Tie Jun Cui

75.3k citations
1.4k papers · 57.8k indexed · 26 hit papers · h-index 112

Tie Jun Cui

1.3k papers receiving 54.9k citations

Hit Papers

A programmable...39120042026201120182505007501000

Peers

Tie Jun Cui
Comparison fields: 5 of 159
  • Electronic, Optical and Magnetic Materials 37.7k
  • Aerospace Engineering 35.9k
  • Acoustics and Ultrasonics 386
  • Electrical and Electronic Engineering 22.7k
  • Atomic and Molecular Physics, and Optics 11.4k
Replace David R. Smith with:
David R. Smith United States
Andrea Alù United States
Cheng‐Wei Qiu Singapore
Nader Engheta United States
Federico Capasso United States
Willie J. Padilla United States
C. T. Chan Hong Kong
Vladimir M. Shalaev United States
Nikolay I. Zheludev United Kingdom
Costas M. Soukoulis United States
Tie Jun Cui relative to David R. Smith United States David R. Smith's profile →
Citations per field
00.5×1.5×2.4×
David R. Smith · 1×
Citations per year

Countries citing papers authored by Tie Jun Cui

Since Specialization
Citations

This map shows the geographic impact of Tie Jun Cui's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Tie Jun Cui with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Tie Jun Cui more than expected).

Fields of papers citing papers by Tie Jun Cui

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Tie Jun Cui. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Tie Jun Cui. The network helps show where Tie Jun Cui may publish in the future.

Co-authorship network

The 25 scholars most cited alongside Tie Jun Cui, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.

Border = papers with Tie Jun Cui Line = papers co-authored together Tie Jun Cui links everyone, so they are left out of the graph.

All Works

20 of 20 papers shown
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About Tie Jun Cui

Tie Jun Cui is a scholar working on Electronic, Optical and Magnetic Materials, Aerospace Engineering and Atomic and Molecular Physics, and Optics, having authored 1.4k papers that have together received 57.8k indexed citations. Recurring topics across this work include Metamaterials and Metasurfaces Applications (840 papers), Advanced Antenna and Metasurface Technologies (649 papers), Antenna Design and Analysis (551 papers), Plasmonic and Surface Plasmon Research (239 papers), Microwave Engineering and Waveguides (134 papers), Electromagnetic Scattering and Analysis (118 papers), Photonic and Optical Devices (110 papers) and Photonic Crystals and Applications (109 papers). The work is most often cited by research in Electronic, Optical and Magnetic Materials (37.7k citations), Aerospace Engineering (35.9k citations) and Acoustics and Ultrasonics (386 citations). Tie Jun Cui has collaborated with scholars based in China, United States and Singapore. Frequent co-authors include Qiang Cheng, Hui Feng, Xiang Wan, Wei Jiang, Shuo Liu, Jie Zhao, Lei Zhang, Mei Qing Qi, Qian Ma and Hao Chi Zhang. Their work appears in journals such as IEEE Transactions on Antennas and Propagation, Advanced Optical Materials, Applied Physics Letters, Scientific Reports and Optics Express.

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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