Hirokuni Hiyama

50 papers receiving 306 citations

Peers

Hirokuni Hiyama
Comparison fields: 5 of 37
  • Biomedical Engineering 229
  • Electrical and Electronic Engineering 154
  • Materials Chemistry 95
  • Mechanical Engineering 79
  • Mechanics of Materials 44
Replace Xiang Zhao with:
Xiang Zhao China
Seunggeol Ryu South Korea
Arvind Jaikumar United States
Konghua Yang China
J. H. Qiao China
Dong Il Shim South Korea
Robert Alink Germany
Suprakash Samanta India
Chen‐Hsun Du Taiwan
Hirokuni Hiyama relative to Xiang Zhao China Xiang Zhao's profile →
Citations per field
00.5×5.1×
Xiang Zhao · 1×
Citations per year

Countries citing papers authored by Hirokuni Hiyama

Since Specialization
Citations

This map shows the geographic impact of Hirokuni Hiyama's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Hirokuni Hiyama with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Hirokuni Hiyama more than expected).

Fields of papers citing papers by Hirokuni Hiyama

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Hirokuni Hiyama. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Hirokuni Hiyama. The network helps show where Hirokuni Hiyama may publish in the future.

Co-authorship network of co-authors of Hirokuni Hiyama

This figure shows the co-authorship network connecting the top 25 collaborators of Hirokuni Hiyama. A scholar is included among the top collaborators of Hirokuni Hiyama based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Hirokuni Hiyama. Hirokuni Hiyama is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
#WorkIndexed citations
1 0
2 0
3 1
4 3
5 2
6 1
7 2
8 9
9 14
10 2
11 42
12 2
13 0
14
WのCMP(化学的機械的研磨)後に観察されるクラックの原因を解明するためFEM(有限要素法)を用いた誘電体の応力解析
53
15 1
16 0
17 0
18 2
19 5
20 2

About Hirokuni Hiyama

Hirokuni Hiyama is a scholar working on Surfaces, Coatings and Films, Biomedical Engineering and Electronic, Optical and Magnetic Materials, having authored 61 papers that have together received 321 indexed citations. Recurring topics across this work include Advanced Surface Polishing Techniques (42 papers), Diamond and Carbon-based Materials Research (9 papers) and Copper Interconnects and Reliability (9 papers). The work is most often cited by research in Surfaces, Coatings and Films (37 citations), Biomedical Engineering (229 citations) and Electrical and Electronic Engineering (154 citations). Hirokuni Hiyama has collaborated with scholars based in Japan, South Korea and United States. Frequent co-authors include Satomi Hamada, Yutaka Wada, Jin-Goo Park, Nagendra Prasad Yerriboina, Akira Fukuda, Syuhei KUROKAWA, Toshiyuki Sanada, Tae‐Gon Kim, Jung‐Hwan Lee and Byoung-Jun Cho. Their work appears in journals such as Journal of The Electrochemical Society, Japanese Journal of Applied Physics and Colloids and Surfaces A Physicochemical and Engineering Aspects.

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

Explore authors with similar magnitude of impact

Rankless by CCL
2026