Tianming Ni

1.8k total citations
109 papers, 1.3k citations indexed

About

Tianming Ni is a scholar working on Electrical and Electronic Engineering, Hardware and Architecture and Artificial Intelligence. According to data from OpenAlex, Tianming Ni has authored 109 papers receiving a total of 1.3k indexed citations (citations by other indexed papers that have themselves been cited), including 94 papers in Electrical and Electronic Engineering, 47 papers in Hardware and Architecture and 9 papers in Artificial Intelligence. Recurrent topics in Tianming Ni's work include Radiation Effects in Electronics (43 papers), Semiconductor materials and devices (33 papers) and VLSI and Analog Circuit Testing (28 papers). Tianming Ni is often cited by papers focused on Radiation Effects in Electronics (43 papers), Semiconductor materials and devices (33 papers) and VLSI and Analog Circuit Testing (28 papers). Tianming Ni collaborates with scholars based in China, Japan and France. Tianming Ni's co-authors include Zhengfeng Huang, Aibin Yan, Xiaoqing Wen, Huaguo Liang, Patrick Girard, Jie Cui, Qi Xu, Hao Chang, Dongsheng Liu and Zhili Chen and has published in prestigious journals such as Journal of Cleaner Production, Energy Conversion and Management and IEEE Access.

In The Last Decade

Tianming Ni

94 papers receiving 1.3k citations

Peers

Tianming Ni

EEE

CNC

Aibin Yan China

Yinan Li China

Huaguo Liang China

Xuecheng Zou China

Arnab Raha United States

Marcian Cirstea United Kingdom

Arun Subramaniyan United States

Tommaso Addabbo Italy

Qiang Zhu China

Mark Zwoliński United Kingdom

Aibin Yan China

Tianming Ni

1.5k ×1.7

EEE

616 ×1.9

152 ×1.1

189 ×1.4

CNC

72 ×0.6

Citations per year, relative to Tianming Ni Tianming Ni (= 1×) peers Aibin Yan

Countries citing papers authored by Tianming Ni

Since Specialization

Citations

This map shows the geographic impact of Tianming Ni's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Tianming Ni with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Tianming Ni more than expected).

Fields of papers citing papers by Tianming Ni

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Tianming Ni. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Tianming Ni. The network helps show where Tianming Ni may publish in the future.

Co-authorship network of co-authors of Tianming Ni

This figure shows the co-authorship network connecting the top 25 collaborators of Tianming Ni. A scholar is included among the top collaborators of Tianming Ni based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Tianming Ni. Tianming Ni is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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20 of 20 papers shown

Ni, Tianming, et al.. (2025). Segmentation-Enhanced Overlapped Defect Identification for Multipatterns Wafer Maps. IEEE Transactions on Instrumentation and Measurement. 74. 1–11.

Yan, Aibin, Chao Zhou, Tianming Ni, et al.. (2025). Cost-Optimized and Highly Robust Latches Providing Complete Quadruple-Node-Upset Tolerance and Recovery With Algorithm-Based Verifications. IEEE Transactions on Aerospace and Electronic Systems. 61(3). 6202–6216. 3 indexed citations

Yan, Aibin, et al.. (2025). Nonvolatile Double- and Triple-Node-Upset Tolerant Latch Designs Based on FeFET and CMOS. IEEE Transactions on Aerospace and Electronic Systems. 61(6). 16981–16992.

Liang, Huaguo, et al.. (2024). A cost-effective and highly robust triple-node-upset self-recoverable latch design based on dual-output C-elements. Microelectronics Journal. 153. 106422–106422.

