Ronald E. Pyle

485 total citations
15 papers, 239 citations indexed

About

Ronald E. Pyle is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials and Mechanics of Materials. According to data from OpenAlex, Ronald E. Pyle has authored 15 papers receiving a total of 239 indexed citations (citations by other indexed papers that have themselves been cited), including 9 papers in Electrical and Electronic Engineering, 8 papers in Electronic, Optical and Magnetic Materials and 4 papers in Mechanics of Materials. Recurrent topics in Ronald E. Pyle's work include Semiconductor materials and devices (5 papers), Copper Interconnects and Reliability (4 papers) and Semiconductor materials and interfaces (4 papers). Ronald E. Pyle is often cited by papers focused on Semiconductor materials and devices (5 papers), Copper Interconnects and Reliability (4 papers) and Semiconductor materials and interfaces (4 papers). Ronald E. Pyle collaborates with scholars based in United States. Ronald E. Pyle's co-authors include T. O. Poehler, K. Bechgaard, D. O. COWAN, A. Bloćh, Aaron N. Bloch, Dwaine O. Cowan, H. Kawasaki, R. L. Hance, J. O. Olowolafe and James W. Miller and has published in prestigious journals such as Physical Review Letters, The Journal of Organic Chemistry and IEEE Transactions on Electron Devices.

In The Last Decade

Ronald E. Pyle

15 papers receiving 213 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name	h						Papers	Cites
Ronald E. Pyle United States	7	172	113	65	41	28	15	239
J.‐P. Manceau France	9	127 0.7×	133 1.2×	111 1.7×	17 0.4×	29 1.0×	16	278
H. F. Gossenberger United States	9	38 0.2×	252 2.2×	80 1.2×	77 1.9×	11 0.4×	15	319
A. Likforman France	6	98 0.6×	277 2.5×	321 4.9×	57 1.4×	12 0.4×	14	355
K. Sugihara Japan	10	39 0.2×	114 1.0×	228 3.5×	136 3.3×	10 0.4×	29	320
S. Madhukar United States	10	178 1.0×	165 1.5×	288 4.4×	33 0.8×	6 0.2×	19	371
S. Mtougui Morocco	12	332 1.9×	122 1.1×	269 4.1×	65 1.6×	17 0.6×	25	466
Haizheng Song Japan	13	49 0.3×	272 2.4×	155 2.4×	106 2.6×	10 0.4×	34	368
Yu. A. Kolesnichenko Ukraine	11	96 0.6×	115 1.0×	141 2.2×	242 5.9×	8 0.3×	79	416
Debashish Das India	11	254 1.5×	110 1.0×	206 3.2×	56 1.4×	5 0.2×	24	415
S. Teslic United States	8	149 0.9×	197 1.7×	371 5.7×	17 0.4×	15 0.5×	10	385

Countries citing papers authored by Ronald E. Pyle

Since Specialization

Citations

This map shows the geographic impact of Ronald E. Pyle's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Ronald E. Pyle with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Ronald E. Pyle more than expected).

Fields of papers citing papers by Ronald E. Pyle

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Ronald E. Pyle. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Ronald E. Pyle. The network helps show where Ronald E. Pyle may publish in the future.

Co-authorship network of co-authors of Ronald E. Pyle

This figure shows the co-authorship network connecting the top 25 collaborators of Ronald E. Pyle. A scholar is included among the top collaborators of Ronald E. Pyle based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Ronald E. Pyle. Ronald E. Pyle is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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15 of 15 papers shown

Pyle, Ronald E., et al.. (2003). Failure analysis of titanium nitride/titanium silicide barrier contacts under high current stress. 469–475. 1 indexed citations

Sun, Shih-Wei, et al.. (2003). Ti-thickness dependent electromigration resistance of the Al-Cu-Si/TiN/sub x//TiSi/sub y/ barrier contact system. 92. 439–446. 1 indexed citations

Kawasaki, H., et al.. (1993). <title>Ti-thickness-dependent electromigration resistance for Ti/Al-Cu-Si metallization with and without barrier rapid-thermal-anneal in an ammonia ambient</title>. Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE. 1805. 263–273. 7 indexed citations

Morris, Stephen, et al.. (1993). <title>Imaging gate oxide ruptures</title>. Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE. 1802. 126–133. 5 indexed citations

Miller, James W., et al.. (1993). <title>Investigation into bake-reversible low-level ESD-induced leakage</title>. Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE. 1802. 155–166. 4 indexed citations

Maniar, P.D., Andrew Campbell, Robert Jones, et al.. (1993). Electron Microscopy Study of the Influence of the Adhesion Layer for Pt Electrode on the Microstructure of Sol-Gel Crystallized Pzt. MRS Proceedings. 310. 3 indexed citations

Pyle, Ronald E., et al.. (1988). On the failure mechanisms of titanium nitride/titanium silicide barrier contacts under high current stress. IEEE Transactions on Electron Devices. 35(12). 2151–2159. 10 indexed citations

Hance, R. L., et al.. (1987). A process dependent study of Al/Si/Cu very large scale integration metallization. I. Spectroscopic properties. Journal of Vacuum Science & Technology B Microelectronics Processing and Phenomena. 5(6). 1639–1643. 1 indexed citations

Hance, R. L., et al.. (1987). A measurement of the distribution of argon in sputter- deposited very large scale integration metallization. Thin Solid Films. 153(1-3). 401–408. 4 indexed citations

10.

Pyle, Ronald E., et al.. (1984). Reliability Implications of Nitrogen Contamination During Deposition of Sputtered Aluminum/Silicon Metal Films. Reliability physics. 1–5. 43 indexed citations

11.

Pyle, Ronald E., et al.. (1984). Characterization of Die Attach Failure Modes in Leadless Chip Carrier (LCC) Packages by Auger Electron Spectroscopy. Reliability physics. 175–180. 8 indexed citations

12.

Cowan, Dwaine O., et al.. (1976). Some Comments on the Electrical Conductivity of TTF-TCNQ. Molecular crystals and liquid crystals. 32(1). 237–240. 5 indexed citations

13.

Cowan, Dwaine O., Aaron N. Bloch, T. O. Poehler, et al.. (1976). The Organic Metallic State¹. Molecular crystals and liquid crystals. 32(1). 223–225. 6 indexed citations

14.

Cowan, Dwaine O., et al.. (1975). Chemical purity and the electrical conductivity of tetrathiafulvalinium tetracyanoquinodimethanide. The Journal of Organic Chemistry. 40(24). 3544–3547. 26 indexed citations

15.

Bloćh, A., et al.. (1975). Low-Temperature Metallic Behavior and Resistance Minimum in a New Quasi One-Dimensional Organic Conductor. Physical Review Letters. 34(25). 1561–1564. 115 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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