Daniel Wheeler
Impact in
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- Electrodeposition and Electroless Coatings
- 3D IC and TSV technologies
- Electronic Packaging and Soldering Technologies
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- Copper Interconnects and Reliability
Papers in
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- Electrodeposition and Electroless Coatings 21
- Electronic Packaging and Soldering Technologies 12
- 3D IC and TSV technologies 2
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- Copper Interconnects and Reliability 6
- Co-authors
- Thomas P. Moffat (31 shared papers)D. Josell (23 shared papers)D. Josell (9 shared papers)James A. Warren (11 shared papers)William H. Huber (4 shared papers)Jonathan E. Guyer (5 shared papers)Monica D. Edelstein (2 shared papers)Connor L. Witt (5 shared papers)
- Journals
- Journal of The Electrochemical Society (16 papers)Electrochemical and Solid-State Letters (8 papers)Journal of Applied Physics (2 papers)Acta Materialia (2 papers)Acta Biomaterialia (1 paper)
- Partner nations
- United StatesUnited KingdomHungary
In The Last Decade
Daniel Wheeler
60 papers receiving 3.3k citations
Peers
Comparison fields: 5 of 68
- Electrical and Electronic Engineering 1.8k
- Electronic, Optical and Magnetic Materials 274
- General Materials Science 8
- Materials Chemistry 246
- Electrochemistry 11
Countries citing papers authored by Daniel Wheeler
This map shows the geographic impact of Daniel Wheeler's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Daniel Wheeler with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Daniel Wheeler more than expected).
Fields of papers citing papers by Daniel Wheeler
This network shows the impact of papers produced by Daniel Wheeler. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Daniel Wheeler. The network helps show where Daniel Wheeler may publish in the future.
Co-authors
The 25 scholars most cited alongside Daniel Wheeler, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 61 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2009 | 336 | |
| 2 | 2005 | 334 | |
| 3 | 2004 | 323 | |
| 4 | 2001 | 290 | |
| 5 | 2012 | 166 | |
| 6 | 2001 | 159 | |
| 7 | 2007 | 145 | |
| 8 | 2003 | 136 | |
| 9 | 2006 | 132 | |
| 10 | 2003 | 123 | |
| 11 | 2001 | 117 | |
| 12 | 2012 | 96 | |
| 13 | 2017 | 89 | |
| 14 | 2013 | 68 | |
| 15 | 2002 | 62 | |
| 16 | 2003 | 62 | |
| 17 | 2007 | 58 | |
| 18 | 2002 | 56 | |
| 19 | 2003 | 55 | |
| 20 | 2002 | 45 |
About Daniel Wheeler
Daniel Wheeler is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials, Materials Chemistry, Computational Mechanics and Biomedical Engineering, having authored 61 papers that have together received 3.4k indexed citations. Recurring topics across this work include Electrodeposition and Electroless Coatings (21 papers), Electronic Packaging and Soldering Technologies (12 papers), Copper Interconnects and Reliability (6 papers), Machine Learning in Materials Science (6 papers), Solidification and crystal growth phenomena (2 papers), Nanowire Synthesis and Applications (2 papers), Fluid Dynamics and Heat Transfer (2 papers) and 3D IC and TSV technologies (2 papers). The work is most often cited by research in Electrical and Electronic Engineering (1.8k citations), Electronic, Optical and Magnetic Materials (274 citations), General Materials Science (8 citations), Materials Chemistry (246 citations) and Electrochemistry (11 citations). Daniel Wheeler has collaborated with scholars based in United States, United Kingdom and Hungary. Frequent co-authors include Thomas P. Moffat, D. Josell, D. Josell, James A. Warren, William H. Huber, Jonathan E. Guyer, Monica D. Edelstein, Connor L. Witt, S.-K. Kim and Surya R. Kalidindi. Their work appears in journals such as Journal of The Electrochemical Society, Electrochemical and Solid-State Letters, Journal of Applied Physics, Acta Materialia and Acta Biomaterialia.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.