B. C. Valek

1.2k total citations
23 papers, 942 citations indexed

About

B. C. Valek is a scholar working on Mechanics of Materials, Electronic, Optical and Magnetic Materials and Electrical and Electronic Engineering. According to data from OpenAlex, B. C. Valek has authored 23 papers receiving a total of 942 indexed citations (citations by other indexed papers that have themselves been cited), including 19 papers in Mechanics of Materials, 19 papers in Electronic, Optical and Magnetic Materials and 14 papers in Electrical and Electronic Engineering. Recurrent topics in B. C. Valek's work include Copper Interconnects and Reliability (19 papers), Metal and Thin Film Mechanics (18 papers) and Electronic Packaging and Soldering Technologies (8 papers). B. C. Valek is often cited by papers focused on Copper Interconnects and Reliability (19 papers), Metal and Thin Film Mechanics (18 papers) and Electronic Packaging and Soldering Technologies (8 papers). B. C. Valek collaborates with scholars based in United States, Switzerland and Germany. B. C. Valek's co-authors include Nobumichi Tamura, J. R. Patel, Ralph Spolenak, H. A. Padmore, Richard Celestre, Alastair A. MacDowell, J. C. Bravman, B. W. Batterman, W. L. Brown and K. N. Tu and has published in prestigious journals such as Physical Review Letters, Applied Physics Letters and Journal of Applied Physics.

In The Last Decade

B. C. Valek

21 papers receiving 913 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
B. C. Valek United States 13 406 377 280 276 198 23 942
J. P. Morniroli France 19 151 0.4× 790 2.1× 158 0.6× 197 0.7× 545 2.8× 70 1.3k
T. Malis Canada 13 280 0.7× 814 2.2× 92 0.3× 151 0.5× 360 1.8× 33 1.3k
S. Grigull Germany 19 190 0.5× 587 1.6× 132 0.5× 274 1.0× 461 2.3× 32 1.0k
J.M. Titchmarsh United Kingdom 22 232 0.6× 841 2.2× 58 0.2× 327 1.2× 755 3.8× 70 1.6k
J. Nasiatka United States 12 499 1.2× 244 0.6× 28 0.1× 118 0.4× 177 0.9× 21 1.1k
C. W. Allen United States 19 251 0.6× 650 1.7× 68 0.2× 98 0.4× 321 1.6× 88 1.1k
Arantxa Vilalta‐Clemente United Kingdom 15 204 0.5× 404 1.1× 78 0.3× 124 0.4× 248 1.3× 28 716
R.J. Gaboriaud France 17 275 0.7× 581 1.5× 113 0.4× 175 0.6× 147 0.7× 70 850
N. G. Chechenin Russia 18 294 0.7× 531 1.4× 242 0.9× 292 1.1× 265 1.3× 135 1.1k
A. Olsen Norway 16 278 0.7× 615 1.6× 53 0.2× 92 0.3× 447 2.3× 56 1.0k

Countries citing papers authored by B. C. Valek

Since Specialization
Citations

This map shows the geographic impact of B. C. Valek's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by B. C. Valek with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites B. C. Valek more than expected).

Fields of papers citing papers by B. C. Valek

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by B. C. Valek. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by B. C. Valek. The network helps show where B. C. Valek may publish in the future.

