al.. (2004). Evaluation of thermal deformation model for BGA packages using moiré interferometry. KSME International Journal. 18(2). 230–239. 3 indexed citations
10.
Joo, Jinwon, et al.. (2004). Characterization of flexural and thermo-mechanical behavior of plastic ball grid package assembly using moiré interferometry. Microelectronics Reliability. 45(3-4). 637–646. 14 indexed citations
11.
Han, Bongtae, et al.. (2004). Temperature Dependent Deformation Analysis of Ceramic Ball Grid Array Package Assembly Under Accelerated Thermal Cycling Condition. Journal of Electronic Packaging. 126(1). 41–47. 20 indexed citations
12.
Han, Bongtae & Jinwon Joo. (2002). Thermo-mechanical and Flexural Analysis of WB-PBGA Package Using Moire Interferometry. Transactions of the Korean Society of Mechanical Engineers A. 26(7). 1302–1308. 2 indexed citations
13.
Joo, Jinwon, et al.. (2002). Thermo-mechanical and flexural behavior of WB-PBGA package using moire interferometry. 421–427. 3 indexed citations
14.
Jang, Jinsung, et al.. (1998). Geometric variations and surface residual stresses in U-bending processes of an UNS N06690 row-1 heat exchanger tubes. Transactions of the Korean Society of Mechanical Engineers A. 22(1). 238–246.
15.
Joo, Jinwon, et al.. (1997). Design of sensing element for 3-component load cell using parallel plate structure. Transactions of the Korean Society of Mechanical Engineers A. 21(11). 1871–1884. 4 indexed citations
16.
Joo, Jinwon, et al.. (1997). Design and evaluation of binocular type six-component load cell by using experimental technique. Transactions of the Korean Society of Mechanical Engineers A. 21(11). 1921–1930. 8 indexed citations
17.
Goretta, K. C., Michael T. Lanagan, S. E. Dorris, et al.. (1994). Processing and properties of bulk BiSrCaCuO superconductors. Applied Superconductivity. 2(6). 411–415. 12 indexed citations
18.
Singh, J. P., et al.. (1993). Effects of silver additions on resistance to thermal shock and delayed failure of YBa2Cu3O7−δ superconductors. Journal of materials research/Pratt's guide to venture capital sources. 8(6). 1226–1231. 29 indexed citations
19.
Goretta, K. C., et al.. (1993). Fracture of dense, textured Bi2Sr2CaCu2Ox. Superconductor Science and Technology. 6(4). 282–286. 29 indexed citations
20.
Joo, Jinwon, et al.. (1990). Calculation of rated output in diaphragm type miniature load cell. Journal of the Korean Society for Precision Engineering. 7(2). 58–64.

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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