J. Cl. Puippe

11 papers receiving 353 citations

Peers

J. Cl. Puippe
Comparison fields: 5 of 45
  • Electrical and Electronic Engineering 275
  • Materials Chemistry 150
  • Atomic and Molecular Physics, and Optics 62
  • Electrochemistry 62
  • Biomedical Engineering 58
Replace K. Vu Quang with:
K. Vu Quang France
J.W. Dini United States
Shixin Gao China
H. Ezaki Japan
S.M. Lari Baghal Iran
Sobha Jayakrishnan India
A. G. Gad‐Allah Egypt
Z. Świątek Poland
Yanchao Guan China
Witold Kucza Poland
J. Cl. Puippe relative to K. Vu Quang France K. Vu Quang's profile →
Citations per field
00.5×5.3×
K. Vu Quang · 1×
Citations per year

Countries citing papers authored by J. Cl. Puippe

Since Specialization
Citations

This map shows the geographic impact of J. Cl. Puippe's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by J. Cl. Puippe with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites J. Cl. Puippe more than expected).

Fields of papers citing papers by J. Cl. Puippe

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by J. Cl. Puippe. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by J. Cl. Puippe. The network helps show where J. Cl. Puippe may publish in the future.

Co-authorship network of co-authors of J. Cl. Puippe

This figure shows the co-authorship network connecting the top 25 collaborators of J. Cl. Puippe. A scholar is included among the top collaborators of J. Cl. Puippe based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with J. Cl. Puippe. J. Cl. Puippe is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

12 of 12 papers shown
#WorkIndexed citations
1 1
2 9
3
Influence of surface aspects and properties of MIM titanium alloys for medical applications
4
4
Procédés innovants de fabrication et de fonctionnalisation du titane implantable : évaluation biologique et physico-chimique
1
5 1
6 3
7 1
8 10
9 88
10 116
11
THE MORPHOLOGY OF PULSE-PLATED DEPOSITS
3
12 140

About J. Cl. Puippe

J. Cl. Puippe is a scholar working on Electrochemistry, Mechanics of Materials and Electrical and Electronic Engineering, having authored 12 papers that have together received 377 indexed citations. Recurring topics across this work include Electrodeposition and Electroless Coatings (6 papers), Copper Interconnects and Reliability (2 papers) and Bone Tissue Engineering Materials (2 papers). The work is most often cited by research in Electrochemistry (62 citations), Metals and Alloys (14 citations) and Electrical and Electronic Engineering (275 citations). J. Cl. Puippe has collaborated with scholars based in Switzerland, Poland and Germany. Frequent co-authors include N. Ibl, H. Angerer, R. E. Acosta, R. J. von Gutfeld, A. Michalski, M. J. Grzybowski, Clémence Demangel, Pascale Vigneron, Jean-Luc Duval and M.D. Nagel. Their work appears in journals such as Journal of The Electrochemical Society, Journal of Applied Electrochemistry and Transactions of the IMF.

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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2026