P.D. Foo

925 total citations
35 papers, 794 citations indexed

About

P.D. Foo is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials and Mechanics of Materials. According to data from OpenAlex, P.D. Foo has authored 35 papers receiving a total of 794 indexed citations (citations by other indexed papers that have themselves been cited), including 31 papers in Electrical and Electronic Engineering, 21 papers in Electronic, Optical and Magnetic Materials and 7 papers in Mechanics of Materials. Recurrent topics in P.D. Foo's work include Semiconductor materials and devices (24 papers), Copper Interconnects and Reliability (21 papers) and Metal and Thin Film Mechanics (6 papers). P.D. Foo is often cited by papers focused on Semiconductor materials and devices (24 papers), Copper Interconnects and Reliability (21 papers) and Metal and Thin Film Mechanics (6 papers). P.D. Foo collaborates with scholars based in Singapore, United States and Taiwan. P.D. Foo's co-authors include K. K. Innes, Xiongfei Yu, Ming Yu, Mengjiao Li, Chunxiang Zhu, Hang Hu, Albert Chin, C.Y. Li, J. R. Wiesenfeld and Byung Jin Cho and has published in prestigious journals such as The Journal of Chemical Physics, Journal of The Electrochemical Society and The Journal of Physical Chemistry.

In The Last Decade

P.D. Foo

33 papers receiving 760 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
P.D. Foo Singapore 16 528 303 242 189 130 35 794
J. Ip France 11 231 0.4× 112 0.4× 114 0.5× 364 1.9× 61 0.5× 22 676
Charly Mayeux France 12 173 0.3× 57 0.2× 131 0.5× 133 0.7× 69 0.5× 21 452
C. Werkhoven Netherlands 15 434 0.8× 38 0.1× 385 1.6× 309 1.6× 80 0.6× 36 672
P. M. Blass United States 13 269 0.5× 41 0.1× 311 1.3× 331 1.8× 44 0.3× 18 627
Juana Vivó Acrivos United States 12 175 0.3× 205 0.7× 166 0.7× 379 2.0× 60 0.5× 49 662
M. Lugarà Italy 13 516 1.0× 143 0.5× 338 1.4× 612 3.2× 28 0.2× 53 895
Štěpán Pick Czechia 16 134 0.3× 178 0.6× 828 3.4× 459 2.4× 13 0.1× 108 1.1k
A. Marbeuf France 16 310 0.6× 260 0.9× 221 0.9× 399 2.1× 24 0.2× 43 747
K. Nagata Japan 15 162 0.3× 182 0.6× 81 0.3× 283 1.5× 27 0.2× 41 560
Tosja Zywietz Germany 13 419 0.8× 614 2.0× 416 1.7× 594 3.1× 36 0.3× 17 1.4k

Countries citing papers authored by P.D. Foo

Since Specialization
Citations

This map shows the geographic impact of P.D. Foo's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by P.D. Foo with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites P.D. Foo more than expected).

Fields of papers citing papers by P.D. Foo

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by P.D. Foo. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by P.D. Foo. The network helps show where P.D. Foo may publish in the future.

