Dejun Wang

1.4k citations

103 papers · 1.1k indexed · h-index 20

Impact in

Electrical and Electronic Engineering top 5%
- Semiconductor materials and devices
- Silicon Carbide Semiconductor Technologies
- 3D IC and TSV technologies
- Electronic Packaging and Soldering Technologies
- Advancements in Semiconductor Devices and Circuit Design
Electronic, Optical and Magnetic Materials top 10%
- Copper Interconnects and Reliability

Papers in ⓘ

Electrical and Electronic Engineering 88
- Silicon Carbide Semiconductor Technologies 43
- Semiconductor materials and devices 42
- 3D IC and TSV technologies 9
- Electronic Packaging and Soldering Technologies 9
- Advancements in Semiconductor Devices and Circuit Design 7
Electronic, Optical and Magnetic Materials 21
- Copper Interconnects and Reliability 16

Co-authors: Fuwen Qin (27 shared papers)Lingqin Huang (12 shared papers)Yan Su (10 shared papers)Zhipeng Yin (12 shared papers)Wenbo Li (4 shared papers)Jijun Zhao (4 shared papers)Jian Cai (10 shared papers)Junqiang Wang (7 shared papers)
Journals: Applied Surface Science (15 papers)Applied Physics Letters (7 papers)Japanese Journal of Applied Physics (5 papers)Journal of Semiconductors (4 papers)Acta Physico-Chimica Sinica (3 papers)
Partner nations: China Japan South Korea

In The Last Decade

Dejun Wang

97 papers receiving 1.1k citations

Peers

Countries citing papers authored by Dejun Wang

Since Specialization

Citations

This map shows the geographic impact of Dejun Wang's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Dejun Wang with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Dejun Wang more than expected).

Fields of papers citing papers by Dejun Wang

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Dejun Wang. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Dejun Wang. The network helps show where Dejun Wang may publish in the future.

Co-authors

The 25 scholars most cited alongside Dejun Wang, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.

Border = papers with Dejun Wang Line = papers co-authored together Dejun Wang links everyone, so they are left out of the graph.

All Works

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20 of 20 papers shown

Showing the 20 most-cited of 103 papers — load more, or switch the sort, to bring in the rest.

