Horst Rempp

408 total citations
19 papers, 338 citations indexed

About

Horst Rempp is a scholar working on Electrical and Electronic Engineering, Biomedical Engineering and Atomic and Molecular Physics, and Optics. According to data from OpenAlex, Horst Rempp has authored 19 papers receiving a total of 338 indexed citations (citations by other indexed papers that have themselves been cited), including 19 papers in Electrical and Electronic Engineering, 9 papers in Biomedical Engineering and 3 papers in Atomic and Molecular Physics, and Optics. Recurrent topics in Horst Rempp's work include 3D IC and TSV technologies (12 papers), Advanced MEMS and NEMS Technologies (8 papers) and Advancements in Semiconductor Devices and Circuit Design (8 papers). Horst Rempp is often cited by papers focused on 3D IC and TSV technologies (12 papers), Advanced MEMS and NEMS Technologies (8 papers) and Advancements in Semiconductor Devices and Circuit Design (8 papers). Horst Rempp collaborates with scholars based in Germany, Ireland and France. Horst Rempp's co-authors include Joachim N. Burghartz, Martin Zimmermann, Christine Harendt, H. Richter, Martín Zimmermann, Christian Reuter, Thai Thanh Hoang Thi, S. Minehane and A. Scorzoni and has published in prestigious journals such as IEEE Transactions on Electron Devices, IEEE Electron Device Letters and Solid-State Electronics.

In The Last Decade

Horst Rempp

19 papers receiving 323 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Horst Rempp Germany 11 276 227 28 25 23 19 338
Martin Zimmermann Germany 10 283 1.0× 241 1.1× 23 0.8× 39 1.6× 28 1.2× 18 346
María T. Arroyo Spain 5 219 0.8× 285 1.3× 20 0.7× 44 1.8× 15 0.7× 11 356
Christine Harendt Germany 15 494 1.8× 322 1.4× 44 1.6× 37 1.5× 24 1.0× 56 589
Erwin Bosman Belgium 12 443 1.6× 316 1.4× 35 1.3× 59 2.4× 18 0.8× 54 591
Kai Zoschke Germany 14 586 2.1× 167 0.7× 26 0.9× 34 1.4× 18 0.8× 64 624
Bram Van Hoe Belgium 11 332 1.2× 199 0.9× 19 0.7× 75 3.0× 16 0.7× 42 457
Ratul Kumar Baruah India 10 342 1.2× 181 0.8× 19 0.7× 8 0.3× 21 0.9× 32 461
Kyung-Hwan Kim South Korea 11 270 1.0× 81 0.4× 14 0.5× 21 0.8× 45 2.0× 27 337
Myriam Willegems Belgium 11 330 1.2× 182 0.8× 14 0.5× 31 1.2× 72 3.1× 26 402
Ziliang Cai United States 9 170 0.6× 318 1.4× 26 0.9× 23 0.9× 12 0.5× 16 389

Countries citing papers authored by Horst Rempp

Since Specialization
Citations

This map shows the geographic impact of Horst Rempp's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Horst Rempp with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Horst Rempp more than expected).

Fields of papers citing papers by Horst Rempp

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Horst Rempp. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Horst Rempp. The network helps show where Horst Rempp may publish in the future.

Co-authorship network of co-authors of Horst Rempp

This figure shows the co-authorship network connecting the top 25 collaborators of Horst Rempp. A scholar is included among the top collaborators of Horst Rempp based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Horst Rempp. Horst Rempp is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

19 of 19 papers shown
1.
Rempp, Horst, et al.. (2015). Thermal characterization and modeling of ultra-thin silicon chips. Solid-State Electronics. 113. 121–126. 6 indexed citations
2.
Rempp, Horst, et al.. (2014). Thermal characterization and modeling of ultra-thin silicon chips. 397–400. 7 indexed citations
3.
Burghartz, Joachim N., et al.. (2013). Ultra-thin chips for flexible electronics. 1–2. 2 indexed citations
4.
5.
Rempp, Horst, et al.. (2012). Compensation of externally applied mechanical stress by stacking of ultrathin chips. Solid-State Electronics. 74. 102–107. 13 indexed citations
6.
Harendt, Christine, et al.. (2012). Manufacturing aspects of an ultra-thin chip technology. 141–144. 9 indexed citations
7.
Rempp, Horst, et al.. (2012). Two-Dimensional Flex Sensor Exploiting Stacked Ultrathin Chips. IEEE Electron Device Letters. 33(3). 444–446. 17 indexed citations
8.
Thi, Thai Thanh Hoang, et al.. (2011). Mechanical characterisation of ultra-thin chips. 1–4. 10 indexed citations
9.
Rempp, Horst, et al.. (2011). Compensation of externally applied mechanical stress by stacking of ultra-thin chips. 279–282. 8 indexed citations
10.
Richter, H., et al.. (2011). Compact modeling of CMOS transistors under variable uniaxial stress. Solid-State Electronics. 57(1). 52–60. 23 indexed citations
11.
Burghartz, Joachim N., et al.. (2010). Ultra-thin chip technology and applications, a new paradigm in silicon technology. Solid-State Electronics. 54(9). 818–829. 66 indexed citations
12.
Rempp, Horst, et al.. (2010). Packaging challenges associated with warpage of ultra-thin chips. 65. 1–5. 6 indexed citations
13.
Burghartz, Joachim N., et al.. (2009). Ultra-thin chips and related applications, a new paradigm in silicon technology. 28–35. 29 indexed citations
14.
Richter, H., et al.. (2009). Technology and design aspects of ultra-thin silicon chips for bendable electronics. 149–154. 11 indexed citations
15.
Burghartz, Joachim N., et al.. (2009). A New Fabrication and Assembly Process for Ultrathin Chips. IEEE Transactions on Electron Devices. 56(2). 321–327. 66 indexed citations
16.
Rempp, Horst, et al.. (2009). Anomalous stress effects in ultra-thin silicon chips on foil. 123?124. 1–4. 11 indexed citations
17.
Burghartz, Joachim N., et al.. (2009). Ultra-thin chips and related applications, a new paradigm in silicon technology. 29–36. 16 indexed citations
18.
Rempp, Horst, et al.. (2008). Ultra-Thin Chips on Foil for Flexible Electronics. 334–617. 34 indexed citations
19.
Rempp, Horst, et al.. (1999). Experiences on reliability simulation in the framework of the PROPHECY project. Microelectronics Reliability. 39(5). 661–672. 1 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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