Siming Pan
Impact in
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- Electromagnetic Compatibility and Noise Suppression
- 3D IC and TSV technologies
- Electronic Packaging and Soldering Technologies
- Electrostatic Discharge in Electronics
- Electromagnetic Compatibility and Measurements
- Microwave Engineering and Waveguides
Papers in ⓘ
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- Electromagnetic Compatibility and Noise Suppression 21
- 3D IC and TSV technologies 17
- Electronic Packaging and Soldering Technologies 8
- Microwave Engineering and Waveguides 5
- Electrostatic Discharge in Electronics 4
- Microwave and Dielectric Measurement Techniques 4
- Advanced DC-DC Converters 4
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- Advanced Antenna and Metasurface Technologies 5
- Co-authors
- Jun Fan (25 shared papers)Brice Achkir (14 shared papers)Jingook Kim (7 shared papers)James L. Drewniak (5 shared papers)Lei He (2 shared papers)Meichen Liu (1 shared paper)Limei Li (1 shared paper)Hongsheng Liu (1 shared paper)
- Journals
- IEEE Transactions on Electromagnetic Compatibility (5 papers)IEEE Transactions on Communications (2 papers)IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (1 paper)IEEE Transactions on Components Packaging and Manufacturing Technology (1 paper)IEEE Transactions on Antennas and Propagation (1 paper)
- Partner nations
- United StatesChinaSouth Korea
In The Last Decade
Siming Pan
38 papers receiving 437 citations
Peers
Comparison fields: 5 of 55
- Electrical and Electronic Engineering 364
- Hardware and Architecture 20
- Biomaterials 34
- Aerospace Engineering 55
- Biochemistry 13
Countries citing papers authored by Siming Pan
This map shows the geographic impact of Siming Pan's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Siming Pan with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Siming Pan more than expected).
Fields of papers citing papers by Siming Pan
This network shows the impact of papers produced by Siming Pan. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Siming Pan. The network helps show where Siming Pan may publish in the future.
Co-authors
The 25 scholars most cited alongside Siming Pan, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 39 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2017 | 75 | |
| 2 | 2013 | 44 | |
| 3 | 2019 | 32 | |
| 4 | 2011 | 30 | |
| 5 | 2016 | 30 | |
| 6 | 2012 | 28 | |
| 7 | 2010 | 28 | |
| 8 | 2019 | 22 | |
| 9 | 2009 | 15 | |
| 10 | 1985 | 15 | |
| 11 | 2017 | 14 | |
| 12 | 2017 | 12 | |
| 13 | 2013 | 11 | |
| 14 | 2010 | 10 | |
| 15 | 2013 | 9 | |
| 16 | 2014 | 7 | |
| 17 | Innovative PDN Design Guidelines for Practical High Layer-Count PCBs | 2013 | 7 |
| 18 | 2012 | 7 | |
| 19 | 2010 | 7 | |
| 20 | 2009 | 6 |
About Siming Pan
Siming Pan is a scholar working on Electrical and Electronic Engineering, Aerospace Engineering, Computer Networks and Communications, Control and Systems Engineering and Atomic and Molecular Physics, and Optics, having authored 39 papers that have together received 462 indexed citations. Recurring topics across this work include Electromagnetic Compatibility and Noise Suppression (21 papers), 3D IC and TSV technologies (17 papers), Electronic Packaging and Soldering Technologies (8 papers), Advanced Antenna and Metasurface Technologies (5 papers), Microwave Engineering and Waveguides (5 papers), Electrostatic Discharge in Electronics (4 papers), Microwave and Dielectric Measurement Techniques (4 papers) and Advanced DC-DC Converters (4 papers). The work is most often cited by research in Electrical and Electronic Engineering (364 citations), Hardware and Architecture (20 citations), Biomaterials (34 citations), Aerospace Engineering (55 citations) and Biochemistry (13 citations). Siming Pan has collaborated with scholars based in United States, China and South Korea. Frequent co-authors include Jun Fan, Brice Achkir, Jingook Kim, James L. Drewniak, Lei He, Meichen Liu, Limei Li, Hongsheng Liu, Wenwen Zheng and Wei Yao. Their work appears in journals such as IEEE Transactions on Electromagnetic Compatibility, IEEE Transactions on Communications, IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on Components Packaging and Manufacturing Technology and IEEE Transactions on Antennas and Propagation.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.