Tz-Cheng Chiu

Fiber-reinforced composites for aerospace, energy, and marine applications: an insight into failure mechanisms under chemical, thermal, oxidative, and mechanical load conditions

Comprehensive review and future prospects on chip-scale thermal management: Core of data center’s thermal management

Warpage simulation for the reconstituted wafer used in fan-out wafer level packaging

Using DMA to Simultaneously Acquire Young's Relaxation Modulus and Time-dependent Poisson's Ratio of a Viscoelastic Material