Christine Harendt

779 total citations
56 papers, 589 citations indexed

About

Christine Harendt is a scholar working on Electrical and Electronic Engineering, Biomedical Engineering and Bioengineering. According to data from OpenAlex, Christine Harendt has authored 56 papers receiving a total of 589 indexed citations (citations by other indexed papers that have themselves been cited), including 53 papers in Electrical and Electronic Engineering, 28 papers in Biomedical Engineering and 4 papers in Bioengineering. Recurrent topics in Christine Harendt's work include 3D IC and TSV technologies (32 papers), Advanced MEMS and NEMS Technologies (17 papers) and Advanced Sensor and Energy Harvesting Materials (12 papers). Christine Harendt is often cited by papers focused on 3D IC and TSV technologies (32 papers), Advanced MEMS and NEMS Technologies (17 papers) and Advanced Sensor and Energy Harvesting Materials (12 papers). Christine Harendt collaborates with scholars based in Germany, United States and Italy. Christine Harendt's co-authors include Joachim N. Burghartz, Heinz‐Gerd Graf, B. Höfflinger, Horst Rempp, H. Richter, Martin Zimmermann, Alina Schreivogel, Charles E. Hunt, M.B. Schubert and Martín Zimmermann and has published in prestigious journals such as Journal of The Electrochemical Society, ACS Applied Materials & Interfaces and Sensors.

In The Last Decade

Christine Harendt

53 papers receiving 555 citations

Peers

Christine Harendt

EEE

BE

ME

CMN

AMPO

Erwin Bosman Belgium

Maarten Cauwe Belgium

Christof Landesberger Germany

Marion Woytasik France

Martin Zimmermann Germany

Chae-Min Lim South Korea

Alejandro de la Fuente Vornbrock United States

Sommawan Khumpuang Japan

Horst Rempp Germany

Kai Zoschke Germany

Erwin Bosman Belgium

Christine Harendt

443 ×0.9

EEE

316 ×1.0

BE

35 ×0.8

ME

25 ×0.6

CMN

59 ×1.6

AMPO

Citations per year, relative to Christine Harendt Christine Harendt (= 1×) peers Erwin Bosman

Countries citing papers authored by Christine Harendt

Since Specialization

Citations

This map shows the geographic impact of Christine Harendt's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Christine Harendt with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Christine Harendt more than expected).

Fields of papers citing papers by Christine Harendt

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Christine Harendt. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Christine Harendt. The network helps show where Christine Harendt may publish in the future.

Co-authorship network of co-authors of Christine Harendt

This figure shows the co-authorship network connecting the top 25 collaborators of Christine Harendt. A scholar is included among the top collaborators of Christine Harendt based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Christine Harendt. Christine Harendt is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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20 of 20 papers shown

1.

Harendt, Christine, et al.. (2023). Flexible Ultrathin Chip-Film Patch for Electronic Component Integration and Encapsulation using Atomic Layer-Deposited Al₂O₃–TiO₂ Nanolaminates. ACS Applied Materials & Interfaces. 15(12). 16221–16231. 5 indexed citations

2.

Harendt, Christine, et al.. (2021). A Flexible Chip-Film Patch and a Flexible Strain Gauge Sensor Suitable for a Hybrid System-in-Foil Integration. IEEE Sensors Journal. 21(23). 26345–26354. 5 indexed citations

3.

Harendt, Christine, et al.. (2021). Ultra-thin Image Sensor Chip Embeded Foil. 1–4. 2 indexed citations

4.

Mueller, Andreas S., et al.. (2020). Chip-Film Patch Sensor System with Integrated Read-out ASIC for Biomedical Applications. 30. 1–4. 1 indexed citations

5.

Burghartz, Joachim N., et al.. (2019). Hybrid Systems-in-Foil—Combining the Merits of Thin Chips and of Large-Area Electronics. IEEE Journal of the Electron Devices Society. 7. 776–783. 16 indexed citations

6.

Burghartz, Joachim N., et al.. (2017). Optimized adaptive layout technique for hybrid systems in foil. 8 indexed citations

7.

Rempp, Horst, et al.. (2014). Thermal characterization and modeling of ultra-thin silicon chips. 397–400. 7 indexed citations

8.

Harendt, Christine, et al.. (2013). Assembly and embedding of ultra-thin chips in polymers. European Microelectronics and Packaging Conference. 1–6. 23 indexed citations

9.

Rempp, Horst, et al.. (2012). Compensation of externally applied mechanical stress by stacking of ultrathin chips. Solid-State Electronics. 74. 102–107. 13 indexed citations

10.

Harendt, Christine, et al.. (2012). Self-aligned through silicon vias in ultra-thin chips for 3D-integration. 1–4. 2 indexed citations

11.

Thi, Thai Thanh Hoang, et al.. (2011). Mechanical characterisation of ultra-thin chips. 1–4. 10 indexed citations

12.

Burghartz, Joachim N., et al.. (2010). Ultra-thin chip technology and applications, a new paradigm in silicon technology. Solid-State Electronics. 54(9). 818–829. 66 indexed citations

13.

Zimmermann, Martin, et al.. (2010). Ultra-thin chip technology for system-in-foil applications. 2.5.1–2.5.4. 25 indexed citations

14.

Burghartz, Joachim N., et al.. (2009). Ultra-thin chip fabrication for next-generation silicon processes. 131–137. 15 indexed citations

15.

Burghartz, Joachim N., et al.. (2009). Ultra-thin chips and related applications, a new paradigm in silicon technology. 28–35. 29 indexed citations

16.

Harendt, Christine, et al.. (2002). Wafer bonding for intelligent power ICs: integration of vertical structures. 93 1. 152–153. 2 indexed citations

17.

Harendt, Christine, et al.. (1992). Silicon fusion bonding and its characterization. Journal of Micromechanics and Microengineering. 2(3). 113–116. 49 indexed citations

18.

Graf, Heinz‐Gerd, et al.. (1992). A smart power process in “direct-bonded” silicon on insulator with 150 V VDMOS, CMOS and bipolar transistors. Microelectronic Engineering. 19(1-4). 153–156. 2 indexed citations

19.

Harendt, Christine, et al.. (1991). Wafer fusion bonding and its application to silicon-on-insulator fabrication. Journal of Micromechanics and Microengineering. 1(3). 145–151. 16 indexed citations

20.

Harendt, Christine, et al.. (1989). Silicon‐on‐Insulator Films Obtained by Etchback of Bonded Wafers. Journal of The Electrochemical Society. 136(11). 3547–3548. 10 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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