T. Tilford

574 total citations
61 papers, 404 citations indexed

About

T. Tilford is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Automotive Engineering. According to data from OpenAlex, T. Tilford has authored 61 papers receiving a total of 404 indexed citations (citations by other indexed papers that have themselves been cited), including 34 papers in Electrical and Electronic Engineering, 23 papers in Mechanical Engineering and 12 papers in Automotive Engineering. Recurrent topics in T. Tilford's work include Electronic Packaging and Soldering Technologies (18 papers), 3D IC and TSV technologies (12 papers) and Epoxy Resin Curing Processes (12 papers). T. Tilford is often cited by papers focused on Electronic Packaging and Soldering Technologies (18 papers), 3D IC and TSV technologies (12 papers) and Epoxy Resin Curing Processes (12 papers). T. Tilford collaborates with scholars based in United Kingdom, Germany and United States. T. Tilford's co-authors include C. Bailey, Hua Lu, Stoyan Stoyanov, C. Mark Johnson, Marc P. Y. Desmulliez, Martin Corfield, S. C. Hogg, Alan Sangster, K. Pericleous and Kevin Parrott and has published in prestigious journals such as SHILAP Revista de lepidopterología, IEEE Transactions on Industrial Electronics and IEEE Access.

In The Last Decade

T. Tilford

55 papers receiving 386 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name	h						Papers	Cites
T. Tilford United Kingdom	10	237	113	83	45	44	61	404
Junli Li China	11	126 0.5×	297 2.6×	25 0.3×	41 0.9×	142 3.2×	34	444
Ho‐Joon Lee South Korea	13	247 1.0×	114 1.0×	20 0.2×	10 0.2×	57 1.3×	63	480
Yanfang Chen China	11	150 0.6×	62 0.5×	33 0.4×	10 0.2×	66 1.5×	45	343
Jingqin Wang China	12	200 0.8×	280 2.5×	41 0.5×	10 0.2×	14 0.3×	75	520
Anaïs Barasinski France	11	43 0.2×	228 2.0×	62 0.7×	14 0.3×	50 1.1×	43	442
Maciej Woźniak Poland	11	28 0.1×	52 0.5×	100 1.2×	56 1.2×	90 2.0×	36	334
Hongyi Lu China	9	90 0.4×	49 0.4×	11 0.1×	25 0.6×	55 1.3×	38	334
Rui Bai China	14	71 0.3×	176 1.6×	116 1.4×	29 0.6×	104 2.4×	55	685
Hyunjae Park South Korea	11	136 0.6×	65 0.6×	15 0.2×	13 0.3×	74 1.7×	46	422
Xinkai Li China	12	37 0.2×	82 0.7×	15 0.2×	21 0.5×	60 1.4×	40	359

Countries citing papers authored by T. Tilford

Since Specialization

Citations

This map shows the geographic impact of T. Tilford's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by T. Tilford with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites T. Tilford more than expected).

Fields of papers citing papers by T. Tilford

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by T. Tilford. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by T. Tilford. The network helps show where T. Tilford may publish in the future.

Co-authorship network of co-authors of T. Tilford

This figure shows the co-authorship network connecting the top 25 collaborators of T. Tilford. A scholar is included among the top collaborators of T. Tilford based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with T. Tilford. T. Tilford is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

Sort: Min cites: Since: Top N: Style:

20 of 20 papers shown

Stoyanov, Stoyan, A. Razia Sulthana, T. Tilford, et al.. (2025). Modelling the fatigue damage in power components using machine learning technology. ePrints Soton (University of Southampton). 10. 100079–100079.

Yang, Xingyu, Zijian Zhang, Xinhua Li, et al.. (2024). High-speed low-cost line-field spectral-domain optical coherence tomography for industrial applications. Optics and Lasers in Engineering. 184. 108631–108631.

Goodall, Iain C. A., et al.. (2024). Machine Learning to Detect Fungal Infections in Stored Pome Fruits via Mass Spectrometry Data: Industry, Economic, and Social Implications. Journal of Advances in Information Technology. 15(10). 1174–1183.

Sulthana, A. Razia, T. Tilford, & Stoyan Stoyanov. (2024). Fine-grained food image classification and recipe extraction using a customized deep neural network and NLP. Computers in Biology and Medicine. 175. 108528–108528. 8 indexed citations

Zhang, Xiaotian, et al.. (2024). IGBT Module DPT Efficiency Enhancement via Multimodal Fusion Networks and Graph Convolution Networks. IEEE Transactions on Industrial Electronics. 71(11). 13766–13777. 1 indexed citations

Stoyanov, Stoyan, et al.. (2024). Coupled thermal-mechanical analysis of power electronic modules with finite element method and parametric model order reduction. SHILAP Revista de lepidopterología. 8. 100063–100063. 2 indexed citations

Desmulliez, Marc P. Y., et al.. (2018). Reliability Testing and Stress Measurement of QFN Packages Encapsulated by an Open-Ended Microwave Curing System. IEEE Transactions on Components Packaging and Manufacturing Technology. 9(1). 173–180. 7 indexed citations

Tilford, T., et al.. (2018). Design, manufacture and test for reliable 3D printed electronics packaging. Microelectronics Reliability. 85. 109–117. 31 indexed citations

Tilford, T., et al.. (2016). Numerical analysis of droplet deposition in inkjet printed electronics assembly. Greenwich Academic Literature Archive (University of Greenwich). 1–7. 1 indexed citations

10.

Stoyanov, Stoyan, et al.. (2015). Data driven approach to quality assessment of 3D printed electronic products. 300–305. 14 indexed citations

11.

Tilford, T., James E. Morris, Andres Krumme, et al.. (2010). Application of Particle Swarm Optimisation to Evaluation of Polymer Cure Kinetics Models. Journal of Algorithms & Computational Technology. 4(1). 121–146. 3 indexed citations

12.

Rizvi, M.J., et al.. (2009). Modelling of jet-impingement cooling for power electronics. Greenwich Academic Literature Archive (University of Greenwich). 40. 1–5. 3 indexed citations

13.

Tilford, T., et al.. (2009). On the application of variable frequency microwave technology for processing of individual surface mount components. Greenwich Academic Literature Archive (University of Greenwich).

14.

Bailey, C., Hua Lu, Chunyan Yin, & T. Tilford. (2008). Integrated reliability and prognostics prediction methodology for power electronic modules. Greenwich Academic Literature Archive (University of Greenwich). 9–9. 3 indexed citations

15.

Tilford, T., et al.. (2008). Advanced microwave oven for rapid curing of encapsulant. Greenwich Academic Literature Archive (University of Greenwich). 25. 551–556. 4 indexed citations

16.

Tilford, T., Marc P. Y. Desmulliez, George Goussetis, et al.. (2008). Open ended microwave oven for packaging. ArXiv.org. 26. 16–20. 5 indexed citations

17.

Bailey, C., T. Tilford, & Hua Lu. (2007). Reliability Analysis for Power Electronics Modules. Greenwich Academic Literature Archive (University of Greenwich). 50. 12–17. 22 indexed citations

18.

Tilford, T., et al.. (2007). Multiphysics simulation of microwave curing in micro‐electronics packaging applications. Soldering and Surface Mount Technology. 19(3). 26–33. 8 indexed citations

19.

Tilford, T., et al.. (2006). Microwave modeling and validation in food applications. 22(3). 195–204. 2 indexed citations

20.

Tilford, T., et al.. (2006). Microwave Modeling and Validation in Food Thawing Applications. Journal of Microwave Power and Electromagnetic Energy. 41(4). 30–45. 21 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

Explore authors with similar magnitude of impact