Myung Jun Kim

3.7k total citations
110 papers, 3.1k citations indexed

About

Myung Jun Kim is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials and Materials Chemistry. According to data from OpenAlex, Myung Jun Kim has authored 110 papers receiving a total of 3.1k indexed citations (citations by other indexed papers that have themselves been cited), including 92 papers in Electrical and Electronic Engineering, 49 papers in Electronic, Optical and Magnetic Materials and 45 papers in Materials Chemistry. Recurrent topics in Myung Jun Kim's work include Electrodeposition and Electroless Coatings (59 papers), Copper Interconnects and Reliability (40 papers) and Electrocatalysts for Energy Conversion (22 papers). Myung Jun Kim is often cited by papers focused on Electrodeposition and Electroless Coatings (59 papers), Copper Interconnects and Reliability (40 papers) and Electrocatalysts for Energy Conversion (22 papers). Myung Jun Kim collaborates with scholars based in South Korea, United States and Japan. Myung Jun Kim's co-authors include Jae Jeong Kim, Benjamin J. Wiley, Shengrong Ye, Soo‐Kil Kim, Taeho Lim, Seunghoe Choe, Patrick F. Flowers, Byung‐Keun Kim, Christopher Reyes and Hoe Chul Kim and has published in prestigious journals such as Chemical Reviews, Journal of the American Chemical Society and ACS Nano.

In The Last Decade

Myung Jun Kim

106 papers receiving 3.0k citations

Peers

Myung Jun Kim

EEE

RESE

EOMM

Xuyun Guo Hong Kong

Yaoyao Li China

Qingchi Xu China

Yi Ding China

Ming Xu China

Chunyang Wu China

Liang Zhao China

Yukun Xiao China

Jun Mei China

Hyuk Chang South Korea

Xuyun Guo Hong Kong

Myung Jun Kim

4.3k ×2.3

EEE

2.5k ×2.1

2.5k ×2.7

RESE

878 ×1.4

EOMM

602 ×0.9

Citations per year, relative to Myung Jun Kim Myung Jun Kim (= 1×) peers Xuyun Guo

Countries citing papers authored by Myung Jun Kim

Since Specialization

Citations

This map shows the geographic impact of Myung Jun Kim's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Myung Jun Kim with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Myung Jun Kim more than expected).

Fields of papers citing papers by Myung Jun Kim

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Myung Jun Kim. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Myung Jun Kim. The network helps show where Myung Jun Kim may publish in the future.

Co-authorship network of co-authors of Myung Jun Kim

This figure shows the co-authorship network connecting the top 25 collaborators of Myung Jun Kim. A scholar is included among the top collaborators of Myung Jun Kim based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Myung Jun Kim. Myung Jun Kim is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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20 of 20 papers shown

Kim, Myung Jun, et al.. (2025). Iridium‐Based Mixed Transition Metal Oxide (Ir₃MO_x, M = Ni, Co, Fe) Incorporated in the Conducting Layer as an Electrocatalyst for Boosting the Oxygen Evolution Reaction. Small. 21(34). e2505937–e2505937. 1 indexed citations

Kim, Myung Jun, et al.. (2025). Formation of twin structures via Cu electrodeposition with SPS and Cl-. Materials Science and Engineering B. 322. 118634–118634. 2 indexed citations

Kim, Myung Jun, et al.. (2025). Pulse electrodeposition of Sn-Bi low-temperature solder with phloroglucinol. Electrochimica Acta. 535. 146661–146661.

Jo, Wook, et al.. (2025). Machine learning for voltammetric analysis of Cu electroplating additives: electrochemically-guided design for dataset structure. Journal of Electroanalytical Chemistry. 999. 119552–119552.

Lee, Min Hyung, et al.. (2024). Synergistic effect of CTA+ and Br- on defect-free TSV filling by Cu electrodeposition. Electrochimica Acta. 503. 144879–144879. 5 indexed citations

Kim, Myung Jun, et al.. (2024). Pretreatments for photoresist-patterned wafer to improve Cu pillar electrodeposition. Journal of Industrial and Engineering Chemistry. 145. 403–409. 1 indexed citations

Kim, Myung Jun, et al.. (2024). Enhancement of heat dissipation in β-Ga₂O₃ Schottky diodes through Cu-filled thermal vias: experimental and simulation investigations. Journal of Materials Chemistry C. 12(29). 11094–11102.

Sung, Yung‐Eun, et al.. (2024). Enhancing Proton Exchange Membrane Water Electrolysis with a Checkered Carbon Matrix Containing Ir‐Ru Nanoparticles. Advanced Energy Materials. 14(46). 7 indexed citations

Kim, Youngkwang, et al.. (2023). Ir–Ru Electrocatalysts Embedded in N‐Doped Carbon Matrix for Proton Exchange Membrane Water Electrolysis. Advanced Functional Materials. 33(28). 32 indexed citations

10.

Lee, Min Hyung, et al.. (2023). Heat Treatment for Enhancing Ir-Based Catalysts Enclosed in a Carbon Layer for Electrochemical Oxygen Evolution Reaction. ACS Sustainable Chemistry & Engineering. 11(41). 15124–15134. 6 indexed citations

11.

Lee, Dohyeon, et al.. (2023). A cracked carbon matrix decorated with amorphous IrO_x for boosting the oxygen evolution reaction in electrochemical water splitting. Journal of Materials Chemistry A. 11(26). 14221–14231. 7 indexed citations

12.

Kim, Myung Jun, et al.. (2022). Shape Control of Metal Nanostructures by Electrodeposition and their Applications in Electrocatalysis. Journal of The Electrochemical Society. 169(11). 112502–112502. 10 indexed citations

13.

Lee, Yoonjae, et al.. (2022). Quaternary ammonium-based levelers for high-speed microvia filling via Cu electrodeposition. Electrochimica Acta. 419. 140389–140389. 19 indexed citations

14.

Fichthorn, Kristen A., Zihao Chen, Zhifeng Chen, et al.. (2021). Understanding the Solution-Phase Growth of Cu and Ag Nanowires and Nanocubes from First Principles. Langmuir. 37(15). 4419–4431. 15 indexed citations

15.

Kim, Myung Jun, et al.. (2021). Through Silicon Via Filling with Suppression Breakdown of PEG–Br ^– in Absence of Accelerator. Journal of The Electrochemical Society. 168(8). 82510–82510. 6 indexed citations

16.

Jung, Jaemin, et al.. (2020). In situ formation of graphene/metal oxide composites for high-energy microsupercapacitors. NPG Asia Materials. 12(1). 37 indexed citations

17.

Kim, Myung Jun, Mutya A. Cruz, Zihao Chen, et al.. (2020). Isotropic Iodide Adsorption Causes Anisotropic Growth of Copper Microplates. Chemistry of Materials. 33(3). 881–891. 32 indexed citations

18.

Kim, Myung Jun, Mutya A. Cruz, Shengrong Ye, et al.. (2019). One-step electrodeposition of copper on conductive 3D printed objects. Additive manufacturing. 27. 318–326. 85 indexed citations

19.

Kim, Myung Jun, et al.. (2018). Modulating the Growth Rate, Aspect Ratio, and Yield of Copper Nanowires with Alkylamines. Chemistry of Materials. 30(8). 2809–2818. 52 indexed citations

20.

Kim, Myung Jun, Samuel Alvarez, Zihao Chen, Kristen A. Fichthorn, & Benjamin J. Wiley. (2018). Single-Crystal Electrochemistry Reveals Why Metal Nanowires Grow. Journal of the American Chemical Society. 140(44). 14740–14746. 84 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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