Mengran Ge

477 total citations
22 papers, 393 citations indexed

About

Mengran Ge is a scholar working on Biomedical Engineering, Mechanics of Materials and Materials Chemistry. According to data from OpenAlex, Mengran Ge has authored 22 papers receiving a total of 393 indexed citations (citations by other indexed papers that have themselves been cited), including 19 papers in Biomedical Engineering, 9 papers in Mechanics of Materials and 9 papers in Materials Chemistry. Recurrent topics in Mengran Ge's work include Advanced Surface Polishing Techniques (19 papers), Diamond and Carbon-based Materials Research (8 papers) and Advanced machining processes and optimization (7 papers). Mengran Ge is often cited by papers focused on Advanced Surface Polishing Techniques (19 papers), Diamond and Carbon-based Materials Research (8 papers) and Advanced machining processes and optimization (7 papers). Mengran Ge collaborates with scholars based in China, United Kingdom and Portugal. Mengran Ge's co-authors include Wenbo Bi, Peiqi Ge, Peizhi Wang, Hongtao Zhu, Chuanzhen Huang, Ao Liu, Yufei Gao, Peiqi Ge, Zongqiang Li and Derong Duan and has published in prestigious journals such as ACS Nano, Applied Thermal Engineering and Engineering Fracture Mechanics.

In The Last Decade

Mengran Ge

21 papers receiving 387 citations

Peers

Mengran Ge

EEE

Mutsumi Touge Japan

K.E. Goodson United States

Ruikang Wu China

Hongjian Zhou China

Mojia Huang China

Gerhard Liedl Austria

S. Teysseyre United States

Dong-Wook Oh South Korea

Fajun Yi China

Liping He China

Mutsumi Touge Japan

Mengran Ge

416 ×1.4

198 ×1.2

397 ×2.7

125 ×1.4

121 ×1.8

EEE

Citations per year, relative to Mengran Ge Mengran Ge (= 1×) peers Mutsumi Touge

Countries citing papers authored by Mengran Ge

Since Specialization

Citations

This map shows the geographic impact of Mengran Ge's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Mengran Ge with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Mengran Ge more than expected).

Fields of papers citing papers by Mengran Ge

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Mengran Ge. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Mengran Ge. The network helps show where Mengran Ge may publish in the future.

Co-authorship network of co-authors of Mengran Ge

This figure shows the co-authorship network connecting the top 25 collaborators of Mengran Ge. A scholar is included among the top collaborators of Mengran Ge based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Mengran Ge. Mengran Ge is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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20 of 20 papers shown

Sun, Hao, et al.. (2025). A rocking-floating-variable speed feeding mode for slicing single-crystal silicon carbide. International Journal of Mechanical Sciences. 304. 110727–110727. 1 indexed citations

Ge, Peiqi, Zheng Cao, Zongqiang Li, et al.. (2025). Progress and critical challenges in slicing of thin semiconductor wafers using ultra-fine diamond wire. Materials Science in Semiconductor Processing. 203. 110209–110209.

Sun, Hao, Wenbo Bi, Mengran Ge, Peizhi Wang, & Peiqi Ge. (2024). Effect of anisotropy on 4H-SiC cracking behavior during diamond wire sawing. Engineering Fracture Mechanics. 309. 110427–110427. 4 indexed citations

Zheng, Jintao, et al.. (2023). Effect of a liquid bridge on the dynamic behavior of diamond wires during slicing. Journal of Manufacturing Processes. 94. 578–591. 3 indexed citations

Zheng, Jintao, et al.. (2023). Effect of liquid bridge on the thickness deviation between wafers sawn by diamond wire. Journal of Manufacturing Processes. 108. 268–279. 5 indexed citations

Ge, Mengran, et al.. (2023). Modeling of electroplated diamond wire and its application towards precision slicing of semiconductors. Journal of Manufacturing Processes. 87. 141–149. 10 indexed citations

Ge, Mengran, et al.. (2022). Simplified calculation of indentation contact deformation of monocrystalline silicon. Optics and Precision Engineering. 30(11). 1317–1324. 3 indexed citations

Duan, Derong, et al.. (2022). Experimental and numerical study on heat transfer enhancement by Flow-induced vibration in pulsating flow. Applied Thermal Engineering. 207. 118171–118171. 29 indexed citations

Ge, Mengran, Zibin Chen, Peizhi Wang, & Peiqi Ge. (2022). Crack damage control for diamond wire sawing of silicon: The selection of processing parameters. Materials Science in Semiconductor Processing. 148. 106838–106838. 21 indexed citations

10.

Zhang, Zhenzhong, et al.. (2022). Fabrication of Cylindrical Microlens Array on RB-SiC Moulds by Precision Grinding with MAWJ-Textured Diamond Wheels. Applied Sciences. 12(14). 6893–6893. 5 indexed citations

11.

Zheng, Jintao, et al.. (2022). Machine vision-based transverse vibration measurement of diamond wire. Precision Engineering. 80. 115–126. 4 indexed citations

12.

Ge, Mengran, Peizhi Wang, Wenbo Bi, & Peiqi Ge. (2021). Fabrication of thin resin-bonded diamond wire and its application to ductile-mode wire sawing of mono-crystalline silicon. Materials Science in Semiconductor Processing. 126. 105665–105665. 20 indexed citations

13.

Ge, Mengran, et al.. (2019). Investigation on residual scratch depth and material removal rate of scratching machining single crystal silicon with Berkovich indenter. Materials Science in Semiconductor Processing. 100. 98–105. 20 indexed citations

14.

Wang, Peizhi, et al.. (2018). Material removal mechanism and crack propagation in single scratch and double scratch tests of single-crystal silicon carbide by abrasives on wire saw. Ceramics International. 45(1). 384–393. 66 indexed citations

15.

Wang, Peizhi, Peiqi Ge, Wenbo Bi, Mengran Ge, & Long Li. (2018). The interaction of periodically distributed parallel cracks in anisotropic materials subjected to concentrated loads. Engineering Fracture Mechanics. 199. 131–142. 8 indexed citations

16.

Ge, Mengran, Wenbo Bi, Peiqi Ge, & Yufei Gao. (2018). Fabrication and performance evaluation for resin-bonded diamond wire saw. The International Journal of Advanced Manufacturing Technology. 98(9-12). 3269–3277. 6 indexed citations

17.

Ge, Mengran, Hongtao Zhu, Chuanzhen Huang, Ao Liu, & Wenbo Bi. (2017). Investigation on critical crack-free cutting depth for single crystal silicon slicing with fixed abrasive wire saw based on the scratching machining experiments. Materials Science in Semiconductor Processing. 74. 261–266. 65 indexed citations

18.

Wang, Peizhi, Peiqi Ge, Zongqiang Li, Mengran Ge, & Yufei Gao. (2017). A scratching force model of diamond abrasive particles in wire sawing of single crystal SiC. Materials Science in Semiconductor Processing. 68. 21–29. 32 indexed citations

19.

Ge, Mengran, et al.. (2016). Experimental research on KDP crystal slicing with resin bonded diamond abrasive wire saw. The International Journal of Advanced Manufacturing Technology. 87(5-8). 1671–1676. 11 indexed citations

20.

Ge, Mengran, et al.. (2016). A finite element analysis of sawing stress in fixed-abrasive wire saw slicing KDP crystal. The International Journal of Advanced Manufacturing Technology. 91(5-8). 2049–2057. 18 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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