Peiqi Ge

1.7k total citations
73 papers, 1.5k citations indexed

About

Peiqi Ge is a scholar working on Biomedical Engineering, Mechanical Engineering and Materials Chemistry. According to data from OpenAlex, Peiqi Ge has authored 73 papers receiving a total of 1.5k indexed citations (citations by other indexed papers that have themselves been cited), including 42 papers in Biomedical Engineering, 34 papers in Mechanical Engineering and 27 papers in Materials Chemistry. Recurrent topics in Peiqi Ge's work include Advanced Surface Polishing Techniques (38 papers), Advanced machining processes and optimization (17 papers) and Diamond and Carbon-based Materials Research (14 papers). Peiqi Ge is often cited by papers focused on Advanced Surface Polishing Techniques (38 papers), Advanced machining processes and optimization (17 papers) and Diamond and Carbon-based Materials Research (14 papers). Peiqi Ge collaborates with scholars based in China, Portugal and Hong Kong. Peiqi Ge's co-authors include Wenbo Bi, Yufei Gao, Tengyun Liu, Jingliang Jiang, Dexiang Wang, Yi Yang, Yanjun Lü, Peizhi Wang, Shuangshuang Wu and Ke Yang and has published in prestigious journals such as PLANT PHYSIOLOGY, Acta Materialia and Journal of Agricultural and Food Chemistry.

In The Last Decade

Peiqi Ge

72 papers receiving 1.4k citations

Peers

Peiqi Ge

EEE

Liang Li China

Shaohui Yin China

L.C. Zhang Australia

Biao Zhao China

Yejun Zhu China

Andre Batako United Kingdom

Binghai Lyu China

Yebing Tian China

Jun Zhao China

Ioan D. Marinescu United States

Liang Li China

Peiqi Ge

1.1k ×1.2

698 ×0.8

311 ×0.5

444 ×1.5

EEE

314 ×1.0

Citations per year, relative to Peiqi Ge Peiqi Ge (= 1×) peers Liang Li

Countries citing papers authored by Peiqi Ge

Since Specialization

Citations

This map shows the geographic impact of Peiqi Ge's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Peiqi Ge with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Peiqi Ge more than expected).

Fields of papers citing papers by Peiqi Ge

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Peiqi Ge. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Peiqi Ge. The network helps show where Peiqi Ge may publish in the future.

Co-authorship network of co-authors of Peiqi Ge

This figure shows the co-authorship network connecting the top 25 collaborators of Peiqi Ge. A scholar is included among the top collaborators of Peiqi Ge based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Peiqi Ge. Peiqi Ge is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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20 of 20 papers shown

Sun, Hao, et al.. (2025). A rocking-floating-variable speed feeding mode for slicing single-crystal silicon carbide. International Journal of Mechanical Sciences. 304. 110727–110727. 1 indexed citations

Ge, Peiqi, et al.. (2025). Wheat DNA Methyltransferase TaMET1 Negatively Regulates Salicylic Acid Biosynthesis to Facilitate Powdery Mildew Susceptibility. Journal of Fungi. 11(12). 876–876. 1 indexed citations

Sun, Hao, Wenbo Bi, Mengran Ge, Peizhi Wang, & Peiqi Ge. (2024). Effect of anisotropy on 4H-SiC cracking behavior during diamond wire sawing. Engineering Fracture Mechanics. 309. 110427–110427. 4 indexed citations

Zheng, Jintao, et al.. (2023). Effect of a liquid bridge on the dynamic behavior of diamond wires during slicing. Journal of Manufacturing Processes. 94. 578–591. 3 indexed citations

Zheng, Jintao, et al.. (2021). Action mechanism of liquid bridge between electroplated diamond wires for ultrathin wafer slicing. Solar Energy. 231. 343–354. 16 indexed citations

Li, Zongqiang, et al.. (2021). Influence of silicon anisotropy on surface shape deviation of wafer by diamond wire saw. Materials Science in Semiconductor Processing. 133. 105981–105981. 21 indexed citations

Liu, Tengyun, Peiqi Ge, Wenbo Bi, & Yufei Gao. (2021). The study of crack damage and fracture strength for single crystal silicon wafers sawn by fixed diamond wire. Materials Science in Semiconductor Processing. 134. 106017–106017. 14 indexed citations

Liu, Tengyun, Peiqi Ge, & Wenbo Bi. (2021). The Influence of Wire Speed on Phase Transitions and Residual Stress in Single Crystal Silicon Wafers Sawn by Resin Bonded Diamond Wire Saw. Micromachines. 12(4). 429–429. 10 indexed citations

Ge, Peiqi, et al.. (2021). Analysis of axial force of double circular arc helical gear hydraulic pump and design of its balancing device. Journal of Central South University. 28(2). 418–428. 6 indexed citations

10.

Lu, Changhou, et al.. (2020). Nonlinear Control System Design for Active Lubrication of Hydrostatic Thrust Bearing. Coatings. 10(4). 426–426. 10 indexed citations

11.

Zhang, Lei, et al.. (2019). Analysis of Antireflection Performance of V‐Ring Groove Structures for Photovoltaic Crystal Silicon Solar Cells. physica status solidi (a). 217(5). 1 indexed citations

12.

Wang, Peizhi, et al.. (2019). Interaction of lateral cracks in double scratching of single-crystal silicon carbide. Theoretical and Applied Fracture Mechanics. 104. 102378–102378. 23 indexed citations

13.

Duan, Derong, et al.. (2018). Vibration Response and Stress Analysis of Planar Elastic Tube Bundle Induced by Fluid Flow. Chinese Journal of Mechanical Engineering. 31(1). 1 indexed citations

14.

Wan, Yi, et al.. (2018). Construction of Antibacterial and Bioactive Surface for Titanium Implant. Nanomanufacturing and Metrology. 1(4). 252–259. 7 indexed citations

15.

Li, Zongqiang, Peiqi Ge, Wenbo Bi, et al.. (2018). Coupling stress caused by thermal and slicing force in KDP crystal slicing with fixed abrasive wire saw. The International Journal of Advanced Manufacturing Technology. 96(9-12). 4333–4343. 20 indexed citations

16.

Li, Xinying, Yufei Gao, Peiqi Ge, Lei Zhang, & Wenbo Bi. (2018). The effect of cut depth and distribution for abrasives on wafer surface morphology in diamond wire sawing of PV polycrystalline silicon. Materials Science in Semiconductor Processing. 91. 316–326. 46 indexed citations

17.

Wang, Dexiang, Peiqi Ge, Shufeng Sun, Jingliang Jiang, & Xinfu Liu. (2017). Investigation on the heat source profile on the finished surface in grinding based on the inverse heat transfer analysis. The International Journal of Advanced Manufacturing Technology. 92(1-4). 1201–1216. 15 indexed citations

18.

Gao, Yufei, Peiqi Ge, & Tengyun Liu. (2016). Experiment study on electroplated diamond wire saw slicing single-crystal silicon. Materials Science in Semiconductor Processing. 56. 106–114. 66 indexed citations

19.

Liu, Tengyun, Peiqi Ge, Wenbo Bi, & Yufei Gao. (2016). Subsurface crack damage in silicon wafers induced by resin bonded diamond wire sawing. Materials Science in Semiconductor Processing. 57. 147–156. 61 indexed citations

20.

Jiang, Jingliang, et al.. (2016). From the microscopic interaction mechanism to the grinding temperature field: An integrated modelling on the grinding process. International Journal of Machine Tools and Manufacture. 110. 27–42. 71 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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