Co-authorship network of co-authors of B. C. Valek

This figure shows the co-authorship network connecting the top 25 collaborators of B. C. Valek. A scholar is included among the top collaborators of B. C. Valek based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with B. C. Valek. B. C. Valek is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Chen, Kai, Nobumichi Tamura, B. C. Valek, & K. N. Tu. (2008). Plastic deformation in Al (Cu) interconnects stressed by electromigration and studied by synchrotron polychromatic x-ray microdiffraction. Journal of Applied Physics. 104(1). 41 indexed citations
2.
Budiman, Arief Suriadi, William D. Nix, Nobumichi Tamura, et al.. (2006). Crystal plasticity in Cu damascene interconnect lines undergoing electromigration as revealed by synchrotron x-ray microdiffraction. Applied Physics Letters. 88(23). 81 indexed citations
3.
Budiman, Arief Suriadi, Nobumichi Tamura, B. C. Valek, et al.. (2006). Electromigration-Induced Plastic Deformation in Cu Damascene Interconnect Lines as Revealed by Synchrotron X-Ray Microdiffraction. MRS Proceedings. 914. 4 indexed citations
4.
Park, Tae‐Soon, Ares J. Rosakis, Ersan Üstündag, et al.. (2005). A Comparison of X-Ray Microdiffraction and Coherent Gradient Sensing in Measuring Discontinuous Curvatures in Thin Film: Substrate Systems. Journal of Applied Mechanics. 73(5). 723–729. 22 indexed citations
5.
Barabash, Rozaliya, Gene E. Ice, Nobumichi Tamura, et al.. (2004). Quantitative characterization of electromigration-induced plastic deformation in Al(0.5wt%Cu) interconnect. Microelectronic Engineering. 75(1). 24–30. 12 indexed citations
6.
Budiman, Arief Suriadi, Nobumichi Tamura, B. C. Valek, et al.. (2004). Unexpected Mode of Plastic Deformation in Cu Damascene Lines Undergoing Electromigration. MRS Proceedings. 812. 2 indexed citations
7.
Wu, Albert T., K. N. Tu, J. R. Lloyd, et al.. (2004). Electromigration-induced microstructure evolution in tin studied by synchrotron x-ray microdiffraction. Applied Physics Letters. 85(13). 2490–2492. 51 indexed citations
8.
Tamura, Nobumichi, Alastair A. MacDowell, Ralph Spolenak, et al.. (2003). Scanning X-ray microdiffraction with submicrometer white beam for strain/stress and orientation mapping in thin films. Journal of Synchrotron Radiation. 10(2). 137–143. 213 indexed citations
9.
Spolenak, Ralph, W. L. Brown, Nobumichi Tamura, et al.. (2003). Local Plasticity of Al Thin Films as Revealed by X-Ray Microdiffraction. Physical Review Letters. 90(9). 96102–96102. 50 indexed citations
10.
Valek, B. C.. (2003). X-ray microdiffraction studies of mechanical behavior and electromigration in thin film structures. 5 indexed citations
11.
Barabash, Rozaliya, Gene E. Ice, Nobumichi Tamura, et al.. (2003). Quantitative analysis of dislocation arrangements induced by electromigration in a passivated Al (0.5 wt % Cu) interconnect. Journal of Applied Physics. 93(9). 5701–5706. 24 indexed citations
12.
Barabash, Rozaliya, Nobumichi Tamura, B. C. Valek, et al.. (2003). Quantitative Characterization of Dislocation Structure coupled with Electromigration in a Passivated Al (0.5wt%Cu) Interconnects. MRS Proceedings. 766.
13.
Valek, B. C., Nobumichi Tamura, Ralph Spolenak, et al.. (2003). Early stage of plastic deformation in thin films undergoing electromigration. Journal of Applied Physics. 94(6). 3757–3761. 44 indexed citations
14.
Tamura, Nobumichi, Richard Celestre, Alastair A. MacDowell, et al.. (2002). Submicron x-ray diffraction and its applications to problems in materials and environmental science. Review of Scientific Instruments. 73(3). 1369–1372. 146 indexed citations
15.
Spolenak, Ralph, D. Barr, M. E. Gross, et al.. (2001). Microtexture and strain in electroplated copper interconnects. eScholarship (California Digital Library). 1 indexed citations
16.
MacDowell, Alastair A., Richard Celestre, Nobumichi Tamura, et al.. (2001). Submicron X-ray diffraction. Nuclear Instruments and Methods in Physics Research Section A Accelerators Spectrometers Detectors and Associated Equipment. 467-468. 936–943. 78 indexed citations
17.
Valek, B. C., Nobumichi Tamura, Ralph Spolenak, et al.. (2001). Local Microstructure and Stress in Al(Cu) Thin Film Structures Studied by X-Ray Microdiffraction. MRS Proceedings. 673. 5 indexed citations
18.
MacDowell, Alastair A., Richard Celestre, Nobumichi Tamura, et al.. (2000). Submicron X-ray diffraction. University of North Texas Digital Library (University of North Texas). 1 indexed citations
19.
Spolenak, Ralph, D. Barr, M. E. Gross, et al.. (2000). Microtexture and Strain in Electroplated Copper Interconnects. MRS Proceedings. 612. 11 indexed citations
20.
Valek, B. C. & J. M. Hampikian. (1997). Silica thin films applied to Ni-20Cr alloy via combustion chemical vapor deposition. Surface and Coatings Technology. 94-95. 13–20. 13 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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