Damena Agonafer

1.1k total citations
38 papers, 815 citations indexed

About

Damena Agonafer is a scholar working on Mechanical Engineering, Electrical and Electronic Engineering and Computational Mechanics. According to data from OpenAlex, Damena Agonafer has authored 38 papers receiving a total of 815 indexed citations (citations by other indexed papers that have themselves been cited), including 17 papers in Mechanical Engineering, 17 papers in Electrical and Electronic Engineering and 15 papers in Computational Mechanics. Recurrent topics in Damena Agonafer's work include Heat Transfer and Optimization (15 papers), Fluid Dynamics and Thin Films (11 papers) and Heat Transfer and Boiling Studies (10 papers). Damena Agonafer is often cited by papers focused on Heat Transfer and Optimization (15 papers), Fluid Dynamics and Thin Films (11 papers) and Heat Transfer and Boiling Studies (10 papers). Damena Agonafer collaborates with scholars based in United States, South Korea and China. Damena Agonafer's co-authors include Yoonjin Won, Kenneth E. Goodson, Mehdi Asheghi, Binjian Ma, Jungwan Cho, Hyoungsoon Lee, Shan Li, Farzad Houshmand, Mark A. Shannon and James W. Palko and has published in prestigious journals such as Advanced Functional Materials, Langmuir and Journal of Colloid and Interface Science.

In The Last Decade

Damena Agonafer

37 papers receiving 788 citations

Peers

Damena Agonafer
Kevin R. Bagnall United States
Gisuk Hwang United States
Richard Bonner United States
Sudeshna Roy Netherlands
Arganthaël Berson United States
Damena Agonafer
Citations per year, relative to Damena Agonafer Damena Agonafer (= 1×) peers Haisheng Fang

Countries citing papers authored by Damena Agonafer

Since Specialization
Citations

This map shows the geographic impact of Damena Agonafer's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Damena Agonafer with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Damena Agonafer more than expected).

Fields of papers citing papers by Damena Agonafer

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Damena Agonafer. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Damena Agonafer. The network helps show where Damena Agonafer may publish in the future.

Co-authorship network of co-authors of Damena Agonafer

This figure shows the co-authorship network connecting the top 25 collaborators of Damena Agonafer. A scholar is included among the top collaborators of Damena Agonafer based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Damena Agonafer. Damena Agonafer is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Graham, Samuel, et al.. (2025). Dynamic Thermal Management of a MOSFET Power Module Using a Novel Three-Component Phase Change Material. ASME Journal of Heat and Mass Transfer. 147(10).
2.
Agonafer, Damena, et al.. (2024). Design and modeling of hollow micropillars evaporator for thermal management in high heat flux applications: Numerical analysis. Applied Thermal Engineering. 262. 124977–124977. 2 indexed citations
3.
Kong, Daeyoung, et al.. (2023). An additively manufactured manifold-microchannel heat sink for high-heat flux cooling. International Journal of Mechanical Sciences. 248. 108228–108228. 41 indexed citations
4.
Kong, Daeyoung, et al.. (2021). A holistic approach to thermal-hydraulic design of 3D manifold microchannel heat sinks for energy-efficient cooling. Case Studies in Thermal Engineering. 28. 101583–101583. 44 indexed citations
5.
Lee, Hyoungsoon, et al.. (2021). Guidelines for Designing Micropillar Structures for Enhanced Evaporative Heat Transfer. Journal of Electronic Packaging. 143(4). 2 indexed citations
6.
Ma, Binjian, et al.. (2021). Molecular dynamics simulations of thin-film evaporation: The influence of interfacial thermal resistance on a graphene-coated heated silicon substrate. Applied Thermal Engineering. 195. 117142–117142. 30 indexed citations
7.
Ma, Binjian, et al.. (2021). Review article: Microscale evaporative cooling technologies for high heat flux microelectronics devices: Background and recent advances. Applied Thermal Engineering. 194. 117109–117109. 66 indexed citations
8.
Li, Shan, et al.. (2019). Investigation of the evaporation heat transfer mechanism of a non-axisymmetric droplet confined on a heated micropillar structure. International Journal of Heat and Mass Transfer. 141. 191–203. 18 indexed citations
9.
Li, Junhui, Shan Li, Binjian Ma, et al.. (2019). Investigation of the confinement effect on the evaporation behavior of a droplet pinned on a micropillar structure. Journal of Colloid and Interface Science. 555. 583–594. 22 indexed citations
10.
Li, Shan, et al.. (2019). Experimental investigation of evaporation from asymmetric microdroplets confined on heated micropillar structures. Experimental Thermal and Fluid Science. 109. 109889–109889. 20 indexed citations
11.
Ma, Binjian, et al.. (2019). Evolution of Microdroplet Morphology Confined on Asymmetric Micropillar Structures. Langmuir. 35(37). 12264–12275. 20 indexed citations
12.
Li, Shan, et al.. (2019). Numerical Investigation of Shape Effect on Microdroplet Evaporation. Journal of Electronic Packaging. 141(4). 12 indexed citations
13.
Agonafer, Damena, Hyoungsoon Lee, Pablo Vásquez, et al.. (2017). Porous micropillar structures for retaining low surface tension liquids. Journal of Colloid and Interface Science. 514. 316–327. 31 indexed citations
14.
Palko, James W., Hyoungsoon Lee, Chi Zhang, et al.. (2017). Extreme Two‐Phase Cooling from Laser‐Etched Diamond and Conformal, Template‐Fabricated Microporous Copper. Advanced Functional Materials. 27(45). 114 indexed citations
15.
Lee, Hyoungsoon, Damena Agonafer, Yoonjin Won, et al.. (2016). Thermal Modeling of Extreme Heat Flux Microchannel Coolers for GaN-on-SiC Semiconductor Devices. Journal of Electronic Packaging. 138(1). 62 indexed citations
16.
Agonafer, Damena, Ken Lopez, James W. Palko, et al.. (2015). Burst behavior at a capillary tip: Effect of low and high surface tension. Journal of Colloid and Interface Science. 455. 1–5. 20 indexed citations
17.
Won, Yoonjin, Jungwan Cho, Damena Agonafer, Mehdi Asheghi, & Kenneth E. Goodson. (2015). Fundamental Cooling Limits for High Power Density Gallium Nitride Electronics. IEEE Transactions on Components Packaging and Manufacturing Technology. 5(6). 737–744. 115 indexed citations
18.
Won, Yoonjin, Farzad Houshmand, Damena Agonafer, Mehdi Asheghi, & Kenneth E. Goodson. (2014). Microfluidic Heat Exchangers for High Power Density GaN on SiC. 1–5. 6 indexed citations
19.
Agonafer, Damena, et al.. (2012). Study of Insulating Properties of Alkanethiol Self-Assembled Monolayers Formed Under Prolonged Incubation Using Electrochemical Impedance Spectroscopy. Journal of Nanotechnology in Engineering and Medicine. 3(3). 12 indexed citations
20.
Yeom, Junghoon, et al.. (2009). Low Reynolds number flow across an array of cylindrical microposts in a microchannel and figure-of-merit analysis of micropost-filled microreactors. Journal of Micromechanics and Microengineering. 19(6). 65025–65025. 39 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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