Hongbo Xü
- Electrical and Electronic Engineering top 5%
- Renewable Energy, Sustainability and the Environment top 2%
- Biomedical Engineering top 2%
- Materials Chemistry top 5%
- Polymers and Plastics top 2%
- Co-authors
- Dianpeng QiWei WangYao LiJiupeng ZhaoNan LüLifeng ChiShen WangFuyi Cui
- Topics
- Electronic Packaging and Soldering Technologies (27 papers)3D IC and TSV technologies (20 papers)Transition Metal Oxide Nanomaterials (19 papers)
- Cited by
- Surfaces, Coatings and FilmsRenewable Energy, Sustainability and the EnvironmentPolymers and Plastics
- Journals
- Advanced MaterialsSHILAP Revista de lepidopterologíaEnvironmental Science & Technology
In The Last Decade
Hongbo Xü
168 papers receiving 4.7k citations
Hit Papers
Peers
Comparison fields: 5 of 126
- Electrical and Electronic Engineering 1.4k
- Renewable Energy, Sustainability and the Environment 1.1k
- Biomedical Engineering 1.1k
- Materials Chemistry 1.0k
- Polymers and Plastics 764
Countries citing papers authored by Hongbo Xü
This map shows the geographic impact of Hongbo Xü's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Hongbo Xü with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Hongbo Xü more than expected).
Fields of papers citing papers by Hongbo Xü
This network shows the impact of papers produced by Hongbo Xü. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Hongbo Xü. The network helps show where Hongbo Xü may publish in the future.
Co-authorship network of co-authors of Hongbo Xü
This figure shows the co-authorship network connecting the top 25 collaborators of Hongbo Xü. A scholar is included among the top collaborators of Hongbo Xü based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Hongbo Xü. Hongbo Xü is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 0 | |
| 2 | 0 | |
| 3 | 2 | |
| 4 | 3 | |
| 5 | 7 | |
| 6 | 3 | |
| 7 | 3 | |
| 8 | 0 | |
| 9 | 10 | |
| 10 | 29 | |
| 11 | 12 | |
| 12 | 41 | |
| 13 | 16 | |
| 14 | 1 | |
| 15 | 124 | |
| 16 | Reliability of wafer-level SLID bonds for MEMS encapsulation | 3 |
| 17 | 16 | |
| 18 | 8 | |
| 19 | Failure Modes of Lead Free Solder Bumps Formed by Induction Spontaneous Heating Reflow | 6 |
| 20 | Polyester rope mooring design considerations | 11 |
About Hongbo Xü
Hongbo Xü is a scholar working on Surfaces, Coatings and Films, Polymers and Plastics and Microbiology, having authored 179 papers that have together received 4.8k indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (27 papers), 3D IC and TSV technologies (20 papers) and Transition Metal Oxide Nanomaterials (19 papers). The work is most often cited by research in Surfaces, Coatings and Films (666 citations), Renewable Energy, Sustainability and the Environment (1.1k citations) and Polymers and Plastics (764 citations). Hongbo Xü has collaborated with scholars based in China, Germany and Italy. Frequent co-authors include Dianpeng Qi, Wei Wang, Yao Li, Jiupeng Zhao, Nan Lü, Lifeng Chi, Shen Wang, Fuyi Cui, Jiupeng Zhao and Ying Xu. Their work appears in journals such as Advanced Materials, SHILAP Revista de lepidopterología and Environmental Science & Technology.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.