Vimal Desai

477 citations
17 papers · 409 · h-index 7

Impact in

Papers in

Vimal Desai

17 papers receiving 389 citations

Peers

Vimal Desai
Comparison fields: 5 of 38
  • Ceramics and Composites 49
  • Biomedical Engineering 235
  • Aerospace Engineering 111
  • Materials Chemistry 193
  • Mechanical Engineering 135
Replace Dongyu He with:
Dongyu He China
Dejun Ma China
D. Jaramillo-Vigueras Mexico
Xianyi Lü China
Pakman Yiu Taiwan
S. Savoie Canada
John Persic Canada
Xinyu Ren China
Yunpeng Su China
Matthew T. Johnson United States
Vimal Desai relative to Dongyu He China Dongyu He's profile →
Citations per field
00.5×3.4×
Dongyu He · 1×
Citations per year

Countries citing papers authored by Vimal Desai

Since Specialization
Citations

This map shows the geographic impact of Vimal Desai's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Vimal Desai with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Vimal Desai more than expected).

Fields of papers citing papers by Vimal Desai

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Vimal Desai. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Vimal Desai. The network helps show where Vimal Desai may publish in the future.

Co-authors

The 12 scholars most cited alongside Vimal Desai, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.

Border = papers with Vimal Desai Line = papers co-authored together Vimal Desai links everyone, so they are left out of the graph.

All Works

17 of 17 papers shown
#Work
1 200797
2 200497
3 200359
4 200340
5 200433
6 200426
7 200824
8 20066
9 20036
10 20035
11 20034
12 20054
13 20042
14 19992
15 20042
16 19981
17 20001

About Vimal Desai

Vimal Desai is a scholar working on Biomedical Engineering, Electrical and Electronic Engineering, Materials Chemistry, Atomic and Molecular Physics, and Optics and Aerospace Engineering, having authored 17 papers that have together received 409 indexed citations. Recurring topics across this work include Advanced Surface Polishing Techniques (11 papers), Advanced Machining and Optimization Techniques (5 papers), Force Microscopy Techniques and Applications (5 papers), High-Temperature Coating Behaviors (4 papers), Diamond and Carbon-based Materials Research (3 papers), Integrated Circuits and Semiconductor Failure Analysis (3 papers), Copper Interconnects and Reliability (3 papers) and Advanced machining processes and optimization (2 papers). The work is most often cited by research in Ceramics and Composites (49 citations), Biomedical Engineering (235 citations), Aerospace Engineering (111 citations), Materials Chemistry (193 citations) and Mechanical Engineering (135 citations). Vimal Desai has collaborated with scholars based in United States and Canada. Frequent co-authors include Tianbao Du, Arun Vijayakumar, Ying Luo, Travis Patterson, Yongho Sohn, Biao Yuan, Kalpathy B. Sundaram, M. Jamal Deen, Dennis W. Hess and Sudipta Seal. Their work appears in journals such as Microelectronic Engineering, Applied Surface Science, Electrochimica Acta, The Electrochemical Society Interface and JOM.

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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