Tianming Ni
- Hardware and Architecture top 2%
- VLSI and Analog Circuit Testing 28
- Physical Unclonable Functions (PUFs) and Hardware Security 22
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- Radiation Effects in Electronics 43
- Semiconductor materials and devices 33
- Integrated Circuits and Semiconductor Failure Analysis 27
- Low-power high-performance VLSI design 21
- 3D IC and TSV technologies 18
- Advanced Memory and Neural Computing 14
- Automotive Engineering top 10%
In The Last Decade
Tianming Ni
94 papers receiving 1.3k citations
Peers
Comparison fields: 5 of 87
- Hardware and Architecture 322
- Electrical and Electronic Engineering 873
- Computer Networks and Communications 135
- Computational Theory and Mathematics 94
- Automotive Engineering 69
Countries citing papers authored by Tianming Ni
This map shows the geographic impact of Tianming Ni's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Tianming Ni with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Tianming Ni more than expected).
Fields of papers citing papers by Tianming Ni
This network shows the impact of papers produced by Tianming Ni. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Tianming Ni. The network helps show where Tianming Ni may publish in the future.
Co-authorship network
The 25 scholars most cited alongside Tianming Ni, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2025 | 0 | |
| 2 | 2025 | 3 | |
| 3 | 2025 | 0 | |
| 4 | 2024 | 0 | |
| 5 | 2024 | 1 | |
| 6 | 2024 | 39 | |
| 7 | 2023 | 21 | |
| 8 | 2023 | 2 | |
| 9 | 2023 | 11 | |
| 10 | 2023 | 36 | |
| 11 | 2023 | 40 | |
| 12 | 2023 | 29 | |
| 13 | 2023 | 3 | |
| 14 | 2022 | 14 | |
| 15 | 2022 | 4 | |
| 16 | 2022 | 31 | |
| 17 | 2021 | 3 | |
| 18 | 2020 | 36 | |
| 19 | 2020 | 65 | |
| 20 | 2019 | 59 |
About Tianming Ni
Tianming Ni is a scholar working on Hardware and Architecture, Electrical and Electronic Engineering and Automotive Engineering, having authored 109 papers that have together received 1.3k indexed citations. Recurring topics across this work include Radiation Effects in Electronics (43 papers), Semiconductor materials and devices (33 papers), VLSI and Analog Circuit Testing (28 papers), Integrated Circuits and Semiconductor Failure Analysis (27 papers), Physical Unclonable Functions (PUFs) and Hardware Security (22 papers), Low-power high-performance VLSI design (21 papers), 3D IC and TSV technologies (18 papers) and Advanced Memory and Neural Computing (14 papers). The work is most often cited by research in Hardware and Architecture (322 citations), Electrical and Electronic Engineering (873 citations) and Computer Networks and Communications (135 citations). Tianming Ni has collaborated with scholars based in China, Japan and France. Frequent co-authors include Zhengfeng Huang, Aibin Yan, Xiaoqing Wen, Huaguo Liang, Patrick Girard, Jie Cui, Qi Xu, Hao Chang, Dongsheng Liu and Zhili Chen.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.