Ya‐Chin King

4.4k total citations
230 papers, 3.3k citations indexed

About

Ya‐Chin King is a scholar working on Electrical and Electronic Engineering, Materials Chemistry and Computer Networks and Communications. According to data from OpenAlex, Ya‐Chin King has authored 230 papers receiving a total of 3.3k indexed citations (citations by other indexed papers that have themselves been cited), including 224 papers in Electrical and Electronic Engineering, 20 papers in Materials Chemistry and 18 papers in Computer Networks and Communications. Recurrent topics in Ya‐Chin King's work include Semiconductor materials and devices (148 papers), Advanced Memory and Neural Computing (106 papers) and Advancements in Semiconductor Devices and Circuit Design (71 papers). Ya‐Chin King is often cited by papers focused on Semiconductor materials and devices (148 papers), Advanced Memory and Neural Computing (106 papers) and Advancements in Semiconductor Devices and Circuit Design (71 papers). Ya‐Chin King collaborates with scholars based in Taiwan, United States and Italy. Ya‐Chin King's co-authors include Meng‐Fan Chang, Chrong Jung Lin, Chrong-Jung Lin, Tsu‐Jae King, Chenming Hu, Chorng-Jung Lin, Wen‐Jen Chiang, Yi-Kuen Lee, Yu-Der Chih and Wei-Hao Chen and has published in prestigious journals such as SHILAP Revista de lepidopterología, Applied Physics Letters and Advanced Functional Materials.

In The Last Decade

Ya‐Chin King

212 papers receiving 3.2k citations

Peers

Ya‐Chin King
Paolo Pavan Italy
Lan Wei Canada
Jaydeep P. Kulkarni United States
Kai Ni United States
E. Nowak France
P. Olivo Italy
G. Torelli Italy
Liang Fang China
Sumeet Kumar Gupta United States
Ken Takeuchi Japan
Paolo Pavan Italy
Ya‐Chin King
Citations per year, relative to Ya‐Chin King Ya‐Chin King (= 1×) peers Paolo Pavan

Countries citing papers authored by Ya‐Chin King

Since Specialization
Citations

This map shows the geographic impact of Ya‐Chin King's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Ya‐Chin King with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Ya‐Chin King more than expected).

Fields of papers citing papers by Ya‐Chin King

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Ya‐Chin King. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Ya‐Chin King. The network helps show where Ya‐Chin King may publish in the future.

Co-authorship network of co-authors of Ya‐Chin King

This figure shows the co-authorship network connecting the top 25 collaborators of Ya‐Chin King. A scholar is included among the top collaborators of Ya‐Chin King based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Ya‐Chin King. Ya‐Chin King is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Wang, Yuxiao, et al.. (2024). A New High Density 3D Stackable Via RRAM for Computing-in-Memory SOC Applications. IEEE Transactions on Electron Devices. 71(4). 2399–2403. 1 indexed citations
2.
Wang, Liyu, Perng-Fei Yuh, Yuxiao Wang, et al.. (2024). A New Ultra-Low Voltage Metal Fuse for High Density OTP Applications. 1–2.
3.
Lin, Burn J., et al.. (2024). On-Wafer FinFET-Based 3-D E-Beam Detector Cube for In Situ Monitoring of Advanced Lithography Processes Beyond 5 nm. IEEE Transactions on Electron Devices. 71(6). 3739–3745.
4.
5.
Hsieh, Yu‐Cheng, et al.. (2024). High-density via RRAM cell with multi-level setting by current compliance circuits. SHILAP Revista de lepidopterología. 19(1). 54–54. 2 indexed citations
6.
Wang, Yuxiao, et al.. (2024). CMOS-Compatible Embedded Artificial Synaptic Device (eASD) for Neuromorphic Computing and AI Applications. IEEE Transactions on Electron Devices. 71(2). 1313–1319. 4 indexed citations
7.
Shih, Jiaw‐Ren, et al.. (2023). Multilevel Fully Logic-Compatible Latch Array for Computing-in-Memory. IEEE Transactions on Electron Devices. 70(4). 2001–2008.
8.
Lin, Burn J., et al.. (2023). 4K Detectors Array for On-Wafer EUV Imaging in Lithography Control Beyond 5-nm Node. IEEE Transactions on Electron Devices. 70(11). 5713–5719.
9.
King, Ya‐Chin, et al.. (2023). Offset-Via Anti-fuse by Cu BEOL Process in Advanced CMOS Technologies. 1–2. 1 indexed citations
10.
11.
Yang, Kai, et al.. (2021). Evaluation of stability and robustness of poly-Si resistors with different dopant concentrations. Japanese Journal of Applied Physics. 61(SC). SC1060–SC1060. 2 indexed citations
12.
King, Ya‐Chin, et al.. (2021). Design and optimization of multiple-time programmable memory cell by advanced CMOS FinFET technologies. Japanese Journal of Applied Physics. 60(SB). SBBB04–SBBB04. 1 indexed citations
13.
Shih, Jiaw‐Ren, et al.. (2021). An Early Detection Circuit for Endurance Enhancement of Backfilled Contact Resistive Random Access Memory Array. Nanoscale Research Letters. 16(1). 114–114. 3 indexed citations
14.
Lin, Chrong Jung, et al.. (2020). Self-Clamping Programming in Narrow-Bridge Floating Gate Cells for Multi-Level Logic Non-Volatile Memory Applications. IEEE Journal of the Electron Devices Society. 8. 681–685.
15.
Lin, Chrong-Jung, et al.. (2020). Test Pattern Design for Plasma Induced Damage on Inter-Metal Dielectric in FinFET Cu BEOL Processes. Nanoscale Research Letters. 15(1). 96–96. 3 indexed citations
16.
Lin, Yu-De, S. S. Sheu, Tuo‐Hung Hou, et al.. (2019). 3D Scalable, Wake-up Free, and Highly Reliable FRAM Technology with Stress-Engineered HfZrO x. IEEE Conference Proceedings. 2019. 1–15. 1 indexed citations
17.
Lin, Chrong Jung, et al.. (2016). 1-kb FinFET Dielectric Resistive Random Access Memory Array in $1\times $ nm CMOS Logic Technology for Embedded Nonvolatile Memory Applications. IEEE Transactions on Electron Devices. 63(11). 4273–4278. 4 indexed citations
18.
Hsu, Tzu‐Hsuan, Hang-Ting Lue, Erh-Kun Lai, et al.. (2007). A High-Speed BE-SONOS NAND Flash Utilizing the Field-Enhancement Effect of FinFET. 913–916. 34 indexed citations
19.
King, Ya‐Chin, et al.. (2004). A four transistor CMOS active pixel sensor with high dynamic range operation. 124–127. 7 indexed citations
20.
King, Ya‐Chin. (1999). Thin dielectric technology and memory devices. PhDT. 6 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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