Wei Mu

730 total citations
56 papers, 489 citations indexed

About

Wei Mu is a scholar working on Electrical and Electronic Engineering, Materials Chemistry and Mechanical Engineering. According to data from OpenAlex, Wei Mu has authored 56 papers receiving a total of 489 indexed citations (citations by other indexed papers that have themselves been cited), including 37 papers in Electrical and Electronic Engineering, 14 papers in Materials Chemistry and 13 papers in Mechanical Engineering. Recurrent topics in Wei Mu's work include Silicon Carbide Semiconductor Technologies (15 papers), Carbon Nanotubes in Composites (7 papers) and 3D IC and TSV technologies (6 papers). Wei Mu is often cited by papers focused on Silicon Carbide Semiconductor Technologies (15 papers), Carbon Nanotubes in Composites (7 papers) and 3D IC and TSV technologies (6 papers). Wei Mu collaborates with scholars based in China, United Kingdom and Sweden. Wei Mu's co-authors include Dahuan Liu, Zhe Chen, Chongli Zhong, Johan Liu, Laili Wang, Yifeng Fu, Kjell Jeppson, Qingyuan Yang, Michael Edwards and Binyu Wang and has published in prestigious journals such as Acta Materialia, Chemical Engineering Journal and IEEE Transactions on Industrial Electronics.

In The Last Decade

Wei Mu

48 papers receiving 477 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name	h						Papers	Cites
Wei Mu China	14	288	183	123	85	58	56	489
Hongmin Liu China	16	493 1.7×	424 2.3×	140 1.1×	49 0.6×	69 1.2×	38	819
Alexander G. Squires United Kingdom	11	303 1.1×	166 0.9×	33 0.3×	40 0.5×	46 0.8×	28	430
Ji Jun Zhao China	7	131 0.5×	351 1.9×	98 0.8×	16 0.2×	110 1.9×	8	513
Md. Moniruzzaman Bangladesh	14	286 1.0×	182 1.0×	143 1.2×	15 0.2×	112 1.9×	48	583
Zirui Wang China	8	64 0.2×	152 0.8×	79 0.6×	53 0.6×	112 1.9×	20	327
Atsushi Kondô Japan	13	166 0.6×	97 0.5×	92 0.7×	30 0.4×	45 0.8×	48	461
Wenna Zhang China	12	274 1.0×	81 0.4×	39 0.3×	25 0.3×	26 0.4×	35	392
Yipeng Su China	17	881 3.1×	156 0.9×	68 0.6×	26 0.3×	37 0.6×	40	961
Reinhard A. Simon Germany	8	89 0.3×	201 1.1×	209 1.7×	25 0.3×	30 0.5×	14	435
Kyung Jun Kim South Korea	11	176 0.6×	110 0.6×	60 0.5×	24 0.3×	31 0.5×	44	419

Countries citing papers authored by Wei Mu

Since Specialization

Citations

This map shows the geographic impact of Wei Mu's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Wei Mu with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Wei Mu more than expected).

Fields of papers citing papers by Wei Mu

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Wei Mu. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Wei Mu. The network helps show where Wei Mu may publish in the future.

Co-authorship network of co-authors of Wei Mu

This figure shows the co-authorship network connecting the top 25 collaborators of Wei Mu. A scholar is included among the top collaborators of Wei Mu based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Wei Mu. Wei Mu is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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20 of 20 papers shown

Zhang, Jinfeng, Junwen Zhang, Weiwei Lü, et al.. (2025). Design of High Light-load Efficiency Two Stage Bidirectional 800V-14V Converter. IEEE Transactions on Industry Applications. 62(1). 1724–1735.

Mu, Wei, Laili Wang, Borong Hu, et al.. (2025). Near Junction Integration of Vapor Chamber for Transient Thermal Performance Improvements of SiC Power Module. IEEE Open Journal of Power Electronics. 6. 286–299.

