Toshiro Doi

1.6k total citations
120 papers, 1.2k citations indexed

About

Toshiro Doi is a scholar working on Biomedical Engineering, Electrical and Electronic Engineering and Mechanical Engineering. According to data from OpenAlex, Toshiro Doi has authored 120 papers receiving a total of 1.2k indexed citations (citations by other indexed papers that have themselves been cited), including 88 papers in Biomedical Engineering, 48 papers in Electrical and Electronic Engineering and 47 papers in Mechanical Engineering. Recurrent topics in Toshiro Doi's work include Advanced Surface Polishing Techniques (83 papers), Advanced machining processes and optimization (38 papers) and Diamond and Carbon-based Materials Research (31 papers). Toshiro Doi is often cited by papers focused on Advanced Surface Polishing Techniques (83 papers), Advanced machining processes and optimization (38 papers) and Diamond and Carbon-based Materials Research (31 papers). Toshiro Doi collaborates with scholars based in Japan, United Kingdom and United States. Toshiro Doi's co-authors include Hideo Aida, Hidetoshi Takeda, Tsutomu Yamazaki, Koji Koyama, Syuhei KUROKAWA, Michio Uneda, Ioan D. Marinescu, Eckart Uhlmann, Seong‐Woo Kim and Osamu Ohnishi and has published in prestigious journals such as SHILAP Revista de lepidopterología, Journal of The Electrochemical Society and Applied Surface Science.

In The Last Decade

Toshiro Doi

105 papers receiving 1.1k citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Toshiro Doi Japan 16 874 524 437 416 291 120 1.2k
Chunli Zou China 17 752 0.9× 562 1.1× 305 0.7× 292 0.7× 164 0.6× 34 952
Anna V. Ceguerra Australia 24 756 0.9× 1.1k 2.1× 130 0.3× 1.1k 2.6× 206 0.7× 57 1.9k
Francisco Carlos Serbena Brazil 23 334 0.4× 924 1.8× 163 0.4× 393 0.9× 509 1.7× 91 1.7k
R. Ramaseshan India 19 224 0.3× 637 1.2× 229 0.5× 262 0.6× 410 1.4× 82 1.1k
J.C. Oliveira Portugal 22 152 0.2× 915 1.7× 288 0.7× 422 1.0× 834 2.9× 76 1.3k
Eungsun Byon South Korea 19 400 0.5× 773 1.5× 299 0.7× 256 0.6× 344 1.2× 75 1.4k
Xiubo Tian China 21 187 0.2× 1.3k 2.4× 370 0.8× 621 1.5× 909 3.1× 101 1.7k
Yunsong Lian China 21 395 0.5× 373 0.7× 324 0.7× 1.2k 2.8× 708 2.4× 56 1.6k
Daniel Heim Austria 17 346 0.4× 678 1.3× 294 0.7× 298 0.7× 529 1.8× 39 1.0k
C.E. Foerster Brazil 18 181 0.2× 601 1.1× 91 0.2× 236 0.6× 513 1.8× 55 975

Countries citing papers authored by Toshiro Doi

Since Specialization
Citations

This map shows the geographic impact of Toshiro Doi's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Toshiro Doi with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Toshiro Doi more than expected).

Fields of papers citing papers by Toshiro Doi

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Toshiro Doi. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Toshiro Doi. The network helps show where Toshiro Doi may publish in the future.

