Tomoo Murakami

431 total citations
13 papers, 307 citations indexed

About

Tomoo Murakami is a scholar working on Electrical and Electronic Engineering, Atomic and Molecular Physics, and Optics and Condensed Matter Physics. According to data from OpenAlex, Tomoo Murakami has authored 13 papers receiving a total of 307 indexed citations (citations by other indexed papers that have themselves been cited), including 8 papers in Electrical and Electronic Engineering, 6 papers in Atomic and Molecular Physics, and Optics and 5 papers in Condensed Matter Physics. Recurrent topics in Tomoo Murakami's work include 3D IC and TSV technologies (6 papers), Physics of Superconductivity and Magnetism (5 papers) and Quantum and electron transport phenomena (5 papers). Tomoo Murakami is often cited by papers focused on 3D IC and TSV technologies (6 papers), Physics of Superconductivity and Magnetism (5 papers) and Quantum and electron transport phenomena (5 papers). Tomoo Murakami collaborates with scholars based in Japan and United States. Tomoo Murakami's co-authors include Eiji Saitoh, Ken‐ichi Uchida, M. Ishida, Akihiro Kirihara, Takashi Kikkawa, Zhiyong Qiu, Masahiko Ishida, Kazuki Ihara, S. Kohmoto and Yuma Iwasaki and has published in prestigious journals such as Applied Physics Letters, Scientific Reports and Journal of Physics Condensed Matter.

In The Last Decade

Tomoo Murakami

11 papers receiving 303 citations

Peers

Tomoo Murakami
X. D. Tao China
Da Lan China
J. Shan Netherlands
Yuzan Xiong United States
Tomoo Murakami
Citations per year, relative to Tomoo Murakami Tomoo Murakami (= 1×) peers Alessandro Sola

Countries citing papers authored by Tomoo Murakami

Since Specialization
Citations

This map shows the geographic impact of Tomoo Murakami's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Tomoo Murakami with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Tomoo Murakami more than expected).

Fields of papers citing papers by Tomoo Murakami

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Tomoo Murakami. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Tomoo Murakami. The network helps show where Tomoo Murakami may publish in the future.

Co-authorship network of co-authors of Tomoo Murakami

This figure shows the co-authorship network connecting the top 25 collaborators of Tomoo Murakami. A scholar is included among the top collaborators of Tomoo Murakami based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Tomoo Murakami. Tomoo Murakami is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

13 of 13 papers shown
1.
Kirihara, Akihiro, Koichi Kondo, Masahiko Ishida, et al.. (2016). Flexible heat-flow sensing sheets based on the longitudinal spin Seebeck effect using one-dimensional spin-current conducting films. Scientific Reports. 6(1). 23114–23114. 57 indexed citations
2.
Iwasaki, Yuma, M. Ishida, Akihiro Kirihara, et al.. (2016). Improvement of Mixing Conductance and Spin-Seebeck Effect at Fe Interface Treatment. MRS Advances. 1(60). 3959–3964. 1 indexed citations
3.
Kikuchi, Daisuke, M. Ishida, Ken‐ichi Uchida, et al.. (2015). Enhancement of spin-Seebeck effect by inserting ultra-thin Fe70Cu30 interlayer. Applied Physics Letters. 106(8). 32 indexed citations
4.
Uchida, Ken‐ichi, M. Ishida, Takashi Kikkawa, et al.. (2014). Longitudinal spin Seebeck effect: from fundamentals to applications. Journal of Physics Condensed Matter. 26(34). 343202–343202. 196 indexed citations
5.
Kirihara, Akihiro, Masahiko Ishida, Ken‐ichi Uchida, et al.. (2014). Spin-Seebeck thermoelectric converter. 1–3. 3 indexed citations
6.
Ohshima, Daisuke, Hideki Sasaki, K. Mori, et al.. (2011). Electrical Design and Techniques for an Embedded High-Pin-Count LSI Chip Package. IEEE Transactions on Components Packaging and Manufacturing Technology. 1(10). 1543–1552.
7.
Sasaki, Hideki, et al.. (2011). Investigation of noise coupling in mixed-signal system-in-packages (SiPs). 194–197.
8.
Yamada, S., et al.. (2010). High-quality ferromagnetic CoFe/Si contacts for Si spin-transistor applications. 40. 1872–1874. 1 indexed citations
9.
Yamamichi, Shintaro, K. Mori, Daisuke Ohshima, et al.. (2009). Chip-level and package-level seamless interconnect technologies for advanced packaging. 1–4. 2 indexed citations
10.
Mori, K., Daisuke Ohshima, Hideki Sasaki, et al.. (2009). A novel ultra-thin package for embedded high-pin-count LSI supported by Cu plate. 1447–1452. 6 indexed citations
11.
Ohshima, Daisuke, Hideki Sasaki, K. Mori, et al.. (2009). Electrical design and demonstration of an embedded high-pin-count LSI chip package. 482–488. 5 indexed citations
12.
Mori, K., et al.. (2008). A Package-on-Package using Coreless Substrate with Excellent Power Integrity -- *. IEICE Technical Report; IEICE Tech. Rep.. 107(425). 87–92. 2 indexed citations
13.
Sasaki, Hideki, et al.. (2008). Signal-to-Noise Ratio Measurements of Sound Source and Speaker System-in-Package (SiP). 1–4. 2 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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