Howard L. Heck
- Electrical and Electronic Engineering top 10%
- Aerospace Engineering top 10%
- Atomic and Molecular Physics, and Optics
- Hardware and Architecture top 10%
- Electronic, Optical and Magnetic Materials
- Co-authors
- S. HallJamesina SimpsonJason MixAllen TafloveTao LiangStephen HallReydezel Torres‐TorresJ.G. Delgado-Frias
- Topics
- Electromagnetic Compatibility and Noise Suppression (6 papers)Microwave Engineering and Waveguides (5 papers)3D IC and TSV technologies (4 papers)
- Journals
- IEEE Transactions on Microwave Theory and TechniquesIEEE Transactions on ComputersIEEE Microwave and Wireless Components Letters
- Partner nations
- United StatesMalaysiaUnited Kingdom
In The Last Decade
Howard L. Heck
14 papers receiving 539 citations
Hit Papers
Peers
Comparison fields: 5 of 49
- Electrical and Electronic Engineering 556
- Aerospace Engineering 121
- Atomic and Molecular Physics, and Optics 34
- Hardware and Architecture 31
- Electronic, Optical and Magnetic Materials 30
Countries citing papers authored by Howard L. Heck
This map shows the geographic impact of Howard L. Heck's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Howard L. Heck with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Howard L. Heck more than expected).
Fields of papers citing papers by Howard L. Heck
This network shows the impact of papers produced by Howard L. Heck. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Howard L. Heck. The network helps show where Howard L. Heck may publish in the future.
Co-authorship network of co-authors of Howard L. Heck
This figure shows the co-authorship network connecting the top 25 collaborators of Howard L. Heck. A scholar is included among the top collaborators of Howard L. Heck based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Howard L. Heck. Howard L. Heck is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 0 | |
| 2 | 1 | |
| 3 | 1 | |
| 4 | 3 | |
| 5 | IEEE Components, Packaging and Manufacturing Technology Society | 1 |
| 6 | Advanced Signal Integrity for High‐Speed Digital Designsbreakdown → | 405 |
| 7 | 1 | |
| 8 | 50 | |
| 9 | 44 | |
| 10 | 6 | |
| 11 | 12 | |
| 12 | 18 | |
| 13 | 2 | |
| 14 | 36 | |
| 15 | 17 |
About Howard L. Heck
Howard L. Heck is a scholar working on Electrical and Electronic Engineering, Hardware and Architecture and Computer Networks and Communications, having authored 15 papers that have together received 597 indexed citations. Recurring topics across this work include Electromagnetic Compatibility and Noise Suppression (6 papers), Microwave Engineering and Waveguides (5 papers) and 3D IC and TSV technologies (4 papers). The work is most often cited by research in Electrical and Electronic Engineering (556 citations), Aerospace Engineering (121 citations) and Hardware and Architecture (31 citations). Howard L. Heck has collaborated with scholars based in United States, Malaysia and United Kingdom. Frequent co-authors include S. Hall, Jamesina Simpson, Jason Mix, Allen Taflove, Tao Liang, S. Hall, Stephen Hall, Reydezel Torres‐Torres and J.G. Delgado-Frias. Their work appears in journals such as IEEE Transactions on Microwave Theory and Techniques, IEEE Transactions on Computers and IEEE Microwave and Wireless Components Letters.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.