Eric Bogatin
Impact in
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- Electromagnetic Compatibility and Noise Suppression
- 3D IC and TSV technologies
- Electronic Packaging and Soldering Technologies
- Microwave Engineering and Waveguides
- Electrostatic Discharge in Electronics
- Low-power high-performance VLSI design
- Advancements in PLL and VCO Technologies
- Hardware and Architecture top 10%
Papers in
-
- Electromagnetic Compatibility and Noise Suppression 20
- 3D IC and TSV technologies 9
- Microwave and Dielectric Measurement Techniques 7
- Electronic Packaging and Soldering Technologies 6
- Microwave Engineering and Waveguides 5
- Electromagnetic Compatibility and Measurements 5
- Electrostatic Discharge in Electronics 5
- Power Line Communications and Noise 3
- Co-authors
- Larry Smith (1 shared paper)Yazi Cao (1 shared paper)Paul G. Huray (1 shared paper)Antonio Ciccomancini Scogna (1 shared paper)M. Piket-May (7 shared papers)Paul Sherlock (1 shared paper)Francesco de Paulis (1 shared paper)Fadi P. Deek (1 shared paper)
- Journals
- IEEE Microwave Magazine (2 papers)IEEE Transactions on Components Packaging and Manufacturing Technology (1 paper)IEEE Electromagnetic Compatibility Magazine (2 papers)IEEE Transactions on Components Hybrids and Manufacturing Technology (2 papers)CERN Document Server (European Organization for Nuclear Research) (2 papers)
- Partner nations
- United StatesItalyCanada
In The Last Decade
Eric Bogatin
25 papers receiving 590 citations
Peers
Comparison fields: 5 of 55
- Electrical and Electronic Engineering 595
- Hardware and Architecture 41
- Aerospace Engineering 84
- Astronomy and Astrophysics 24
- Control and Systems Engineering 31
Countries citing papers authored by Eric Bogatin
This map shows the geographic impact of Eric Bogatin's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Eric Bogatin with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Eric Bogatin more than expected).
Fields of papers citing papers by Eric Bogatin
This network shows the impact of papers produced by Eric Bogatin. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Eric Bogatin. The network helps show where Eric Bogatin may publish in the future.
Co-authors
The 11 scholars most cited alongside Eric Bogatin, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 30 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | Signal and Power Integrity - Simplified | 2009 | 234 |
| 2 | Signal Integrity - Simplified | 2003 | 231 |
| 3 | 1988 | 63 | |
| 4 | 2011 | 23 | |
| 5 | 2011 | 21 | |
| 6 | Which one is better? Comparing Options to Describe Frequency Dependent Losses | 2013 | 16 |
| 7 | 2018 | 15 | |
| 8 | 1990 | 12 | |
| 9 | 2016 | 9 | |
| 10 | Practical Analysis of Backplane Vias | 2009 | 6 |
| 11 | 2017 | 6 | |
| 12 | 2004 | 4 | |
| 13 | 2010 | 4 | |
| 14 | 2022 | 3 | |
| 15 | 2017 | 2 | |
| 16 | Method of Modeling Differential Vias | 2011 | 2 |
| 17 | 2022 | 2 | |
| 18 | 2021 | 1 | |
| 19 | 2008 | 1 | |
| 20 | 2002 | 1 |
About Eric Bogatin
Eric Bogatin is a scholar working on Electrical and Electronic Engineering, Computer Networks and Communications, Aerospace Engineering, Astronomy and Astrophysics and Hardware and Architecture, having authored 30 papers that have together received 661 indexed citations. Recurring topics across this work include Electromagnetic Compatibility and Noise Suppression (20 papers), 3D IC and TSV technologies (9 papers), Microwave and Dielectric Measurement Techniques (7 papers), Electronic Packaging and Soldering Technologies (6 papers), Microwave Engineering and Waveguides (5 papers), Electromagnetic Compatibility and Measurements (5 papers), Electrostatic Discharge in Electronics (5 papers) and Power Line Communications and Noise (3 papers). The work is most often cited by research in Electrical and Electronic Engineering (595 citations), Hardware and Architecture (41 citations), Aerospace Engineering (84 citations), Astronomy and Astrophysics (24 citations) and Control and Systems Engineering (31 citations). Eric Bogatin has collaborated with scholars based in United States, Italy and Canada. Frequent co-authors include Larry Smith, Yazi Cao, Paul G. Huray, Antonio Ciccomancini Scogna, M. Piket-May, Paul Sherlock, Francesco de Paulis, Fadi P. Deek, Francisco J. Pérez‐Alonso and Bryan Crawford. Their work appears in journals such as IEEE Microwave Magazine, IEEE Transactions on Components Packaging and Manufacturing Technology, IEEE Electromagnetic Compatibility Magazine, IEEE Transactions on Components Hybrids and Manufacturing Technology and CERN Document Server (European Organization for Nuclear Research).
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.