Wai-Yeung Yip
Impact in
- Hardware and Architecture top 5%
- Physical Unclonable Functions (PUFs) and Hardware Security
- Embedded Systems Design Techniques
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- Chaos-based Image/Signal Encryption
Papers in
-
- 3D IC and TSV technologies 4
- Electromagnetic Compatibility and Noise Suppression 3
- Low-power high-performance VLSI design 3
- Electronic Packaging and Soldering Technologies 2
- Semiconductor materials and devices 2
- Co-authors
- A.J. Elbirt (2 shared papers)Christof Paar (2 shared papers)Ching-Chao Huang (2 shared papers)Tadahiro Kuroda (1 shared paper)Kyung Suk Oh (1 shared paper)W.T. Beyene (1 shared paper)V.K. Tripathi (1 shared paper)
- Journals
- IEEE Transactions on Very Large Scale Integration (VLSI) Systems (1 paper)IEEE Transactions on Components Packaging and Manufacturing Technology Part B (1 paper)Cambridge University Press eBooks (1 paper)Electrical Performance of Electronic Packaging (2 papers)
- Partner nations
- United StatesJapan
In The Last Decade
Wai-Yeung Yip
10 papers receiving 319 citations
Peers
Comparison fields: 5 of 26
- Hardware and Architecture 86
- Computer Vision and Pattern Recognition 235
- Artificial Intelligence 288
- Signal Processing 32
- Computer Networks and Communications 38
Countries citing papers authored by Wai-Yeung Yip
This map shows the geographic impact of Wai-Yeung Yip's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Wai-Yeung Yip with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Wai-Yeung Yip more than expected).
Fields of papers citing papers by Wai-Yeung Yip
This network shows the impact of papers produced by Wai-Yeung Yip. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Wai-Yeung Yip. The network helps show where Wai-Yeung Yip may publish in the future.
Co-authors
The 7 scholars most cited alongside Wai-Yeung Yip, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2001 | 211 | |
| 2 | An FPGA Implementation and Performance Evaluation of the AES Block Cipher Candidate Algorithm Finalists. | 2000 | 117 |
| 3 | 1996 | 33 | |
| 4 | 2002 | 6 | |
| 5 | 2003 | 3 | |
| 6 | RDRAM@ Channel Design with 32-bit 4.8GB/s Memory Modules | 2002 | 3 |
| 7 | 2007 | 3 | |
| 8 | 2021 | 2 | |
| 9 | 2003 | 2 | |
| 10 | 2002 | 1 |
About Wai-Yeung Yip
Wai-Yeung Yip is a scholar working on Electrical and Electronic Engineering, Computer Networks and Communications, Computer Vision and Pattern Recognition, Artificial Intelligence and Hardware and Architecture, having authored 10 papers that have together received 381 indexed citations. Recurring topics across this work include 3D IC and TSV technologies (4 papers), Electromagnetic Compatibility and Noise Suppression (3 papers), Low-power high-performance VLSI design (3 papers), Cryptographic Implementations and Security (2 papers), Electronic Packaging and Soldering Technologies (2 papers), Coding theory and cryptography (2 papers), Semiconductor materials and devices (2 papers) and Chaos-based Image/Signal Encryption (2 papers). The work is most often cited by research in Hardware and Architecture (86 citations), Computer Vision and Pattern Recognition (235 citations), Artificial Intelligence (288 citations), Signal Processing (32 citations) and Computer Networks and Communications (38 citations). Wai-Yeung Yip has collaborated with scholars based in United States and Japan. Frequent co-authors include A.J. Elbirt, Christof Paar, Ching-Chao Huang, Tadahiro Kuroda, Kyung Suk Oh, W.T. Beyene and V.K. Tripathi. Their work appears in journals such as IEEE Transactions on Very Large Scale Integration (VLSI) Systems, IEEE Transactions on Components Packaging and Manufacturing Technology Part B, Cambridge University Press eBooks and Electrical Performance of Electronic Packaging.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.