Immediate Impact

1 from Science/Nature 15 standout
Sub-graph 1 of 8

Citing Papers

Liquid Crystal‐Engineered Polydimethylsiloxane: Enhancing Intrinsic Thermal Conductivity through High Grafting Density of Mesogens
2025 Standout
Recent Advances and Trends in Advanced Packaging
2022 Standout
2 intermediate papers

Works of D. F. Lim being referenced

(Invited) Cu Surface Passivation with Self-Assembled Monolayer (SAM) and Its Application for Wafer Bonding at Moderately Low Temperature
2013
Through Silicon Via Fabrication with Low-κ Dielectric Liner and Its Implications on Parasitic Capacitance and Leakage Current
2012

Author Peers

Author Last Decade Papers Cites
D. F. Lim 360 65 118 21 379
Akitsu Shigetou 320 52 77 24 383
Pascal Tilmant 284 56 131 17 346
Zhenzhe Li 294 18 146 24 367
T.C. Chai 318 41 45 16 342
Jiawen Chen 364 53 105 20 443
Alexander G. Squires 272 51 40 23 380
E.M. Kelder 287 85 61 16 381
Wenjiang Zhou 191 61 91 15 379
Ran He 412 31 48 17 451
Zhihui Li 160 23 216 18 342

All Works

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Rankless by CCL
2026