D. Ingerly

1.5k total citations
6 papers, 137 citations indexed

About

D. Ingerly is a scholar working on Electrical and Electronic Engineering, Hardware and Architecture and Computer Networks and Communications. According to data from OpenAlex, D. Ingerly has authored 6 papers receiving a total of 137 indexed citations (citations by other indexed papers that have themselves been cited), including 6 papers in Electrical and Electronic Engineering, 2 papers in Hardware and Architecture and 1 paper in Computer Networks and Communications. Recurrent topics in D. Ingerly's work include 3D IC and TSV technologies (5 papers), Parallel Computing and Optimization Techniques (2 papers) and Physics of Superconductivity and Magnetism (1 paper). D. Ingerly is often cited by papers focused on 3D IC and TSV technologies (5 papers), Parallel Computing and Optimization Techniques (2 papers) and Physics of Superconductivity and Magnetism (1 paper). D. Ingerly collaborates with scholars based in United States and India. D. Ingerly's co-authors include Frank O’Mahony, Wilfred Gomes, Lei Jiang, Ajay Balankutty, Rajesh Kumar, Martin Dixon, Tejas Shah, Arun G. Chandrasekhar, Eric Karl and Cole Petersburg and has published in prestigious journals such as Superconductor Science and Technology and 2022 IEEE International Solid- State Circuits Conference (ISSCC).

In The Last Decade

D. Ingerly

6 papers receiving 135 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name	h						Papers	Cites
D. Ingerly United States	4	106	35	33	11	11	6	137
John Wuu United States	7	196 1.8×	68 1.9×	97 2.9×	8 0.7×	19 1.7×	14	253
Joo-Sun Choi South Korea	9	278 2.6×	29 0.8×	38 1.2×	7 0.6×	35 3.2×	13	301
Tadashi Yasufuku Japan	10	259 2.4×	60 1.7×	37 1.1×	4 0.4×	68 6.2×	21	273
A. Sugavanam United States	3	152 1.4×	111 3.2×	38 1.2×	21 1.9×	16 1.5×	4	204
Gordon Gammie United States	8	248 2.3×	29 0.8×	94 2.8×	4 0.4×	60 5.5×	17	283
Sumin Choi South Korea	12	327 3.1×	21 0.6×	62 1.9×	20 1.8×	29 2.6×	43	349
R. Hopkins United States	7	318 3.0×	118 3.4×	60 1.8×	10 0.9×	46 4.2×	9	348
D. Mizoguchi Japan	8	421 4.0×	91 2.6×	44 1.3×	10 0.9×	56 5.1×	13	442
Sukeshwar Kannan United States	12	328 3.1×	25 0.7×	78 2.4×	25 2.3×	37 3.4×	46	361
Jung-Bae Lee South Korea	9	169 1.6×	40 1.1×	56 1.7×	3 0.3×	48 4.4×	26	202

Countries citing papers authored by D. Ingerly

Since Specialization

Citations

This map shows the geographic impact of D. Ingerly's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by D. Ingerly with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites D. Ingerly more than expected).

Fields of papers citing papers by D. Ingerly

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by D. Ingerly. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by D. Ingerly. The network helps show where D. Ingerly may publish in the future.

Co-authorship network of co-authors of D. Ingerly

This figure shows the co-authorship network connecting the top 25 collaborators of D. Ingerly. A scholar is included among the top collaborators of D. Ingerly based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with D. Ingerly. D. Ingerly is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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6 of 6 papers shown

1.

Gomes, Wilfred, D. Ingerly, Tejas Shah, et al.. (2022). Ponte Vecchio: A Multi-Tile 3D Stacked Processor for Exascale Computing. 2022 IEEE International Solid- State Circuits Conference (ISSCC). 42–44. 59 indexed citations

2.

Gomes, Wilfred, D. Ingerly, Frank O’Mahony, et al.. (2020). 8.1 Lakefield and Mobility Compute: A 3D Stacked 10nm and 22FFL Hybrid Processor System in 12×12mm², 1mm Package-on-Package. 144–146. 58 indexed citations

3.

Prasad, C., Sunny Chugh, M. A. Maksud, et al.. (2020). Silicon Reliability Characterization of Intel’s Foveros 3D Integration Technology for Logic-on-Logic Die Stacking. 8 indexed citations

4.

Fischer, K., D. Ingerly, Ik Kyeong Jin, et al.. (2016). Performance enhancement for 14nm high volume manufacturing microprocessor and system on a chip processes. 5–7. 9 indexed citations

5.

Zhou, Ying, T. Scherban, Jun He, et al.. (2004). Impact of interfacial chemistry on adhesion and electromigration in Cu interconnects. 189–199. 2 indexed citations

6.

Ingerly, D., et al.. (1995). Use of X-ray imaging for the evaluation of superconducting ceramics fabricated by the powder-in-tube method. Superconductor Science and Technology. 8(10). 779–782. 1 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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