Brian K. Via
Impact in
- Building and Construction top 1%
- Wood Treatment and Properties
- Analytical Chemistry top 1%
- Spectroscopy and Chemometric Analyses
Papers in
-
- Wood Treatment and Properties 64
-
- Natural Fiber Reinforced Composites 32
- Co-authors
- Chengfeng ZhouOladiran FasinaSushil AdhikariTodd F. ShupeWei JiangChi‐Leung SoLori G. EckhardtMarı́a L. Auad
- Journals
- BioResources (13 papers)Wood and Fiber Science (7 papers)European Journal of Wood and Wood Products (6 papers)Wood Science and Technology (4 papers)Polymers (4 papers)
- Partner nations
- United StatesChinaSouth Korea
In The Last Decade
Brian K. Via
146 papers receiving 2.2k citations
Peers
Comparison fields: 5 of 134
- Building and Construction 684
- Analytical Chemistry 385
- Polymers and Plastics 498
- Biomaterials 388
- Biomedical Engineering 906
Countries citing papers authored by Brian K. Via
This map shows the geographic impact of Brian K. Via's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Brian K. Via with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Brian K. Via more than expected).
Fields of papers citing papers by Brian K. Via
This network shows the impact of papers produced by Brian K. Via. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Brian K. Via. The network helps show where Brian K. Via may publish in the future.
Co-authors
The 25 scholars most cited alongside Brian K. Via, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2025 | 0 | |
| 2 | 2024 | 1 | |
| 3 | 2024 | 1 | |
| 4 | 2023 | 18 | |
| 5 | 2023 | 1 | |
| 6 | 2022 | 10 | |
| 7 | 2022 | 3 | |
| 8 | Cost Analysis of Lightweight Wood Panels Strengthened with Lignin- Cellulose Nanofibrils | 2020 | 1 |
| 9 | 2019 | 1 | |
| 10 | 2019 | 19 | |
| 11 | 2015 | 26 | |
| 12 | Technical Note: Melt Dispersion Technique for Preparing Paraffin Wax Microspheres for Cellulose Encapsulation | 2014 | 2 |
| 13 | Cellulose Reinforcement of Phenol Formaldehyde: Characterization and Chemometric Elucidation | 2013 | 18 |
| 14 | Effect of Microcrystalline Cellulose, Species, and Particle Size on Mechanical and Physical Properties of Particleboard | 2012 | 15 |
| 15 | EFFECT OF PROCESSING PARAMETERS, RESIN, AND WAX LOADING ON WATER VAPOR SORPTION OF WOOD STRANDS | 2008 | 7 |
| 16 | Formosan and Native Subterranean Termite Attack of Pressure-Treated SPF Wood Species Exposed in Louisiana | 2006 | 6 |
| 17 | The Response of Visible/Near Infrared Absorbance to Wood-Staining Fungi | 2006 | 6 |
| 18 | Ability of near infrared spectroscopy to monitor air-dry density distribution and variation of wood | 2005 | 24 |
| 19 | Near infared spectroscopy in the forest products industry | 2004 | 74 |
| 20 | Relationship between tooth withdrawal strength and specific gravity for metal plate truss connections | 1999 | 1 |
About Brian K. Via
Brian K. Via is a scholar working on Building and Construction, Polymers and Plastics, Analytical Chemistry, Biomaterials and Nature and Landscape Conservation, having authored 153 papers that have together received 2.3k indexed citations. Recurring topics across this work include Wood Treatment and Properties (64 papers), Lignin and Wood Chemistry (42 papers), Natural Fiber Reinforced Composites (32 papers), Spectroscopy and Chemometric Analyses (28 papers), Advanced Cellulose Research Studies (20 papers), Forest ecology and management (18 papers), Tree Root and Stability Studies (16 papers) and Thermochemical Biomass Conversion Processes (15 papers). The work is most often cited by research in Building and Construction (684 citations), Analytical Chemistry (385 citations), Polymers and Plastics (498 citations), Biomaterials (388 citations) and Biomedical Engineering (906 citations). Brian K. Via has collaborated with scholars based in United States, China and South Korea. Frequent co-authors include Chengfeng Zhou, Oladiran Fasina, Sushil Adhikari, Todd F. Shupe, Wei Jiang, Chi‐Leung So, Lori G. Eckhardt, Marı́a L. Auad, Qingzheng Cheng and Leslie H. Groom. Their work appears in journals such as BioResources, Wood and Fiber Science, European Journal of Wood and Wood Products, Wood Science and Technology and Polymers.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.