Yan, Aibin, Zhengfeng Huang, Jie Cui, et al.. (2024). Cost Efficient Flip-Flop Designs With Multiple-Node Upset-Tolerance and Algorithm-Based Verifications. IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems. 44(1). 390–394. 1 indexed citations

Yan, Aibin, Zhixing Li, Jin Zhang, et al.. (2024). MURLAV: A Multiple-Node-Upset Recovery Latch and Algorithm-Based Verification Method. IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems. 43(7). 2205–2214. 39 indexed citations

Ni, Tianming, et al.. (2023). Performance analysis on the liquid cooling plate with the new Tesla valve capillary channel based on the fluid solid coupling simulation. Applied Thermal Engineering. 232. 120977–120977. 21 indexed citations

Huang, Zhengfeng, et al.. (2023). Overhead Optimized and Quadruple-Node-Upset Self-Recoverable Latch Design Based on Looped C-Element Matrix. IEEE Transactions on Aerospace and Electronic Systems. 59(6). 9357–9367. 2 indexed citations

Ni, Tianming, et al.. (2023). Design of True Random Number Generator Based on Multi-Ring Convergence Oscillator Using Short Pulse Enhanced Randomness. IEEE Transactions on Circuits and Systems I Regular Papers. 70(12). 5074–5085. 11 indexed citations

10.

Yan, Aibin, Litao Wang, Jie Cui, et al.. (2023). Nonvolatile Latch Designs With Node-Upset Tolerance and Recovery Using Magnetic Tunnel Junctions and CMOS. IEEE Transactions on Very Large Scale Integration (VLSI) Systems. 32(1). 116–127. 36 indexed citations

11.

Yan, Aibin, Zhengfeng Huang, Jie Cui, et al.. (2023). Two Double-Node-Upset-Hardened Flip-Flop Designs for High-Performance Applications. IEEE Transactions on Emerging Topics in Computing. 11(4). 1070–1081. 40 indexed citations

12.

Yan, Aibin, Runqi Liu, Jie Cui, et al.. (2023). Designs of BCD Adder Based on Excess-3 Code in Quantum-Dot Cellular Automata. IEEE Transactions on Circuits & Systems II Express Briefs. 70(6). 2256–2260. 29 indexed citations

13.

Ni, Tianming, et al.. (2023). Memristor-Based D-Flip-Flop Design and Application in Built-In Self-Test. Electronics. 12(14). 3019–3019. 3 indexed citations

14.

Huang, Zhengfeng, et al.. (2022). A Soft-Error-Immune Quadruple-Node-Upset Tolerant Latch. IEEE Transactions on Aerospace and Electronic Systems. 59(3). 2621–2632. 14 indexed citations

15.

Ni, Tianming, et al.. (2022). Broadcast-TDMA: A Cost-Effective Fault-Tolerance Method for TSV Lifetime Reliability Enhancement. IEEE Design and Test. 39(5). 34–42. 4 indexed citations

16.

Yan, Aibin, Zhixing Li, Jie Cui, et al.. (2022). LDAVPM: A Latch Design and Algorithm-Based Verification Protected Against Multiple-Node-Upsets in Harsh Radiation Environments. IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems. 42(6). 2069–2073. 31 indexed citations

17.

Xu, Qi, Hao Geng, Tianming Ni, et al.. (2021). Fortune: A New Fault-Tolerance TSV Configuration in Router-Based Redundancy Structure. IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems. 41(10). 3182–3187. 3 indexed citations

18.

Ni, Tianming, Qi Xu, Zhengfeng Huang, et al.. (2020). A Cost-Effective TSV Repair Architecture for Clustered Faults in 3-D IC. IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems. 40(9). 1952–1956. 36 indexed citations

19.

Yan, Aibin, Jie Cui, Zhili Chen, et al.. (2020). Novel Quadruple-Node-Upset-Tolerant Latch Designs With Optimized Overhead for Reliable Computing in Harsh Radiation Environments. IEEE Transactions on Emerging Topics in Computing. 10(1). 404–413. 65 indexed citations

20.

Ni, Tianming, Yao Yao, Hao Chang, et al.. (2019). LCHR-TSV: Novel Low Cost and Highly Repairable Honeycomb-Based TSV Redundancy Architecture for Clustered Faults. IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems. 39(10). 2938–2951. 59 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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