S. Das Mahapatra
- Biomedical Engineering top 10%
- Electrical and Electronic Engineering
- Mechanical Engineering
- Polymers and Plastics top 10%
- Materials Chemistry
- Co-authors
- Graham ChristieYogendra Kumar MishraVijay Kumar ThakurStephan HofmannAdrianus Indrat AriaI. DuttaBhaskar MajumdarWeitao Zheng
- Topics
- Electronic Packaging and Soldering Technologies (6 papers)Copper Interconnects and Reliability (3 papers)3D IC and TSV technologies (3 papers)
- Partner nations
- United StatesDenmarkIndia
In The Last Decade
S. Das Mahapatra
8 papers receiving 503 citations
Hit Papers
Peers
Comparison fields: 5 of 58
- Biomedical Engineering 347
- Electrical and Electronic Engineering 170
- Mechanical Engineering 157
- Polymers and Plastics 124
- Materials Chemistry 113
Countries citing papers authored by S. Das Mahapatra
This map shows the geographic impact of S. Das Mahapatra's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by S. Das Mahapatra with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites S. Das Mahapatra more than expected).
Fields of papers citing papers by S. Das Mahapatra
This network shows the impact of papers produced by S. Das Mahapatra. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by S. Das Mahapatra. The network helps show where S. Das Mahapatra may publish in the future.
Co-authorship network of co-authors of S. Das Mahapatra
This figure shows the co-authorship network connecting the top 25 collaborators of S. Das Mahapatra. A scholar is included among the top collaborators of S. Das Mahapatra based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with S. Das Mahapatra. S. Das Mahapatra is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 9 | |
| 2 | Piezoelectric Materials for Energy Harvesting and Sensing Applications: Roadmap for Future Smart Materialsbreakdown → | 454 |
| 3 | 17 | |
| 4 | 12 | |
| 5 | 5 | |
| 6 | 6 | |
| 7 | 3 | |
| 8 | 10 |
About S. Das Mahapatra
S. Das Mahapatra is a scholar working on General Materials Science, Electronic, Optical and Magnetic Materials and Electrical and Electronic Engineering, having authored 8 papers that have together received 516 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (6 papers), Copper Interconnects and Reliability (3 papers) and 3D IC and TSV technologies (3 papers). The work is most often cited by research in Polymers and Plastics (124 citations), Biomedical Engineering (347 citations) and Mechanical Engineering (157 citations). S. Das Mahapatra has collaborated with scholars based in United States, Denmark and India. Frequent co-authors include Graham Christie, Yogendra Kumar Mishra, Vijay Kumar Thakur, Stephan Hofmann, Adrianus Indrat Aria, I. Dutta, Bhaskar Majumdar, Weitao Zheng, Peigen Zhang and Zhihua Tian. Their work appears in journals such as Materials Science and Engineering A, Journal of Materials Science and Advanced Science.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.