Byoung-Jun Cho

494 total citations
17 papers, 399 citations indexed

About

Byoung-Jun Cho is a scholar working on Biomedical Engineering, Electrical and Electronic Engineering and Materials Chemistry. According to data from OpenAlex, Byoung-Jun Cho has authored 17 papers receiving a total of 399 indexed citations (citations by other indexed papers that have themselves been cited), including 15 papers in Biomedical Engineering, 11 papers in Electrical and Electronic Engineering and 8 papers in Materials Chemistry. Recurrent topics in Byoung-Jun Cho's work include Advanced Surface Polishing Techniques (15 papers), Diamond and Carbon-based Materials Research (8 papers) and Advanced machining processes and optimization (7 papers). Byoung-Jun Cho is often cited by papers focused on Advanced Surface Polishing Techniques (15 papers), Diamond and Carbon-based Materials Research (8 papers) and Advanced machining processes and optimization (7 papers). Byoung-Jun Cho collaborates with scholars based in South Korea, India and Japan. Byoung-Jun Cho's co-authors include Jin-Goo Park, R. Manivannan, Ramanathan Srinivasan, Satomi Hamada, Hailin Xiong, Tae-Young Kwon, Ahmed Busnaina, Chan‐Hee Lee, Yutaka Wada and Hirokuni Hiyama and has published in prestigious journals such as Applied Surface Science, Japanese Journal of Applied Physics and Wear.

In The Last Decade

Byoung-Jun Cho

17 papers receiving 386 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Byoung-Jun Cho South Korea 11 337 197 166 152 47 17 399
Wantang Wang China 9 287 0.9× 216 1.1× 151 0.9× 111 0.7× 36 0.8× 12 385
Lianjun Hu China 9 279 0.8× 202 1.0× 137 0.8× 107 0.7× 59 1.3× 18 357
Satomi Hamada Japan 11 319 0.9× 171 0.9× 178 1.1× 111 0.7× 42 0.9× 54 401
Nengyuan Zeng China 9 265 0.8× 239 1.2× 124 0.7× 87 0.6× 39 0.8× 10 366
Yongchao Xu China 9 292 0.9× 201 1.0× 86 0.5× 175 1.2× 42 0.9× 24 358
Qiuliang Luo United States 7 330 1.0× 169 0.9× 204 1.2× 156 1.0× 28 0.6× 9 404
H. P. Amanapu United States 12 345 1.0× 212 1.1× 239 1.4× 97 0.6× 52 1.1× 14 427
Guoshun Pan China 11 194 0.6× 207 1.1× 150 0.9× 192 1.3× 130 2.8× 20 434
Parshuram B. Zantye United States 4 443 1.3× 230 1.2× 196 1.2× 230 1.5× 53 1.1× 11 510
Vimal Desai United States 7 232 0.7× 189 1.0× 163 1.0× 134 0.9× 23 0.5× 17 402

Countries citing papers authored by Byoung-Jun Cho

Since Specialization
Citations

This map shows the geographic impact of Byoung-Jun Cho's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Byoung-Jun Cho with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Byoung-Jun Cho more than expected).

Fields of papers citing papers by Byoung-Jun Cho

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Byoung-Jun Cho. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Byoung-Jun Cho. The network helps show where Byoung-Jun Cho may publish in the future.

Co-authorship network of co-authors of Byoung-Jun Cho

This figure shows the co-authorship network connecting the top 25 collaborators of Byoung-Jun Cho. A scholar is included among the top collaborators of Byoung-Jun Cho based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Byoung-Jun Cho. Byoung-Jun Cho is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