Co-authorship network of co-authors of Toshiro Doi

This figure shows the co-authorship network connecting the top 25 collaborators of Toshiro Doi. A scholar is included among the top collaborators of Toshiro Doi based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Toshiro Doi. Toshiro Doi is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Doi, Toshiro, et al.. (2022). Effect of Mn-Based Slurries on Chemical Mechanical Polishing of SiC Substrates. ECS Journal of Solid State Science and Technology. 11(7). 74002–74002. 9 indexed citations
2.
Takeda, Hidetoshi, Toshiro Doi, Seong‐Woo Kim, Hideo Aida, & Masaharu Shiratani. (2017). High efficiency processing and its processing mechanism of large area diamond substrate due to plasma fusion CMP. IEICE Technical Report; IEICE Tech. Rep.. 117(334). 1–6. 1 indexed citations
3.
4.
Doi, Toshiro, et al.. (2013). Current Status and Future Prospects of GaN Substrates for Green Devices. Sensors and Materials. 141–141. 2 indexed citations
5.
Ohnishi, Osamu, et al.. (2012). Precision Profile Measurement System for Microholes Using Vibrating Optical Fiber. Sensors and Materials. 387–387. 3 indexed citations
6.
Doi, Toshiro, et al.. (2012). Residual Stress of Hoop-Wound CFRP Composites Manufactured with Simultaneous Heating. Sensors and Materials. 99–99. 6 indexed citations
7.
Ikeda, Hiroshi, Yoichi AKAGAMI, Michio Uneda, et al.. (2012). Development of an AC Electrical Field Tribochemical Polishing Technique to Promote High-Efficiency Polishing for Glass Substrates. Journal of the Japan Society for Precision Engineering. 78(4). 316–320.
8.
Doi, Toshiro, et al.. (2011). Development of a Filament-Winding Machine Based on Internal Heating by a High-Temperature Fluid for Composite Vessels. Sensors and Materials. 347–347. 4 indexed citations
9.
Arimoto, Y., et al.. (2011). Tungsten Film Chemical Mechanical Polishing Using MnO. Japanese Journal of Applied Physics. 50(7). 1 indexed citations
10.
Uneda, Michio, et al.. (2011). Location Finding Function of High Correlation Sound Sources, Using Combined Methods of Spatial Smoothing Processing and MUSIC. Journal of the Japan Society for Precision Engineering. 77(12). 1158–1164. 1 indexed citations
11.
Fujita, Takashi, et al.. (2010). Development on Pad Conditioning Conforming to Pad Surface. Journal of the Japan Society for Precision Engineering. 76(4). 433–437. 2 indexed citations
12.
KUROKAWA, Syuhei, et al.. (2010). Unwoven Fabric Pads Non-Destructive conditioning by High Pressure Micro Jet in CMP Process. Journal of the Japan Society for Precision Engineering. 76(9). 1076–1081. 2 indexed citations
13.
Yamada, Yohei, et al.. (2009). Development of Abrasive-Free Copper CMP Process. Journal of the Japan Society for Precision Engineering. 75(4). 496–500. 1 indexed citations
14.
KUROKAWA, Syuhei, et al.. (2008). Research on Cleaning Efficiency of High Pressure Micro Jet. Journal of the Japan Society for Precision Engineering. 74(10). 1074–1079. 1 indexed citations
15.
Yamada, Yohei, et al.. (2008). Study on Reduction of Micro-Scratch in Oxide CMP for Multi-Level Interconnection. Journal of the Japan Society for Precision Engineering. 74(12). 1303–1307. 1 indexed citations
16.
Doi, Toshiro, et al.. (2007). Trend of Semiconductor Devices and Planarization Technology with Future Development. Journal of the Japan Society for Precision Engineering. 73(7). 745–750. 1 indexed citations
17.
Doi, Toshiro, et al.. (2007). Planarization CMP for Semiconductor LSI Devices and Its Applications. Journal of the Japan Society for Precision Engineering. 73(10). 1097–1101. 1 indexed citations
18.
Doi, Toshiro, et al.. (2006). Study of a CMP pad conditioning using high-pressure micro jet (HPMJ)-Characterization of slurry residues in pad grooves by UV-enhanced fluorescence-:Characterization of slurry residues in pad grooves by UV-enhanced fluorescence. 50(8). 465–470.
19.
Doi, Toshiro, et al.. (2006). Development of a Pad Conditioning Method for Oxide Film CMP using a High Pressure Micro Jet (HPMJ). Seimitsu kougakkaishi rombunshuu/Seimitsu kougakkaishi/Seimitsu Kougakkaishi rombunshuu. 72(7). 924–928.
20.
Doi, Toshiro, et al.. (2005). Proposal and Apparatus of a High Pressure Micro Jet (HPMJ) Cleaning Technique. Seimitsu kougakkaishi rombunshuu/Seimitsu kougakkaishi/Seimitsu Kougakkaishi rombunshuu. 71(1). 110–114. 2 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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