Hongbin Shi
- Electrical and Electronic Engineering
- Mechanics of Materials top 10%
- Mechanical Engineering
- Materials Chemistry
- Biomedical Engineering
- Co-authors
- Toshitsugu UedaTao WangTeng ZhangYabing ZhangXiaofeng DaiQing LiuFa XingMin Tang
- Topics
- Electronic Packaging and Soldering Technologies (24 papers)3D IC and TSV technologies (20 papers)Electromagnetic Compatibility and Noise Suppression (8 papers)
- Partner nations
- ChinaJapanUnited States
In The Last Decade
Hongbin Shi
49 papers receiving 456 citations
Peers
Comparison fields: 5 of 54
- Electrical and Electronic Engineering 270
- Mechanics of Materials 140
- Mechanical Engineering 116
- Materials Chemistry 115
- Biomedical Engineering 99
Countries citing papers authored by Hongbin Shi
This map shows the geographic impact of Hongbin Shi's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Hongbin Shi with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Hongbin Shi more than expected).
Fields of papers citing papers by Hongbin Shi
This network shows the impact of papers produced by Hongbin Shi. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Hongbin Shi. The network helps show where Hongbin Shi may publish in the future.
Co-authorship network of co-authors of Hongbin Shi
This figure shows the co-authorship network connecting the top 25 collaborators of Hongbin Shi. A scholar is included among the top collaborators of Hongbin Shi based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Hongbin Shi. Hongbin Shi is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 1 | |
| 2 | 1 | |
| 3 | 1 | |
| 4 | 0 | |
| 5 | 1 | |
| 6 | 4 | |
| 7 | 1 | |
| 8 | 1 | |
| 9 | 8 | |
| 10 | 1 | |
| 11 | 4 | |
| 12 | 19 | |
| 13 | 11 | |
| 14 | 5 | |
| 15 | Relations between microstructure and mechanical properties of fiber/matrix interface in 4D in-plane C/C composites | 2 |
| 16 | Mechanical experiment of 4D in-plain C/C composites | 6 |
| 17 | Numerical analysis of deflection torque of flexible joint with high pressure | 3 |
| 18 | 9 | |
| 19 | 1 | |
| 20 | 26 |
About Hongbin Shi
Hongbin Shi is a scholar working on Ceramics and Composites, Mechanics of Materials and Electrical and Electronic Engineering, having authored 53 papers that have together received 463 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (24 papers), 3D IC and TSV technologies (20 papers) and Electromagnetic Compatibility and Noise Suppression (8 papers). The work is most often cited by research in Mechanics of Materials (140 citations), Electrical and Electronic Engineering (270 citations) and Ceramics and Composites (25 citations). Hongbin Shi has collaborated with scholars based in China, Japan and United States. Frequent co-authors include Toshitsugu Ueda, Tao Wang, Teng Zhang, Yabing Zhang, Xiaofeng Dai, Qing Liu, Fa Xing, Min Tang, Yuling Shi and Tetsuzo Ueda. Their work appears in journals such as Nano Letters, Chemical Engineering Journal and Journal of the American Ceramic Society.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.