Immediate Impact

9 standout
Sub-graph 1 of 5

Citing Papers

Recent Advances and Trends in Advanced Packaging
2022 Standout
Dielectric polymers for high-temperature capacitive energy storage
2021 Standout
2 intermediate papers

Works of E Perfecto being referenced

Reliability of a 300-mm-compatible 3DI technology based on hybrid Cu-adhesive wafer bonding
2006
Measurement of dielectric anisotropy of BPDA-PDA polyimide in multilayer thin-film packages
1994

Author Peers

Author Last Decade Papers Cites
E Perfecto 38 6 1 21 16 11 61
R.N. Master 94 5 3 7 13 11 120
Mian Tao 48 2 3 12 11 14 58
Suresh Ramalingam 22 11 5 7 9 11 48
Donald R. J. White 55 31 2 8 10 10 96
I. Stark 22 5 1 14 13 6 67
Douglas Yu 100 10 7 4 8 8 115
Gang Lv 20 3 25 8 24 10 67
Stephan Neuhaus 12 7 6 8 9 57
K. Koseki 35 1 1 13 8 16 62
Y. Hiruta 90 4 1 59 7 11 109

All Works

Loading papers...

Rankless by CCL
2026