S. Das Mahapatra

669 total citations · 1 hit paper
8 papers, 516 citations indexed

About

S. Das Mahapatra is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials and Aerospace Engineering. According to data from OpenAlex, S. Das Mahapatra has authored 8 papers receiving a total of 516 indexed citations (citations by other indexed papers that have themselves been cited), including 7 papers in Electrical and Electronic Engineering, 3 papers in Electronic, Optical and Magnetic Materials and 2 papers in Aerospace Engineering. Recurrent topics in S. Das Mahapatra's work include Electronic Packaging and Soldering Technologies (6 papers), Copper Interconnects and Reliability (3 papers) and 3D IC and TSV technologies (3 papers). S. Das Mahapatra is often cited by papers focused on Electronic Packaging and Soldering Technologies (6 papers), Copper Interconnects and Reliability (3 papers) and 3D IC and TSV technologies (3 papers). S. Das Mahapatra collaborates with scholars based in United States, India and United Kingdom. S. Das Mahapatra's co-authors include Graham Christie, Adrianus Indrat Aria, Stephan Hofmann, Yogendra Kumar Mishra, Vijay Kumar Thakur, I. Dutta, Bhaskar Majumdar, Weitao Zheng, N. Fredj and Peigen Zhang and has published in prestigious journals such as Materials Science and Engineering A, Journal of Materials Science and Advanced Science.

In The Last Decade

S. Das Mahapatra

8 papers receiving 503 citations

Hit Papers

align trajectories

What are hit papers?

Hit papers significantly outperform the citation benchmark for their cohort. A paper qualifies if it has ≥500 total citations, achieves ≥1.5× the top-1% citation threshold for papers in the same subfield and year (this is the minimum needed to enter the top 1%, not the average within it), or reaches the top citation threshold in at least one of its specific research topics.

Piezoelectric Materials for Energy Harvesting and Sensing Applications: Roadmap for Future Smart Materials

2021 454 citations S. Das Mahapatra, Adrianus Indrat Aria et al. Advanced Science profile →

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name	h						Papers	Cites
S. Das Mahapatra United States	6	347	170	157	124	113	8	516
Zijian Chen China	14	343 1.0×	135 0.8×	124 0.8×	111 0.9×	78 0.7×	36	522
Libin Zhao China	12	352 1.0×	196 1.2×	134 0.9×	178 1.4×	169 1.5×	43	646
Canlin Ou United Kingdom	13	318 0.9×	184 1.1×	203 1.3×	154 1.2×	251 2.2×	17	632
Ju Lin China	8	435 1.3×	244 1.4×	161 1.0×	111 0.9×	114 1.0×	11	589
Febby Krisnadi United States	7	499 1.4×	200 1.2×	141 0.9×	152 1.2×	97 0.9×	12	631
Likun Yang China	10	172 0.5×	192 1.1×	120 0.8×	132 1.1×	71 0.6×	20	481
Muhammad Wajahat South Korea	13	414 1.2×	232 1.4×	96 0.6×	96 0.8×	127 1.1×	20	585
Guozhen Chen China	9	345 1.0×	166 1.0×	226 1.4×	127 1.0×	101 0.9×	19	563
Hongda Lu Australia	14	525 1.5×	165 1.0×	236 1.5×	172 1.4×	100 0.9×	26	797
Yasmin Mohamed Yousry Singapore	12	389 1.1×	137 0.8×	88 0.6×	162 1.3×	121 1.1×	20	495

Countries citing papers authored by S. Das Mahapatra

Since Specialization

Citations

This map shows the geographic impact of S. Das Mahapatra's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by S. Das Mahapatra with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites S. Das Mahapatra more than expected).

Fields of papers citing papers by S. Das Mahapatra

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by S. Das Mahapatra. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by S. Das Mahapatra. The network helps show where S. Das Mahapatra may publish in the future.

Co-authorship network of co-authors of S. Das Mahapatra

This figure shows the co-authorship network connecting the top 25 collaborators of S. Das Mahapatra. A scholar is included among the top collaborators of S. Das Mahapatra based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with S. Das Mahapatra. S. Das Mahapatra is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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8 of 8 papers shown

1.

Tang, Haifeng, Bingzhen Yan, Peigen Zhang, et al.. (2024). Controlling tin whisker growth via oxygen-mediated decomposition of Ti2SnC. Journal of Materials Science. 59(5). 1958–1967. 9 indexed citations

2.

Mahapatra, S. Das, Adrianus Indrat Aria, Graham Christie, et al.. (2021). Piezoelectric Materials for Energy Harvesting and Sensing Applications: Roadmap for Future Smart Materials. Advanced Science. 8(17). e2100864–e2100864. 454 indexed citations breakdown →

3.

Majumdar, Bhaskar, et al.. (2019). Recent Advances in Mitigation of Whiskers from Electroplated Tin. JOM. 72(2). 906–917. 17 indexed citations

4.

Mahapatra, S. Das & I. Dutta. (2018). Co-electrodeposition of tin with 0.2–20% indium: Implications on tin whisker growth. Surface and Coatings Technology. 337. 478–483. 12 indexed citations

5.

Fredj, N., et al.. (2018). Whisker Mitigation Mechanisms in Indium-Doped Tin Thin Films: Role of the Surface. Journal of Electronic Materials. 47(10). 6229–6240. 5 indexed citations

6.

Mahapatra, S. Das & I. Dutta. (2017). Role of surface oxide in mitigating tin whisker growth: A finite element study. Materials Science and Engineering A. 706. 181–191. 6 indexed citations

7.

Mahapatra, S. Das, Bhaskar Majumdar, & I. Dutta. (2017). Elimination of tin whisker growth by indium addition to electroplated tin in electronic packages. 1425–1432. 3 indexed citations

8.

Mahapatra, S. Das, et al.. (2016). Eliminating Whisker Growth by Indium Addition in Electroplated Sn on Copper Substrate. Journal of Electronic Materials. 46(7). 4062–4075. 10 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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