#	Work
1	Surface electronic states and photovoltage gas-sensitive characters of nanocrystalline LaFeO3 Materials Chemistry and Physics ·Kuiying Li, Dejun Wang, Fengqing Wu, Tengfeng Xie, Tiejin Li	2000	61
2	Low resistance Ti Ohmic contacts to 4H-SiC by reducing barrier heights without high temperature annealing Applied Physics Letters ·Lingqin Huang, Bingbing Liu, Qiaozhi Zhu, Suhua Chen, Mingchao Gao, Fuwen Qin, Dejun Wang	2012	40
3	Oxygen vacancy formation and uniformity of conductive filaments in Si-doped Ta2O5 RRAM Applied Surface Science ·Chengxuan Cai, Shengsheng Wei, Zhipeng Yin, Jiao Bai, Weiwei Xie, Yue Li, Fuwen Qin, Yan Su, Dejun Wang	2021	33
4	Bias temperature instability in SiC metal oxide semiconductor devices Journal of Physics D Applied Physics ·Chao Yang, Shengsheng Wei, Dejun Wang	2020	32
5	Chemical structure study of SiO2/4H-SiC (0001) interface transition region by angle-dependent x-ray photoelectron spectroscopy Applied Physics Letters ·Qiaozhi Zhu, Lingqin Huang, Wenbo Li, Shenmin Li, Dejun Wang	2011	29
6	Real-Time Monitoring of Heavy Metals in Healthcare via Twistable and Washable Smartsensors Analytical Chemistry ·Yu Jiang, Shengjun Cui, Tong Xia, Tongrui Sun, Haixin Tan, Fei Yu, Yan Su, Suli Wu, Dejun Wang, Nan Zhu	2020	28
7	Activation of electroplated-Cu surface via plasma pretreatment for low temperature Cu-Sn bonding in 3D interconnection Applied Surface Science ·Junqiang Wang, Qian Wang, Ziyu Liu, Zijian Wu, Jian Cai, Dejun Wang	2016	28
8	Process dependency on threshold voltage of GaN MOSFET on AlGaN/GaN heterostructure Solid-State Electronics ·Qingpeng Wang, Ying Jiang, Takahiro Miyashita, Shin‐ichi Motoyama, Liuan Li, Dejun Wang, Yasuo Ohno, Jin‐Ping Ao	2014	28
9	Effects of surface properties on barrier height and barrier inhomogeneities of platinum contacts to n-type 4H-SiC Applied Physics Letters ·Lingqin Huang, Fuwen Qin, Li Shi-Juan, Dejun Wang	2013	28
10	Cleaning of SiC surfaces by low temperature ECR microwave hydrogen plasma Applied Surface Science ·Lingqin Huang, Qiaozhi Zhu, Mingchao Gao, Fuwen Qin, Dejun Wang	2011	25
11	An amorphous SiO2/4H-SiC(0001) interface: Band offsets and accurate charge transition levels of typical defects Solid State Communications ·Wenbo Li, Jijun Zhao, Dejun Wang	2015	25
12	Electrical and physical properties of 4H-SiC MOS interface with electron cyclotron resonance microwave nitrogen plasma post-oxidation annealing Physica B Condensed Matter ·Qiaozhi Zhu, Fuwen Qin, Wenbo Li, Dejun Wang	2013	24
13	Photoelectric properties of ZnO/Ag2S heterostructure and its photoelectric ethanol sensing characteristics Materials Chemistry and Physics ·Yu Zhang, Bingkun Liu, Dejun Wang, Yan Lin, Tengfeng Xie, Jiali Zhai	2012	24
14	Solid-State-Diffusion Bonding for Wafer-Level Fine-Pitch Cu/Sn/Cu Interconnect in 3-D Integration IEEE Transactions on Components Packaging and Manufacturing Technology ·Junqiang Wang, Qian Wang, Zijian Wu, Dejun Wang, Jian Cai	2016	24
15	Sensitive ethanol sensors fabricated from p-type La0.7Sr0.3FeO3 nanoparticles and n-type SnO2 nanofibers Sensors and Actuators B Chemical ·Qi Qi, Jun Zhao, Rui-Fei Xuan, Peipei Wang, Liangliang Feng, Lijing Zhou, Dejun Wang, Guodong Li	2013	22
16	Passivation of SiO2/4H–SiC interface defects via electron cyclotron resonance hydrogen–nitrogen mixed plasma pretreatment for SiC surface combined with post-oxidation annealing Applied Surface Science ·Bingbing Liu, Fuwen Qin, Dejun Wang	2015	20
17	Wafer-Level Hermetic Package by Low-Temperature Cu/Sn TLP Bonding with Optimized Sn Thickness Journal of Electronic Materials ·Zijian Wu, Jian Cai, Qian Wang, Junqiang Wang, Dejun Wang	2017	20
18	Conduction mechanism and impedance analysis of HfOx-based RRAM at different resistive states Applied Surface Science ·Jiao Bai, Weiwei Xie, Weiqi Zhang, Zhipeng Yin, Shengsheng Wei, Dehao Qu, Yue Li, Fuwen Qin, Dayu Zhou, Dejun Wang	2022	20
19	A Monolithic CMOS Magnetic Hall Sensor with High Sensitivity and Linearity Characteristics Sensors ·Haiyun Huang, Dejun Wang, Yue Xu	2015	19
20	Carrier capture and emission properties of silicon interstitial defects in near SiC/SiO2 interface region Applied Surface Science ·Fanglong Zhang, Chao Yang, Yan Su, Dejun Wang	2020	19

About Dejun Wang

Dejun Wang is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials, Condensed Matter Physics, Ceramics and Composites and Materials Chemistry, having authored 103 papers that have together received 1.1k indexed citations. Recurring topics across this work include Silicon Carbide Semiconductor Technologies (43 papers), Semiconductor materials and devices (42 papers), Copper Interconnects and Reliability (16 papers), Semiconductor materials and interfaces (11 papers), GaN-based semiconductor devices and materials (10 papers), 3D IC and TSV technologies (9 papers), Electronic Packaging and Soldering Technologies (9 papers) and Advancements in Semiconductor Devices and Circuit Design (7 papers). The work is most often cited by research in Electrical and Electronic Engineering (908 citations), Electronic, Optical and Magnetic Materials (256 citations), Ceramics and Composites (71 citations), Condensed Matter Physics (112 citations) and Materials Chemistry (300 citations). Dejun Wang has collaborated with scholars based in China, Japan and South Korea. Frequent co-authors include Fuwen Qin, Lingqin Huang, Yan Su, Zhipeng Yin, Wenbo Li, Jijun Zhao, Jian Cai, Junqiang Wang, Tengfeng Xie and Jiao Bai. Their work appears in journals such as Applied Surface Science, Applied Physics Letters, Japanese Journal of Applied Physics, Journal of Semiconductors and Acta Physico-Chimica Sinica.

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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