C.K. Wong

487 total citations
27 papers, 394 citations indexed

About

C.K. Wong is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Biomedical Engineering. According to data from OpenAlex, C.K. Wong has authored 27 papers receiving a total of 394 indexed citations (citations by other indexed papers that have themselves been cited), including 21 papers in Electrical and Electronic Engineering, 5 papers in Mechanical Engineering and 5 papers in Biomedical Engineering. Recurrent topics in C.K. Wong's work include Electronic Packaging and Soldering Technologies (13 papers), 3D IC and TSV technologies (13 papers) and Advanced MEMS and NEMS Technologies (4 papers). C.K. Wong is often cited by papers focused on Electronic Packaging and Soldering Technologies (13 papers), 3D IC and TSV technologies (13 papers) and Advanced MEMS and NEMS Technologies (4 papers). C.K. Wong collaborates with scholars based in Singapore, Japan and United States. C.K. Wong's co-authors include Jun Wei, Mui Ling Sharon Nai, Hua Xie, Dawei Pan, E.H. Wong, Carolyn Wong, Yi Jin, L.C. Lee, Zhen Sun and Yukai Sun and has published in prestigious journals such as Chemosphere, IEEE Transactions on Power Systems and Thin Solid Films.

In The Last Decade

C.K. Wong

27 papers receiving 377 citations

Peers

C.K. Wong

EEE

BE

ME

CM

MC

Hongyu Zhang China

Gagan Anand India

Martin Bellmann Norway

Rui Tang China

Bo Qian China

Rao Li China

Bo Zhou China

Chien-Ping Wang Taiwan

Qiang Shen China

Benjamin Möller Germany

Hongyu Zhang China

C.K. Wong

296 ×1.2

EEE

28 ×0.3

BE

199 ×2.8

ME

18 ×0.5

CM

149 ×3.8

MC

Citations per year, relative to C.K. Wong C.K. Wong (= 1×) peers Hongyu Zhang

Countries citing papers authored by C.K. Wong

Since Specialization

Citations

This map shows the geographic impact of C.K. Wong's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by C.K. Wong with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites C.K. Wong more than expected).

Fields of papers citing papers by C.K. Wong

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by C.K. Wong. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by C.K. Wong. The network helps show where C.K. Wong may publish in the future.

Co-authorship network of co-authors of C.K. Wong

This figure shows the co-authorship network connecting the top 25 collaborators of C.K. Wong. A scholar is included among the top collaborators of C.K. Wong based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with C.K. Wong. C.K. Wong is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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20 of 20 papers shown

1.

Hoffman, Joseph, et al.. (2024). Evaluation of Strains in Dead-End Fittings of High-Temperature Low Sag Electrical Conductors Using FBG Sensors. IEEE Transactions on Instrumentation and Measurement. 73. 1–8. 1 indexed citations

2.

Wong, E.H. & C.K. Wong. (2008). Tri-Layer Structures Subjected to Combined Temperature and Mechanical Loadings. IEEE Transactions on Components and Packaging Technologies. 31(4). 790–800. 23 indexed citations

3.

Wong, C.K., et al.. (2006). Influence of Solder Volume on Interfacial Reaction between Sn-Ag-Cu Solder and TiW/Cu/Ni UBM. 2. 492–496. 2 indexed citations

4.

Wei, Jun & C.K. Wong. (2005). PHYSICAL AND CHEMICAL NANOLITHOGRAPHY TECHNIQUES: CHALLENGES AND PROSPECTS. International Journal of Nanoscience. 4(4). 575–585. 1 indexed citations

5.

Fan, Wenhui, et al.. (2005). Design and fabrication of micro thermoelectric cooler on LTCC substrate. 76–80. 6 indexed citations

6.

Zhang, Y. P., et al.. (2005). Frequency-band selection for an integrated-circuit package antenna using LTCC technology. Microwave and Optical Technology Letters. 44(5). 439–441. 4 indexed citations

7.

Wei, Jun, et al.. (2005). Low temperature Si-to-Si wafer bonding with sol-gel coating as intermediate layer. 28. 189–192. 1 indexed citations

8.

Wong, C.K., S.C. Wong, & C. O. Tong. (2005). The advantages of the multi-period lane-based optimization method for traffic signal design. 2 indexed citations

9.

Wei, Jun, et al.. (2004). Low temperature bonding process for wafer-level MEMS packaging. 41 42. 8 pp.–8 pp.. 2 indexed citations

10.

Jin, Yi, et al.. (2004). MEMS vacuum packaging technology and applications. 301–306. 24 indexed citations

11.

Wei, Jun, C.K. Wong, & L.C. Lee. (2004). Improvement of anodic bond quality with the assistance of sputtered amorphous film. Sensors and Actuators A Physical. 113(2). 218–225. 11 indexed citations

12.

Nai, Mui Ling Sharon, et al.. (2004). Silicon-to-silicon wafer bonding with gold as intermediate layer. 119–124. 12 indexed citations

13.

Wei, Jun, Mui Ling Sharon Nai, C.K. Wong, & L.C. Lee. (2004). Glass-to-glass anodic bonding process and electrostatic force. Thin Solid Films. 462-463. 487–491. 22 indexed citations

14.

Wang, Zhenfeng, et al.. (2004). High-aspect-ratio fabrications of micro journal air bearings for micro gas turbine engine. Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE. 5276. 428–428. 5 indexed citations

15.

Wong, C.K., et al.. (2003). HPLC pigment analysis of marine phytoplankton during a red tide occurrence in Tolo Harbour, Hong Kong. Chemosphere. 52(9). 1633–1640. 43 indexed citations

16.

Wei, Jun, et al.. (2003). A Packaging Solution for Pressure Sensor MEMS. 113–118. 1 indexed citations

17.

Shan, Xuechuan, et al.. (2003). A POLYMER-BASED OPTICAL SWITCH FABRICATED USING SILICON PROCESS, ELECTROPLATING AND MICRO HOT EMBOSSING. 4(3). 725–728. 2 indexed citations

18.

Wei, Jun, et al.. (2003). Low temperature wafer anodic bonding. Journal of Micromechanics and Microengineering. 13(2). 217–222. 116 indexed citations

19.

Wei, Jun, et al.. (2002). Nano-film assisted anodic bonding. Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE. 4936. 455–455. 1 indexed citations

20.

Goel, L., et al.. (1995). An educational software package for reliability evaluation of interconnected power systems. IEEE Transactions on Power Systems. 10(3). 1147–1153. 9 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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