Jinhu Fan

423 total citations
12 papers, 325 citations indexed

About

Jinhu Fan is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Biomedical Engineering. According to data from OpenAlex, Jinhu Fan has authored 12 papers receiving a total of 325 indexed citations (citations by other indexed papers that have themselves been cited), including 10 papers in Electrical and Electronic Engineering, 3 papers in Mechanical Engineering and 3 papers in Biomedical Engineering. Recurrent topics in Jinhu Fan's work include Electronic Packaging and Soldering Technologies (7 papers), 3D IC and TSV technologies (6 papers) and Nanomaterials and Printing Technologies (5 papers). Jinhu Fan is often cited by papers focused on Electronic Packaging and Soldering Technologies (7 papers), 3D IC and TSV technologies (6 papers) and Nanomaterials and Printing Technologies (5 papers). Jinhu Fan collaborates with scholars based in China. Jinhu Fan's co-authors include Zirong Tang, Guanglan Liao, Tielin Shi, Xing Yu, Junjie Li, Siyi Cheng, Tianxiang Li, Liang Qi, Feng Chen and Junjie Li and has published in prestigious journals such as Journal of Alloys and Compounds, Surface and Coatings Technology and Crystal Growth & Design.

In The Last Decade

Jinhu Fan

11 papers receiving 321 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Jinhu Fan China 7 250 133 71 56 48 12 325
Zou Guisheng China 5 168 0.7× 250 1.9× 92 1.3× 47 0.8× 60 1.3× 13 401
Seyed Amir Paknejad United Kingdom 6 306 1.2× 213 1.6× 57 0.8× 53 0.9× 27 0.6× 10 368
Salvador A. Barriga United States 3 309 1.2× 130 1.0× 171 2.4× 39 0.7× 51 1.1× 3 475
Zhihui Li China 12 160 0.6× 40 0.3× 102 1.4× 235 4.2× 33 0.7× 19 365
Masoud Sakaki Germany 11 124 0.5× 151 1.1× 118 1.7× 33 0.6× 24 0.5× 39 338
Jing Cao China 10 121 0.5× 87 0.7× 187 2.6× 71 1.3× 96 2.0× 36 305
Shayan Byrappa United States 8 212 0.8× 60 0.5× 102 1.4× 58 1.0× 62 1.3× 16 348
Cheng‐An Hsieh Taiwan 7 148 0.6× 291 2.2× 167 2.4× 41 0.7× 22 0.5× 9 524

Countries citing papers authored by Jinhu Fan

Since Specialization
Citations

This map shows the geographic impact of Jinhu Fan's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Jinhu Fan with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Jinhu Fan more than expected).

Fields of papers citing papers by Jinhu Fan

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Jinhu Fan. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Jinhu Fan. The network helps show where Jinhu Fan may publish in the future.

Co-authorship network of co-authors of Jinhu Fan

This figure shows the co-authorship network connecting the top 25 collaborators of Jinhu Fan. A scholar is included among the top collaborators of Jinhu Fan based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Jinhu Fan. Jinhu Fan is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

12 of 12 papers shown
1.
Zhang, Tao, et al.. (2025). Water vapor corrosion resistance of a novel environmental barrier coating candidate (Yb0.2Y0.2Lu0.2Er0.2Sc0.2)2Si2O7. Surface and Coatings Technology. 500. 131907–131907. 5 indexed citations
2.
Cheng, Zhengwang, Aobo Wang, Shengjia Li, et al.. (2023). Realizing Ultrauniform Films at Wafer Scale through the Magnetron Sputtering Method. Crystal Growth & Design. 24(1). 339–346. 3 indexed citations
3.
4.
Li, Junjie, Liang Qi, Tielin Shi, et al.. (2018). Design of Cu nanoaggregates composed of ultra-small Cu nanoparticles for Cu-Cu thermocompression bonding. Journal of Alloys and Compounds. 772. 793–800. 81 indexed citations
5.
Fan, Jinhu, Tielin Shi, Zirong Tang, et al.. (2018). Low-Temperature Cu-Cu Bonding Process Based on the Sn-Cu Multilayer and Self-Propagating Reaction Joining. Journal of Electronic Materials. 48(2). 1310–1317. 4 indexed citations
6.
Li, Junjie, Xing Yu, Tielin Shi, et al.. (2017). Low-Temperature and Low-Pressure Cu–Cu Bonding by Highly Sinterable Cu Nanoparticle Paste. Nanoscale Research Letters. 12(1). 255–255. 62 indexed citations
7.
Li, Junjie, Tielin Shi, Xing Yu, et al.. (2017). A novel method of synthesizing antioxidative copper nanoparticles for high performance conductive ink. Journal of Materials Science Materials in Electronics. 28(18). 13556–13564. 11 indexed citations
8.
Yu, Xing, Junjie Li, Tielin Shi, et al.. (2017). A green approach of synthesizing of Cu-Ag core-shell nanoparticles and their sintering behavior for printed electronics. Journal of Alloys and Compounds. 724. 365–372. 83 indexed citations
9.
Li, Junjie, Xing Yu, Tielin Shi, et al.. (2017). Depressing of Cu Cu bonding temperature by composting Cu nanoparticle paste with Ag nanoparticles. Journal of Alloys and Compounds. 709. 700–707. 41 indexed citations
10.
Li, Junjie, Tielin Shi, Feng Chen, et al.. (2017). The novel Cu nanoaggregates formed by 5 nm Cu nanoparticles with high sintering performance at low temperature. Materials Letters. 216. 20–23. 23 indexed citations
11.
Li, Junjie, Tielin Shi, Xing Yu, et al.. (2017). Low-Temperature and Low-Pressure Cu-Cu Bonding by Pure Cu Nanosolder Paste for Wafer-Level Packaging. 976–981. 6 indexed citations
12.
Fan, Jinhu, Tielin Shi, Junjie Li, et al.. (2017). The Cu Cu self-propagating reaction joining with different thickness of tin. Journal of Alloys and Compounds. 735. 1189–1194. 6 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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2026