Vimal Desai

472 total citations
17 papers, 402 citations indexed

About

Vimal Desai is a scholar working on Biomedical Engineering, Electrical and Electronic Engineering and Materials Chemistry. According to data from OpenAlex, Vimal Desai has authored 17 papers receiving a total of 402 indexed citations (citations by other indexed papers that have themselves been cited), including 11 papers in Biomedical Engineering, 8 papers in Electrical and Electronic Engineering and 6 papers in Materials Chemistry. Recurrent topics in Vimal Desai's work include Advanced Surface Polishing Techniques (11 papers), Force Microscopy Techniques and Applications (5 papers) and Advanced Machining and Optimization Techniques (5 papers). Vimal Desai is often cited by papers focused on Advanced Surface Polishing Techniques (11 papers), Force Microscopy Techniques and Applications (5 papers) and Advanced Machining and Optimization Techniques (5 papers). Vimal Desai collaborates with scholars based in United States and Canada. Vimal Desai's co-authors include Tianbao Du, Arun Vijayakumar, Ying Luo, Biao Yuan, Travis Patterson, Yongho Sohn, Kalpathy B. Sundaram, M. Jamal Deen, Dennis W. Hess and Sudipta Seal and has published in prestigious journals such as Electrochimica Acta, Journal of the American Ceramic Society and Applied Surface Science.

In The Last Decade

Vimal Desai

17 papers receiving 384 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Vimal Desai United States 7 232 189 163 134 110 17 402
Dongyu He China 12 69 0.3× 203 1.1× 88 0.5× 185 1.4× 105 1.0× 30 425
Yunpeng Su China 10 118 0.5× 156 0.8× 148 0.9× 206 1.5× 89 0.8× 24 415
Pakman Yiu Taiwan 12 59 0.3× 131 0.7× 93 0.6× 208 1.6× 65 0.6× 28 352
Matthew T. Johnson United States 12 41 0.2× 284 1.5× 106 0.7× 120 0.9× 133 1.2× 31 471
Alessandro Pugliara France 11 131 0.6× 177 0.9× 101 0.6× 76 0.6× 53 0.5× 28 381
A. R. Bhatti United Kingdom 11 60 0.3× 126 0.7× 112 0.7× 176 1.3× 18 0.2× 27 378
Feng Xiao China 11 81 0.3× 109 0.6× 108 0.7× 142 1.1× 72 0.7× 42 353
Fabian Schmitz Germany 14 61 0.3× 402 2.1× 200 1.2× 150 1.1× 144 1.3× 30 560
Xinyu Ren China 13 30 0.1× 170 0.9× 153 0.9× 305 2.3× 103 0.9× 51 501
Dejun Ma China 13 95 0.4× 162 0.9× 195 1.2× 138 1.0× 18 0.2× 26 519

Countries citing papers authored by Vimal Desai

Since Specialization
Citations

This map shows the geographic impact of Vimal Desai's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Vimal Desai with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Vimal Desai more than expected).

Fields of papers citing papers by Vimal Desai

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Vimal Desai. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Vimal Desai. The network helps show where Vimal Desai may publish in the future.

Co-authorship network of co-authors of Vimal Desai

This figure shows the co-authorship network connecting the top 25 collaborators of Vimal Desai. A scholar is included among the top collaborators of Vimal Desai based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Vimal Desai. Vimal Desai is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

17 of 17 papers shown
1.
Yuan, Biao, et al.. (2008). Degradation of Yttria Stabilized Zirconia Thermal Barrier Coatings by Molten CMAS (CaO-MgO-Al<sub>2</sub>O<sub>3</sub>-SiO<sub>2</sub>) Deposits. Materials science forum. 595-598. 207–212. 23 indexed citations
2.
Yuan, Biao, et al.. (2007). Degradation of Yttria‐Stabilized Zirconia Thermal Barrier Coatings by Vanadium Pentoxide, Phosphorous Pentoxide, and Sodium Sulfate. Journal of the American Ceramic Society. 90(11). 3601–3607. 95 indexed citations
3.
Hess, Dennis W., et al.. (2006). Dielectric Science and Technology. The Electrochemical Society Interface. 15(1). 28–31. 6 indexed citations
4.
Desai, Vimal. (2005). An overview of the yucca mountain project. JOM. 57(1). 18–19. 4 indexed citations
5.
Du, Tianbao, et al.. (2004). Electrochemical characterization of copper chemical mechanical planarization in KIO3 slurry. Applied Surface Science. 229(1-4). 167–174. 26 indexed citations
6.
Du, Tianbao, Arun Vijayakumar, & Vimal Desai. (2004). Effect of Hydrogen Peroxide on Oxidation of Copper in CMP Slurries Containing Glycine and Cu Sulfate. MRS Proceedings. 816. 2 indexed citations
7.
Du, Tianbao, Arun Vijayakumar, & Vimal Desai. (2004). Effect of hydrogen peroxide on oxidation of copper in CMP slurries containing glycine and Cu ions. Electrochimica Acta. 49(25). 4505–4512. 95 indexed citations
8.
Vijayakumar, Arun, Tianbao Du, Kalpathy B. Sundaram, & Vimal Desai. (2004). The Application of Chemical Mechanical Polishing for Nickel Used in MEMS Devices. MRS Proceedings. 816. 2 indexed citations
9.
Du, Tianbao, Arun Vijayakumar, Kalpathy B. Sundaram, & Vimal Desai. (2004). Chemical mechanical polishing of nickel for applications in MEMS devices. Microelectronic Engineering. 75(2). 234–241. 32 indexed citations
10.
Vijayakumar, Arun, Tianbao Du, Kalpathy B. Sundaram, & Vimal Desai. (2003). Selectivity Studies On Tantalum Barrier Layer In Copper CMP. MRS Proceedings. 767. 4 indexed citations
11.
Du, Tianbao, et al.. (2003). Electrochemical characterization of copper chemical mechanical polishing. Microelectronic Engineering. 69(1). 1–9. 40 indexed citations
12.
Du, Tianbao & Vimal Desai. (2003). The pH Effect On Chemical Mechanical Planarization Of Copper. MRS Proceedings. 767. 4 indexed citations
13.
Luo, Ying, Tianbao Du, & Vimal Desai. (2003). Chemical-Mechanical Planarization of Copper: The Effect of Inhibitor and Complexing Agent. MRS Proceedings. 767. 6 indexed citations
14.
Du, Tianbao, Ying Luo, & Vimal Desai. (2003). The combinatorial effect of complexing agent and inhibitor on chemical–mechanical planarization of copper. Microelectronic Engineering. 71(1). 90–97. 59 indexed citations
15.
Zhang, Jianqi, et al.. (2000). Quality Assurance Evaluation of Thermal Barrier Coatings by Electrochemical Impedance Spectroscopy. MRS Proceedings. 645. 1 indexed citations
16.
Seal, Sudipta, et al.. (1999). XPS and Electrochemical Studies on Tungsten-Oxidizer Interaction in Chemical Mechanical Polishing. MRS Proceedings. 566. 2 indexed citations
17.
Desai, Vimal, et al.. (1998). Oxidation Characteristics of Nickel Based Superalloys in Steam. Journal of International Crisis and Risk Communication Research. 1 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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