Hailin Bai
- Electrical and Electronic Engineering top 10%
- Materials Chemistry
- Mechanical Engineering top 10%
- Biomedical Engineering
- Ceramics and Composites top 5%
- Co-authors
- Guisheng ZouL. T. LiXiaohui WangWeiguo QuXiangyun DengHui ZhouI‐Wei ChenWei Guo
- Topics
- Electronic Packaging and Soldering Technologies (11 papers)Nanomaterials and Printing Technologies (6 papers)Physics of Superconductivity and Magnetism (5 papers)
- Partner nations
- ChinaCanadaUnited States
In The Last Decade
Hailin Bai
26 papers receiving 772 citations
Peers
Comparison fields: 5 of 55
- Electrical and Electronic Engineering 403
- Materials Chemistry 345
- Mechanical Engineering 330
- Biomedical Engineering 182
- Ceramics and Composites 143
Countries citing papers authored by Hailin Bai
This map shows the geographic impact of Hailin Bai's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Hailin Bai with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Hailin Bai more than expected).
Fields of papers citing papers by Hailin Bai
This network shows the impact of papers produced by Hailin Bai. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Hailin Bai. The network helps show where Hailin Bai may publish in the future.
Co-authorship network of co-authors of Hailin Bai
This figure shows the co-authorship network connecting the top 25 collaborators of Hailin Bai. A scholar is included among the top collaborators of Hailin Bai based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Hailin Bai. Hailin Bai is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 13 | |
| 2 | 34 | |
| 3 | 22 | |
| 4 | 13 | |
| 5 | 33 | |
| 6 | 41 | |
| 7 | 15 | |
| 8 | 14 | |
| 9 | 85 | |
| 10 | 33 | |
| 11 | 34 | |
| 12 | 10 | |
| 13 | 15 | |
| 14 | 2 | |
| 15 | 1 | |
| 16 | 4 | |
| 17 | 2 | |
| 18 | 42 | |
| 19 | 276 | |
| 20 | Fuzzy risk of natural disasters | 0 |
About Hailin Bai
Hailin Bai is a scholar working on Ceramics and Composites, Condensed Matter Physics and Mechanical Engineering, having authored 27 papers that have together received 787 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (11 papers), Nanomaterials and Printing Technologies (6 papers) and Physics of Superconductivity and Magnetism (5 papers). The work is most often cited by research in Ceramics and Composites (143 citations), Mechanical Engineering (330 citations) and Materials Chemistry (345 citations). Hailin Bai has collaborated with scholars based in China, Canada and United States. Frequent co-authors include Guisheng Zou, L. T. Li, Xiaohui Wang, Weiguo Qu, Xiangyun Deng, Hui Zhou, I‐Wei Chen, Wei Guo, Hongqiang Zhang and Jianfeng Yan. Their work appears in journals such as ACS Nano, Nano Energy and Journal of the American Ceramic Society.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.