Daniel DiMase

1.4k total citations · 1 hit paper
11 papers, 891 citations indexed

About

Daniel DiMase is a scholar working on Electrical and Electronic Engineering, Hardware and Architecture and Civil and Structural Engineering. According to data from OpenAlex, Daniel DiMase has authored 11 papers receiving a total of 891 indexed citations (citations by other indexed papers that have themselves been cited), including 5 papers in Electrical and Electronic Engineering, 4 papers in Hardware and Architecture and 3 papers in Civil and Structural Engineering. Recurrent topics in Daniel DiMase's work include Integrated Circuits and Semiconductor Failure Analysis (5 papers), Physical Unclonable Functions (PUFs) and Hardware Security (4 papers) and Smart Grid Security and Resilience (3 papers). Daniel DiMase is often cited by papers focused on Integrated Circuits and Semiconductor Failure Analysis (5 papers), Physical Unclonable Functions (PUFs) and Hardware Security (4 papers) and Smart Grid Security and Resilience (3 papers). Daniel DiMase collaborates with scholars based in United States, Germany and United Kingdom. Daniel DiMase's co-authors include Ujjwal Guin, Mohammad Tehranipoor, Yiorgos Makris, Ke Huang, John M. Carulli, Igor Linkov, Zachary A. Collier, Julie Dixon, Elke Anklam and Ortwin Renn and has published in prestigious journals such as Proceedings of the IEEE, IEEE Access and Computer.

In The Last Decade

Daniel DiMase

11 papers receiving 852 citations

Hit Papers

Counterfeit Integrated Circuits: A Rising Threat in the G... 2014 2026 2018 2022 2014 100 200 300
What are hit papers?

Hit papers significantly outperform the citation benchmark for their cohort. A paper qualifies if it has ≥500 total citations, achieves ≥1.5× the top-1% citation threshold for papers in the same subfield and year (this is the minimum needed to enter the top 1%, not the average within it), or reaches the top citation threshold in at least one of its specific research topics.

  1. Counterfeit Integrated Circuits: A Rising Threat in the Global Semiconductor Supply Chain
    2014 353 citations Ujjwal Guin, Ke Huang et al. Proceedings of the IEEE profile →

Peers

Daniel DiMase
Venkatesh Akella United States
Francisco Maciá Pérez Spain
A. Steiger‐Garção Portugal
Vlasios Tsiatsis United States
Abbas Dandache France
Amit Kumar Goel India
Chen Hong China
Chao Jiang China
Venkatesh Akella United States
Daniel DiMase
Citations per year, relative to Daniel DiMase Daniel DiMase (= 1×) peers Venkatesh Akella

Countries citing papers authored by Daniel DiMase

Since Specialization
Citations

This map shows the geographic impact of Daniel DiMase's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Daniel DiMase with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Daniel DiMase more than expected).

Fields of papers citing papers by Daniel DiMase

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Daniel DiMase. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Daniel DiMase. The network helps show where Daniel DiMase may publish in the future.

Co-authorship network of co-authors of Daniel DiMase

This figure shows the co-authorship network connecting the top 25 collaborators of Daniel DiMase. A scholar is included among the top collaborators of Daniel DiMase based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Daniel DiMase. Daniel DiMase is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

11 of 11 papers shown
1.
May, Nicholas, et al.. (2022). Rapid three-dimensional reconstruction of printed circuit board using femtosecond laser delayering and digital microscopy. Microelectronics Reliability. 138. 114659–114659. 10 indexed citations
2.
May, Nicholas, et al.. (2022). Correlative multimodal imaging and targeted lasering for automated high-precision IC decapsulation. Microelectronics Reliability. 138. 114660–114660. 7 indexed citations
3.
DiMase, Daniel, et al.. (2020). A Holistic Approach to Cyber Physical Systems Security and Resilience. 1–8. 3 indexed citations
4.
Dixon, Julie, et al.. (2019). A Blockchain-Based Framework for Supply Chain Provenance. IEEE Access. 7. 157113–157125. 97 indexed citations
5.
DiMase, Daniel, et al.. (2016). Traceability and Risk Analysis Strategies for Addressing Counterfeit Electronics in Supply Chains for Complex Systems. Risk Analysis. 36(10). 1834–1843. 45 indexed citations
6.
DiMase, Daniel, et al.. (2015). Systems engineering framework for cyber physical security and resilience. Environment Systems & Decisions. 35(2). 291–300. 68 indexed citations
7.
Guin, Ujjwal, Daniel DiMase, & Mohammad Tehranipoor. (2014). Counterfeit Integrated Circuits: Detection, Avoidance, and the Challenges Ahead. Journal of Electronic Testing. 30(1). 9–23. 159 indexed citations
8.
Collier, Zachary A., et al.. (2014). Cybersecurity Standards: Managing Risk and Creating Resilience. Computer. 47(9). 70–76. 42 indexed citations
9.
Guin, Ujjwal, Daniel DiMase, & Mohammad Tehranipoor. (2014). A Comprehensive Framework for Counterfeit Defect Coverage Analysis and Detection Assessment. Journal of Electronic Testing. 30(1). 25–40. 54 indexed citations
10.
Linkov, Igor, Elke Anklam, Zachary A. Collier, Daniel DiMase, & Ortwin Renn. (2014). Risk-based standards: integrating top–down and bottom–up approaches. Environment Systems & Decisions. 34(1). 134–137. 53 indexed citations
11.
Guin, Ujjwal, Ke Huang, Daniel DiMase, et al.. (2014). Counterfeit Integrated Circuits: A Rising Threat in the Global Semiconductor Supply Chain. Proceedings of the IEEE. 102(8). 1207–1228. 353 indexed citations breakdown →

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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