Mu, Wei, et al.. (2024). Liquid Metal Fluidic Connection and Floating Die Structure for Ultralow Thermomechanical Stress of SiC Power Electronics Packaging. IEEE Transactions on Power Electronics. 39(7). 7808–7814. 7 indexed citations

Mu, Wei, et al.. (2024). Grid Impedance Estimation and Decoupling through a Series–Parallel Direct-Injection Soft Open Point. 4975–4979. 1 indexed citations

Wang, Liang, Borong Hu, Wei Mu, et al.. (2024). Forced Fluorinated Liquid Cooling for Medium Voltage SiC Power Modules: Concurrently Addressing Electrical and Thermal Challenges. IEEE Transactions on Power Electronics. 39(12). 15622–15634. 2 indexed citations

Wang, Liang, Teng Long, Borong Hu, et al.. (2024). A Review of Partial Discharge in Medium Voltage SiC Power Modules Under Square Wave Excitation: Characterization, Mitigation, and Detection. IEEE Journal of Emerging and Selected Topics in Power Electronics. 12(4). 3588–3606. 4 indexed citations

Mu, Wei, et al.. (2024). Substrate Embedded Power Electronics Packaging for Silicon Carbide mosfets. IEEE Transactions on Power Electronics. 39(8). 9614–9628. 4 indexed citations

Jiang, Yunlei, et al.. (2024). A Passive Self Damping Busbar to Reduce DC-link Ringing. 4819–4824.

Mu, Wei, et al.. (2024). A 3-D GaN-Based PoL Converters Based on the Planar Magnetic Component With Distributed Air Gap and High Thermal Conductivity. IEEE Journal of Emerging and Selected Topics in Power Electronics. 13(1). 880–891.

10.

Mu, Wei, et al.. (2024). Differential Detection of Feeder and Mesh Impedances Through a Series–Parallel Direct-Injection Soft Open Point. IEEE Transactions on Power Electronics. 40(1). 1964–1973. 3 indexed citations

11.

Liu, Teng, et al.. (2023). High-Reliability Rotor Position Detection Method for Sensorless Control of Synchronous Condenser. World Electric Vehicle Journal. 14(10). 299–299.

12.

Wang, Laili, et al.. (2021). An Ultrahigh Step-Down DC–DC Converter Based on Switched-Capacitor and Coupled Inductor Techniques. IEEE Transactions on Industrial Electronics. 69(11). 11221–11230. 25 indexed citations

13.

Mu, Wei, et al.. (2021). Symmetric Four-Phase Inverse Coupled Inductors for GaN-Based Interleaving Four-Phase Point-of-load Converters. 5453–5458. 2 indexed citations

14.

Mu, Wei, Michael Edwards, Davide Mencarelli, et al.. (2016). Vertically aligned CNT-Cu nano-composite material for stacked through-silicon-via interconnects. Nanotechnology. 27(33). 335705–335705. 40 indexed citations

15.

Wang, Shanming, et al.. (2012). Simulation and Recognition for Rotary Rectifier Fault of Multi-Phase Brushless Excitation System. Diangong Jishu Xuebao. 27(4). 138–144. 3 indexed citations

16.

Mu, Wei, et al.. (2012). Dissipating heat from hot spot using a new nano thermal interface material. Chalmers Research (Chalmers University of Technology). 38. 171–176. 1 indexed citations

17.

Mu, Wei, et al.. (2010). Study on Properties of PP/Nano-ATH Composite. China Plastics Industry. 38(7). 72–74. 1 indexed citations

18.

Mu, Wei, et al.. (2010). Diffusion Rates of Gas Molecules Adsorbed in Metal-Organic Frameworks. Acta Physico-Chimica Sinica. 26(6). 1657–1663. 2 indexed citations

19.

Mu, Wei, Dahuan Liu, Qingyuan Yang, & Chongli Zhong. (2009). Computational study of the effect of organic linkers on natural gas upgrading in metal–organic frameworks. Microporous and Mesoporous Materials. 130(1-3). 76–82. 61 indexed citations

20.

Mu, Wei & Zhe Chen. (2007). A Fast PLL Method for Power Electronic Systems Connected to Distorted Grids. 4. 1702–1707. 4 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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