T. Tilford
Impact in
- Automotive Engineering top 10%
- Additive Manufacturing and 3D Printing Technologies
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- Silicon Carbide Semiconductor Technologies
- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- Electromagnetic Compatibility and Noise Suppression
- Nanomaterials and Printing Technologies
Papers in
-
- Electronic Packaging and Soldering Technologies 18
- 3D IC and TSV technologies 12
- Nanomaterials and Printing Technologies 7
- Silicon Carbide Semiconductor Technologies 7
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- Epoxy Resin Curing Processes 12
- Co-authors
- C. Bailey (50 shared papers)Hua Lu (10 shared papers)Stoyan Stoyanov (21 shared papers)C. Mark Johnson (3 shared papers)Marc P. Y. Desmulliez (21 shared papers)Martin Corfield (1 shared paper)S. C. Hogg (1 shared paper)Kevin Parrott (3 shared papers)
- Journals
- IEEE Transactions on Components Packaging and Manufacturing Technology (4 papers)IEEE Access (2 papers)International Journal of Numerical Methods for Heat & Fluid Flow (2 papers)IEEE Transactions on Industrial Electronics (1 paper)IEEE Transactions on Microwave Theory and Techniques (1 paper)
- Partner nations
- United KingdomGermanyUnited States
In The Last Decade
T. Tilford
55 papers receiving 386 citations
Peers
Comparison fields: 5 of 59
- Automotive Engineering 83
- Electrical and Electronic Engineering 237
- Mechanical Engineering 113
- Polymers and Plastics 32
- Industrial and Manufacturing Engineering 20
Countries citing papers authored by T. Tilford
This map shows the geographic impact of T. Tilford's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by T. Tilford with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites T. Tilford more than expected).
Fields of papers citing papers by T. Tilford
This network shows the impact of papers produced by T. Tilford. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by T. Tilford. The network helps show where T. Tilford may publish in the future.
Co-authors
The 25 scholars most cited alongside T. Tilford, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 61 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2007 | 48 | |
| 2 | 2007 | 42 | |
| 3 | 2018 | 31 | |
| 4 | 2007 | 22 | |
| 5 | 2006 | 21 | |
| 6 | 2007 | 16 | |
| 7 | 2015 | 14 | |
| 8 | 2007 | 13 | |
| 9 | 2021 | 12 | |
| 10 | 2019 | 10 | |
| 11 | 2018 | 9 | |
| 12 | 2024 | 8 | |
| 13 | 2007 | 8 | |
| 14 | 2017 | 8 | |
| 15 | 2016 | 8 | |
| 16 | 2008 | 8 | |
| 17 | 2018 | 8 | |
| 18 | 2018 | 7 | |
| 19 | 2009 | 7 | |
| 20 | 2016 | 7 |
About T. Tilford
T. Tilford is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering, Automotive Engineering, Polymers and Plastics and Organic Chemistry, having authored 61 papers that have together received 404 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (18 papers), Epoxy Resin Curing Processes (12 papers), 3D IC and TSV technologies (12 papers), Additive Manufacturing and 3D Printing Technologies (11 papers), Synthesis and properties of polymers (11 papers), Microwave-Assisted Synthesis and Applications (9 papers), Nanomaterials and Printing Technologies (7 papers) and Silicon Carbide Semiconductor Technologies (7 papers). The work is most often cited by research in Automotive Engineering (83 citations), Electrical and Electronic Engineering (237 citations), Mechanical Engineering (113 citations), Polymers and Plastics (32 citations) and Industrial and Manufacturing Engineering (20 citations). T. Tilford has collaborated with scholars based in United Kingdom, Germany and United States. Frequent co-authors include C. Bailey, Hua Lu, Stoyan Stoyanov, C. Mark Johnson, Marc P. Y. Desmulliez, Martin Corfield, S. C. Hogg, Kevin Parrott, George Goussetis and K. Pericleous. Their work appears in journals such as IEEE Transactions on Components Packaging and Manufacturing Technology, IEEE Access, International Journal of Numerical Methods for Heat & Fluid Flow, IEEE Transactions on Industrial Electronics and IEEE Transactions on Microwave Theory and Techniques.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.