David Copeland

549 total citations
31 papers, 442 citations indexed

About

David Copeland is a scholar working on Mechanical Engineering, Electrical and Electronic Engineering and Computational Mechanics. According to data from OpenAlex, David Copeland has authored 31 papers receiving a total of 442 indexed citations (citations by other indexed papers that have themselves been cited), including 26 papers in Mechanical Engineering, 10 papers in Electrical and Electronic Engineering and 3 papers in Computational Mechanics. Recurrent topics in David Copeland's work include Heat Transfer and Optimization (24 papers), Heat Transfer Mechanisms (14 papers) and Heat Transfer and Boiling Studies (13 papers). David Copeland is often cited by papers focused on Heat Transfer and Optimization (24 papers), Heat Transfer Mechanisms (14 papers) and Heat Transfer and Boiling Studies (13 papers). David Copeland collaborates with scholars based in United States, Japan and Australia. David Copeland's co-authors include Wataru Nakayama, Masud Behnia, Andrew M. Chan, Martine Baelmans, John Parry, Clemens Lasance, Jukka Rantala, Jie Wei, A. M. C. Chan and A. Mertol and has published in prestigious journals such as Pediatric Dermatology, Journal of Electronic Packaging and IEEE Transactions on Components Packaging and Manufacturing Technology Part A.

In The Last Decade

David Copeland

27 papers receiving 412 citations

Peers

David Copeland
Je-Young Chang United States
Sertaç Çadırcı Türkiye
Minghui Chen United States
T. Deepa India
Hasan Parsa Iran
Roberto Agromayor Norway
Nedim Sözbi̇r Türkiye
Koichi Mashiko Japan
Shubhankar Chakraborty India
Sang-Moon Lee South Korea
Je-Young Chang United States
David Copeland
Citations per year, relative to David Copeland David Copeland (= 1×) peers Je-Young Chang

Countries citing papers authored by David Copeland

Since Specialization
Citations

This map shows the geographic impact of David Copeland's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by David Copeland with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites David Copeland more than expected).

Fields of papers citing papers by David Copeland

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by David Copeland. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by David Copeland. The network helps show where David Copeland may publish in the future.

Co-authorship network of co-authors of David Copeland

This figure shows the co-authorship network connecting the top 25 collaborators of David Copeland. A scholar is included among the top collaborators of David Copeland based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with David Copeland. David Copeland is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
2.
Copeland, David, et al.. (2009). Passive phase change tower heat sink & pumped coolant technologies for next generation CPU module thermal design. European Microelectronics and Packaging Conference. 1–6. 4 indexed citations
3.
4.
Gao, Ming, et al.. (2008). A Study Of Pressure Limits Of Double Q&T P110 In Low H2S Environments. Pediatric Dermatology. 24(5). E73–5.
5.
Copeland, David, et al.. (2007). A Statistical Approach For Characterizing The Thermal Impact Of TIM Voids. 17. 79–82. 2 indexed citations
6.
Copeland, David & Andrew M. Chan. (2004). Power and temperature requirements for refrigerated systems. 7. 237–241. 3 indexed citations
7.
Copeland, David. (2003). Fundamental Performance Limits of Heatsinks. Journal of Electronic Packaging. 125(2). 221–225. 19 indexed citations
8.
Copeland, David. (2002). Optimization of parallel plate heatsinks for forced convection. 266–272. 98 indexed citations
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Copeland, David, et al.. (2002). Thermal enhancement and reliability of 40 mm EPBGA packages with interface materials. 376–385. 2 indexed citations
11.
Copeland, David. (2002). High performance heatsinks for processors and power electronics: Beyond extrusions. 146–149. 1 indexed citations
12.
Behnia, Masud, et al.. (2001). A comparison of fin geometries for heatsinks in laminar forced convection: Part II -Optimization of staggered plate fin heatsink. 24(1). 77–83. 2 indexed citations
13.
Copeland, David, Masud Behnia, & Wataru Nakayama. (1998). Manifold microchannel heat sinks: Conjugate and extended models. 1(2). 139–152. 10 indexed citations
14.
Copeland, David, Masud Behnia, Wataru Nakayama, & Bock Choon Pak. (1997). Manifold microchannel heat sinks: Review and comparison. 19(2). 2065–2070. 1 indexed citations
15.
Copeland, David. (1996). Single-Phase and Boiling Cooling of Small Pin Fin Arrays by Multiple Nozzle Jet Impingement. Journal of Electronic Packaging. 118(1). 21–26. 27 indexed citations
16.
Copeland, David, et al.. (1995). Manifold Microchannel Heat Sinks : Theory and Experiment. Nihon dennetsu gakkai ronbunshu/Thermal science and engineering. 3(2). 9–15. 29 indexed citations
17.
Copeland, David. (1995). Manifold Microchannel Heat Sinks : Analysis and Optimization. Nihon dennetsu gakkai ronbunshu/Thermal science and engineering. 34(132). 7–12. 29 indexed citations
18.
Copeland, David, et al.. (1995). Cooling of Electronic Systems by Using Manifold Microchannel Heat Sinks. 대한기계학회 춘추학술대회. 74–80. 3 indexed citations
19.
Copeland, David. (1995). Manifold Microchannel Heat Sinks: Numerical Analysis. 111–116. 1 indexed citations
20.
Copeland, David. (1995). Single-phase and boiling cooling of small pin fin arrays by multiple slot nozzle suction and impingement. IEEE Transactions on Components Packaging and Manufacturing Technology Part A. 18(3). 510–516. 14 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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