Y. S. Chan

526 total citations
12 papers, 441 citations indexed

About

Y. S. Chan is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Automotive Engineering. According to data from OpenAlex, Y. S. Chan has authored 12 papers receiving a total of 441 indexed citations (citations by other indexed papers that have themselves been cited), including 9 papers in Electrical and Electronic Engineering, 5 papers in Mechanical Engineering and 2 papers in Automotive Engineering. Recurrent topics in Y. S. Chan's work include Electronic Packaging and Soldering Technologies (8 papers), 3D IC and TSV technologies (6 papers) and Aluminum Alloy Microstructure Properties (2 papers). Y. S. Chan is often cited by papers focused on Electronic Packaging and Soldering Technologies (8 papers), 3D IC and TSV technologies (6 papers) and Aluminum Alloy Microstructure Properties (2 papers). Y. S. Chan collaborates with scholars based in Hong Kong, China and Taiwan. Y. S. Chan's co-authors include C. T. Chan, S. W. Ricky Lee, John H. Lau, Yaning Wang, Rongjun Zhang, Binhang Yan, Jeffery C. C. Lo, Kaida Xiao, Sang Liu and Lifeng Fu and has published in prestigious journals such as Physical Review Letters, Chemical Engineering Journal and Key engineering materials.

In The Last Decade

Y. S. Chan

12 papers receiving 413 citations

Peers

Y. S. Chan

AMPO

EEE

EOMM

Alexandra Ledermann Germany

K. Inoshita Japan

Parisa Andalib United States

Caixing Hu China

Weijie Kong China

A. Takayama Japan

Sabine Essig Germany

Yonggang Wu China

Jung Ho Park South Korea

Kh. S. Singh India

Alexandra Ledermann Germany

Y. S. Chan

244 ×0.8

AMPO

123 ×0.6

EEE

134 ×1.4

89 ×0.9

EOMM

270 ×3.3

Citations per year, relative to Y. S. Chan Y. S. Chan (= 1×) peers Alexandra Ledermann

Countries citing papers authored by Y. S. Chan

Since Specialization

Citations

This map shows the geographic impact of Y. S. Chan's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Y. S. Chan with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Y. S. Chan more than expected).

Fields of papers citing papers by Y. S. Chan

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Y. S. Chan. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Y. S. Chan. The network helps show where Y. S. Chan may publish in the future.

Co-authorship network of co-authors of Y. S. Chan

This figure shows the co-authorship network connecting the top 25 collaborators of Y. S. Chan. A scholar is included among the top collaborators of Y. S. Chan based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Y. S. Chan. Y. S. Chan is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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12 of 12 papers shown

Wang, Yaning, Y. S. Chan, Rongjun Zhang, & Binhang Yan. (2023). Insights into the contribution of oxygen vacancies on CO2 activation for dry reforming of methane over ceria-based solid solutions. Chemical Engineering Journal. 481. 148360–148360. 33 indexed citations

Chan, Y. S., et al.. (2010). Predictive modeling and experimental validation of lead-free solder joint reliability under temperature cycling. Rare & Special e-Zone (The Hong Kong University of Science and Technology). 1–8. 2 indexed citations

Lau, John H., et al.. (2010). 3D IC Integration with TSV Interposers for High Performance Applications. Rare & Special e-Zone (The Hong Kong University of Science and Technology). 14(5). 26. 22 indexed citations

Lau, John H., Y. S. Chan, & S. W. Ricky Lee. (2010). Thermal-Enhanced and Cost-Effective 3D IC Integration With TSV (Through-Silicon Via) Interposers for High-Performance Applications. Rare & Special e-Zone (The Hong Kong University of Science and Technology). 137–144. 12 indexed citations

Chan, Y. S. & S. W. Ricky Lee. (2010). Detailed investigation on the creep damage accumulation of lead-free solder joints under accelerated temperature cycling. Rare & Special e-Zone (The Hong Kong University of Science and Technology). 1–6. 8 indexed citations

Chan, Y. S., S. W. Ricky Lee, Fang Song, Jeffery C. C. Lo, & Tong Jiang. (2009). Effect of UBM and BCB layers on the thermo-mechanical reliability of wafer level chip scale package (WLCSP). Rare & Special e-Zone (The Hong Kong University of Science and Technology). 407–410. 4 indexed citations

Lee, S. W. Ricky, et al.. (2009). Process development and prototyping for the assembly of LED arrays on flexible printed circuit tape for general solid state lighting. Rare & Special e-Zone (The Hong Kong University of Science and Technology). 2137–2142. 2 indexed citations

Xiao, Kaida, et al.. (2008). Use of Air Beam for In-Process Optical Measurement in Precision Machining. Key engineering materials. 381-382. 183–186. 8 indexed citations

Chan, Y. S., et al.. (2007). Development of 2D Modeling Techniques for the Thermal Fatigue Analysis of Solder Joints of a Module Mounted in a 3D Cavity on a Printed Circuit Board. Rare & Special e-Zone (The Hong Kong University of Science and Technology). 1–6. 1 indexed citations

10.

Chan, Y. S. & S. W. Ricky Lee. (2006). Thermal Resistance Analysis of a Multi-Stack Flip Chip 3-D Package. Rare & Special e-Zone (The Hong Kong University of Science and Technology). 1–5. 2 indexed citations

11.

Chan, Y. S., et al.. (2006). Experimental Testing and Failure Prediction of PBGA Package Assemblies under 3-Point Bending Condition through Computational Stress Analysis. Rare & Special e-Zone (The Hong Kong University of Science and Technology). 1–7. 13 indexed citations

12.

Chan, Y. S., et al.. (1998). Photonic Band Gaps in Two Dimensional Photonic Quasicrystals. Physical Review Letters. 80(5). 956–959. 334 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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