Yeong K. Kim
- Mechanics of Materials top 2%
- Mechanical Engineering top 5%
- Electrical and Electronic Engineering
- Polymers and Plastics top 10%
- Civil and Structural Engineering
- Co-authors
- Scott R. WhiteBoyoung LeeJoo-Ho ChoiInsu ParkSang-Yul LeeJae-Seong KimGang JinJae Hyuk Lim
- Topics
- Electronic Packaging and Soldering Technologies (9 papers)Material Properties and Processing (9 papers)Mechanical Behavior of Composites (8 papers)
- Journals
- Polymer Engineering and ScienceMicroelectronics ReliabilityJournal of Reinforced Plastics and Composites
- Partner nations
- South KoreaUnited StatesChina
In The Last Decade
Yeong K. Kim
22 papers receiving 616 citations
Peers
Comparison fields: 5 of 37
- Mechanics of Materials 494
- Mechanical Engineering 472
- Electrical and Electronic Engineering 126
- Polymers and Plastics 101
- Civil and Structural Engineering 36
Countries citing papers authored by Yeong K. Kim
This map shows the geographic impact of Yeong K. Kim's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Yeong K. Kim with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Yeong K. Kim more than expected).
Fields of papers citing papers by Yeong K. Kim
This network shows the impact of papers produced by Yeong K. Kim. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Yeong K. Kim. The network helps show where Yeong K. Kim may publish in the future.
Co-authorship network of co-authors of Yeong K. Kim
This figure shows the co-authorship network connecting the top 25 collaborators of Yeong K. Kim. A scholar is included among the top collaborators of Yeong K. Kim based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Yeong K. Kim. Yeong K. Kim is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 1 | |
| 2 | 12 | |
| 3 | 1 | |
| 4 | 1 | |
| 5 | 14 | |
| 6 | 1 | |
| 7 | 2 | |
| 8 | 1 | |
| 9 | 30 | |
| 10 | 1 | |
| 11 | 2 | |
| 12 | 2 | |
| 13 | 28 | |
| 14 | 7 | |
| 15 | 2 | |
| 16 | 17 | |
| 17 | 91 | |
| 18 | 50 | |
| 19 | 184 | |
| 20 | 7 |
About Yeong K. Kim
Yeong K. Kim is a scholar working on Mechanics of Materials, General Materials Science and Statistics, Probability and Uncertainty, having authored 22 papers that have together received 647 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (9 papers), Material Properties and Processing (9 papers) and Mechanical Behavior of Composites (8 papers). The work is most often cited by research in Mechanics of Materials (494 citations), Mechanical Engineering (472 citations) and Polymers and Plastics (101 citations). Yeong K. Kim has collaborated with scholars based in South Korea, United States and China. Frequent co-authors include Scott R. White, Boyoung Lee, Joo-Ho Choi, Insu Park, Sang-Yul Lee, Jae-Seong Kim, Gang Jin and Jae Hyuk Lim. Their work appears in journals such as Polymer Engineering and Science, Microelectronics Reliability and Journal of Reinforced Plastics and Composites.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.