Standout Papers

Wafer bonding for silicon-on-insulator technologies 1986 2026 1999 2012 372
  1. Wafer bonding for silicon-on-insulator technologies (1986)
    J. B. Lasky Applied Physics Letters

Immediate Impact

9 from Science/Nature 64 standout
Sub-graph 1 of 24

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Works of J. B. Lasky being referenced

Wafer bonding for silicon-on-insulator technologies
1986 Standout

Author Peers

Author Last Decade Papers Cites
J. B. Lasky 767 134 422 10 876
R. Flitsch 696 394 180 13 969
U. G�sele 771 366 399 16 889
K.E. Bean 708 227 229 17 896
Stanley M. Wolf 724 234 172 5 942
L. Muehlhoff 542 325 226 9 752
Benjamin W. Chui 486 110 525 20 844
T. Hoose 550 73 297 17 889
Matthew Church 565 194 68 9 826
A.Y.C. Yu 694 181 652 18 899
T. C. Bailey 588 65 253 13 843

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