Immediate Impact
7 standout
Citing Papers
Recent Advances and Trends in Advanced Packaging
2022 Standout
A Review of Actuation and Sensing Mechanisms in MEMS-Based Sensor Devices
2021 Standout
Works of C.S. Premachandran being referenced
Development of novel intermetallic joints using thin film indium based solder by low temperature bonding technology for 3D IC stacking
2009
Design and development of a 3D scanning MEMS OCT probe using a novel SiOB package assembly
2008
Author Peers
| Author | Last Decade | Papers | Cites | ||||
|---|---|---|---|---|---|---|---|
| C.S. Premachandran | 106 | 122 | 10 | 30 | 18 | 185 | |
| Quentin A. A. Tanguy | 93 | 102 | 6 | 51 | 19 | 212 | |
| Mirela G. Bancu | 197 | 154 | 6 | 93 | 11 | 280 | |
| S. Sivaramakrishnan | 81 | 90 | 3 | 27 | 18 | 170 | |
| Shulong Feng | 81 | 105 | 17 | 72 | 26 | 198 | |
| J. Otto | 166 | 149 | 9 | 30 | 19 | 297 | |
| P. Brédy | 106 | 39 | 1 | 29 | 19 | 144 | |
| Paul Gräupner | 99 | 203 | 5 | 33 | 15 | 232 | |
| Veerle Simons | 32 | 159 | 7 | 27 | 13 | 207 | |
| Youji Kotsuka | 133 | 100 | 3 | 13 | 24 | 268 | |
| Lira Hamada | 190 | 107 | 15 | 4 | 26 | 251 |
All Works
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