17 of 17 papers shown
1.
Cho, Byoung-Jun, Nagendra Prasad Yerriboina, Chan‐Hee Lee, et al.. (2019). Selection and Optimization of Corrosion Inhibitors for Improved Cu CMP and Post-Cu CMP Cleaning. ECS Journal of Solid State Science and Technology. 8(5). P3058–P3062. 42 indexed citations
2.
Cho, Byoung-Jun, et al.. (2017). Fabrication of high performance copper-resin lapping plate for sapphire: A combined 2-body and 3-body diamond abrasive wear on sapphire. Tribology International. 120. 203–209. 21 indexed citations
3.
Cho, Byoung-Jun, et al.. (2016). Effect of pH and chemical mechanical planarization process conditions on the copper–benzotriazole complex formation. Japanese Journal of Applied Physics. 55(6S3). 06JB01–06JB01. 10 indexed citations
4.
Cho, Byoung-Jun, et al.. (2016). Investigation of cu-BTA complex formation during Cu chemical mechanical planarization process. Applied Surface Science. 384. 505–510. 70 indexed citations
5.
Cho, Byoung-Jun, et al.. (2015). Comparison between sapphire lapping processes using 2-body and 3-body modes as a function of diamond abrasive size. Wear. 332-333. 794–799. 42 indexed citations
6.
Kim, Hyuntae, Byoung-Jun Cho, Jung‐Hwan Lee, et al.. (2015). Prevention of Metal Contamination in Sub 50 Nm SC1 Cleaning Process. ECS Transactions. 69(8). 69–75. 1 indexed citations
7.
Cho, Byoung-Jun, et al.. (2015). Effect of lanthanum doping in ceria abrasives on chemical mechanical polishing selectivity for shallow trench isolation. Materials Science in Semiconductor Processing. 33. 161–168. 42 indexed citations
8.
Manivannan, R., Byoung-Jun Cho, Hailin Xiong, Ramanathan Srinivasan, & Jin-Goo Park. (2014). Characterization of non-amine-based post-copper chemical mechanical planarization cleaning solution. Microelectronic Engineering. 122. 33–39. 44 indexed citations
9.
Kwon, Tae-Young, R. Manivannan, Byoung-Jun Cho, Ahmed Busnaina, & Jin-Goo Park. (2013). The impact of diamond conditioners on scratch formation during chemical mechanical planarization (CMP) of silicon dioxide. Tribology International. 67. 272–277. 17 indexed citations
10.
Cho, Byoung-Jun, R. Venkatesh, Tae-Young Kwon, & Jin-Goo Park. (2013). Modification of Diamond Conditioner with V-SAM Coatings for Corrosion Prevention During Metal CMP. International Journal of Electrochemical Science. 8(4). 4723–4734. 2 indexed citations
11.
Kwon, Tae-Young, et al.. (2013). Effect of Silicon Dioxide Hardness on Scratches in Interlevel Dielectric Chemical–Mechanical Polishing. Tribology Transactions. 57(2). 190–197. 6 indexed citations
12.
Kwon, Tae-Young, Byoung-Jun Cho, R. Manivannan, Ahmed Busnaina, & Jin-Goo Park. (2013). Investigation of Source-Based Scratch Formation During Oxide Chemical Mechanical Planarization. Tribology Letters. 50(2). 169–175. 12 indexed citations
13.
Manivannan, R., et al.. (2013). Abrasive and additive interactions in high selectivity STI CMP slurries. Microelectronic Engineering. 114. 98–104. 30 indexed citations
14.
Manivannan, R., Byoung-Jun Cho, Tae-Young Kwon, & Jin-Goo Park. (2013). Hybrid Cleaning Technology for Enhanced Post-Cu/Low-Dielectric Constant Chemical Mechanical Planarization Cleaning Performance. Japanese Journal of Applied Physics. 52(5S3). 05FC02–05FC02. 6 indexed citations
15.
Park, Jin-Goo, Tae-Young Kwon, R. Venkatesh, & Byoung-Jun Cho. (2012). CMP Defects; Their Detection and Analysis on Root Causes. ECS Transactions. 44(1). 559–564. 1 indexed citations
16.
Kwon, Tae-Young, Byoung-Jun Cho, R. Venkatesh, & Jin-Goo Park. (2012). Correlation of Polishing Pad Property and Pad Debris on Scratch Formation during CMP. 1–6. 2 indexed citations
17.
Cho, Byoung-Jun, et al.. (2012). On the mechanism of material removal by fixed abrasive lapping of various glass substrates. Wear. 302(1-2). 1334–1339. 51 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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2026