Co-authorship network of co-authors of P.D. Foo

This figure shows the co-authorship network connecting the top 25 collaborators of P.D. Foo. A scholar is included among the top collaborators of P.D. Foo based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with P.D. Foo. P.D. Foo is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Zhang, D.H., et al.. (2005). Ta/SiCN bilayer barrier for Cu–ultra low k integration. Thin Solid Films. 504(1-2). 235–238. 12 indexed citations
2.
Yang, Liping, et al.. (2004). Characterization of Cu/Ta/ultra low-k porous polymer structures for multilevel interconnects. Thin Solid Films. 462-463. 182–185. 1 indexed citations
3.
Hu, Hang, H.F. Lim, Chunxiang Zhu, et al.. (2003). High Performance ALD HfO 2-Al 2O 3 Laminate MIM Capacitors for RF and Mixed Signal IC Applications. National University of Singapore. 379–382. 5 indexed citations
4.
Zheng, Yiting, Qiang Guo, Yi Su, & P.D. Foo. (2003). Polymer residue chemical composition analysis and its effect on via contact resistance in dual damascene copper interconnects process integration. Microelectronics Journal. 34(2). 109–113. 9 indexed citations
5.
Yu, Xiongfei, Chunxiang Zhu, Hang Hu, et al.. (2003). Mim Capacitors with HfO2 and HfAlOx for Si RF and Analog Applications. MRS Proceedings. 766. 1 indexed citations
6.
Yu, Xiongfei, Chunxiang Zhu, Hang Hu, et al.. (2003). A high-density MIM capacitor (13 fF/μm/sup 2/) using ALD HfO2 dielectrics. IEEE Electron Device Letters. 24(2). 63–65. 126 indexed citations
7.
Tan, Yinlong, et al.. (2003). Adhesion Enhancement for Multiple Level Cu/SiLKTM Integration. MRS Proceedings. 766. 1 indexed citations
8.
Kumar, Rakesh, et al.. (2002). Reduction of Oxygen Plasma Damage by Postdeposition Helium Plasma Treatment for Carbon-Doped Silicon Oxide Low Dielectric Constant Films. Electrochemical and Solid-State Letters. 6(1). F1–F1. 18 indexed citations
9.
Wu, J., et al.. (2002). EFFECT OF UNDERLAYERS ON THE STRESS OF CU FILMS PREPARED USING IONIZED METAL PLASMA. International Journal of Modern Physics B. 16(01n02). 189–196. 7 indexed citations
10.
You, Guoqiang, et al.. (2002). Investigation of the effects of byproduct components in Cu plating for advanced interconnect metallization. Microelectronics Journal. 33(3). 229–234. 32 indexed citations
11.
Shen, Luming, Jisheng Pan, An Du, et al.. (2002). A Correlation Study of Thermal Stability on Porous Low k. MRS Proceedings. 716. 5 indexed citations
12.
Prasad, K., et al.. (2002). Diffusion Studies of Cu in Si and Low-k Dielectric Materials. MRS Proceedings. 716. 2 indexed citations
13.
Narayanan, Binitha N., Rakesh Kumar, & P.D. Foo. (2002). Properties of low-k SiCOH films prepared by plasma-enhanced chemical vapor deposition using trimethylsilane. Microelectronics Journal. 33(11). 971–974. 14 indexed citations
14.
Foo, P.D., et al.. (2001). STUDY OF Cu DIFFUSION IN Cu/TaN/SiO2/Si MULTILAYER STRUCTURES. Surface Review and Letters. 8(5). 527–532. 3 indexed citations
15.
Wu, J., et al.. (2001). COMPARATIVE STUDY OF IONIZED METAL PLASMA Ta, TaN AND MULTISTACKED Ta/TaN STRUCTURE AS DIFFUSION BARRIERS FOR Cu METALLIZATION. Surface Review and Letters. 8(5). 459–464. 15 indexed citations
16.
Teh, W. H., et al.. (2001). Evaluation of the performance of TaN diffusionbarrier againstcopper diffusion using SIMS and AFM. Electronics Letters. 37(10). 660–661. 3 indexed citations
17.
Foo, P.D., J. R. Wiesenfeld, Mai‐Yan Yuen, & Deeba Husain. (1976). Collisional quenching of electronically excited tin atoms, Sn(5p2 3P1) and Sn(5p2 3P2), by time-resolved attenuation of atomic resonance radiation. The Journal of Physical Chemistry. 80(2). 91–97. 22 indexed citations
18.
Foo, P.D. & K. K. Innes. (1974). New experimental tests of existing interpretations of electronic transitions of ethylene. The Journal of Chemical Physics. 60(11). 4582–4589. 80 indexed citations
19.
Foo, P.D. & K. K. Innes. (1973). Spectrum of acetylene: 1650–1950 Å. Chemical Physics Letters. 22(3). 439–442. 78 indexed citations
20.
Moule, D. C. & P.D. Foo. (1971). Analysis of the 2973-Å Absorption System of Phosgene. The Journal of Chemical Physics. 55(3). 1262–1268. 28 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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