Peiqi Ge

1.7k total citations
73 papers, 1.5k citations indexed

About

Peiqi Ge is a scholar working on Biomedical Engineering, Mechanical Engineering and Materials Chemistry. According to data from OpenAlex, Peiqi Ge has authored 73 papers receiving a total of 1.5k indexed citations (citations by other indexed papers that have themselves been cited), including 42 papers in Biomedical Engineering, 34 papers in Mechanical Engineering and 27 papers in Materials Chemistry. Recurrent topics in Peiqi Ge's work include Advanced Surface Polishing Techniques (38 papers), Advanced machining processes and optimization (17 papers) and Diamond and Carbon-based Materials Research (14 papers). Peiqi Ge is often cited by papers focused on Advanced Surface Polishing Techniques (38 papers), Advanced machining processes and optimization (17 papers) and Diamond and Carbon-based Materials Research (14 papers). Peiqi Ge collaborates with scholars based in China, Portugal and Hong Kong. Peiqi Ge's co-authors include Wenbo Bi, Yufei Gao, Tengyun Liu, Jingliang Jiang, Dexiang Wang, Yi Yang, Yanjun Lü, Peizhi Wang, Shuangshuang Wu and Ke Yang and has published in prestigious journals such as PLANT PHYSIOLOGY, Acta Materialia and Journal of Agricultural and Food Chemistry.

In The Last Decade

Peiqi Ge

72 papers receiving 1.4k citations

Peers

Countries citing papers authored by Peiqi Ge

Since Specialization

Citations

This map shows the geographic impact of Peiqi Ge's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Peiqi Ge with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Peiqi Ge more than expected).

Fields of papers citing papers by Peiqi Ge

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Peiqi Ge. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Peiqi Ge. The network helps show where Peiqi Ge may publish in the future.

Co-authorship network of co-authors of Peiqi Ge

This figure shows the co-authorship network connecting the top 25 collaborators of Peiqi Ge. A scholar is included among the top collaborators of Peiqi Ge based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Peiqi Ge. Peiqi Ge is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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20 of 20 papers shown

#	Title	Journal	Authors	Indexed citations
1	A rocking-floating-variable speed feeding mode for slicing single-crystal silicon carbide	International Journal of Mechanical Sciences	Hao Sun, Mengran Ge et al.	1
2	Wheat DNA Methyltransferase TaMET1 Negatively Regulates Salicylic Acid Biosynthesis to Facilitate Powdery Mildew Susceptibility	Journal of Fungi	Peiqi Ge, Jiao Liu et al.	1
3	Effect of anisotropy on 4H-SiC cracking behavior during diamond wire sawing	Engineering Fracture Mechanics	Hao Sun, Wenbo Bi et al.	4
4	Effect of a liquid bridge on the dynamic behavior of diamond wires during slicing	Journal of Manufacturing Processes	Jintao Zheng, Mengran Ge et al.	3
5	Action mechanism of liquid bridge between electroplated diamond wires for ultrathin wafer slicing	Solar Energy	Jintao Zheng, Peiqi Ge et al.	16
6	Influence of silicon anisotropy on surface shape deviation of wafer by diamond wire saw	Materials Science in Semiconductor Processing	Zongqiang Li, Peiqi Ge et al.	21
7	The study of crack damage and fracture strength for single crystal silicon wafers sawn by fixed diamond wire	Materials Science in Semiconductor Processing	Tengyun Liu, Peiqi Ge et al.	14
8	The Influence of Wire Speed on Phase Transitions and Residual Stress in Single Crystal Silicon Wafers Sawn by Resin Bonded Diamond Wire Saw	Micromachines	Tengyun Liu, Peiqi Ge et al.	10
9	Analysis of axial force of double circular arc helical gear hydraulic pump and design of its balancing device	Journal of Central South University	Peiqi Ge, Wenbo Bi et al.	6
10	Nonlinear Control System Design for Active Lubrication of Hydrostatic Thrust Bearing	Coatings	Changhou Lu, Wei Pan et al.	10
11	Analysis of Antireflection Performance of V‐Ring Groove Structures for Photovoltaic Crystal Silicon Solar Cells	physica status solidi (a)	Lei Zhang, Peiqi Ge et al.	1
12	Interaction of lateral cracks in double scratching of single-crystal silicon carbide	Theoretical and Applied Fracture Mechanics	Peizhi Wang, Peiqi Ge et al.	23
13	Vibration Response and Stress Analysis of Planar Elastic Tube Bundle Induced by Fluid Flow	Chinese Journal of Mechanical Engineering	Derong Duan, Peiqi Ge et al.	1
14	Construction of Antibacterial and Bioactive Surface for Titanium Implant	Nanomanufacturing and Metrology	Yi Wan, Bing Ren et al.	7
15	Coupling stress caused by thermal and slicing force in KDP crystal slicing with fixed abrasive wire saw	The International Journal of Advanced Manufacturing Technology	Zongqiang Li, Peiqi Ge et al.	20
16	The effect of cut depth and distribution for abrasives on wafer surface morphology in diamond wire sawing of PV polycrystalline silicon	Materials Science in Semiconductor Processing	Xinying Li, Yufei Gao et al.	46
17	Investigation on the heat source profile on the finished surface in grinding based on the inverse heat transfer analysis	The International Journal of Advanced Manufacturing Technology	Dexiang Wang, Peiqi Ge et al.	15
18	Experiment study on electroplated diamond wire saw slicing single-crystal silicon	Materials Science in Semiconductor Processing	Yufei Gao, Peiqi Ge et al.	66
19	Subsurface crack damage in silicon wafers induced by resin bonded diamond wire sawing	Materials Science in Semiconductor Processing	Tengyun Liu, Peiqi Ge et al.	61
20	From the microscopic interaction mechanism to the grinding temperature field: An integrated modelling on the grinding process	International Journal of Machine Tools and Manufacture	Jingliang Jiang, Peiqi Ge et al.	71

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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