Hoe Chul Kim

468 total citations
19 papers, 418 citations indexed

About

Hoe Chul Kim is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials and Materials Chemistry. According to data from OpenAlex, Hoe Chul Kim has authored 19 papers receiving a total of 418 indexed citations (citations by other indexed papers that have themselves been cited), including 19 papers in Electrical and Electronic Engineering, 9 papers in Electronic, Optical and Magnetic Materials and 9 papers in Materials Chemistry. Recurrent topics in Hoe Chul Kim's work include Electrodeposition and Electroless Coatings (18 papers), Copper Interconnects and Reliability (9 papers) and Corrosion Behavior and Inhibition (8 papers). Hoe Chul Kim is often cited by papers focused on Electrodeposition and Electroless Coatings (18 papers), Copper Interconnects and Reliability (9 papers) and Corrosion Behavior and Inhibition (8 papers). Hoe Chul Kim collaborates with scholars based in South Korea, Sudan and United States. Hoe Chul Kim's co-authors include Jae Jeong Kim, Myung Jun Kim, Seunghoe Choe, Soo‐Kil Kim, Taeho Lim, Sung Ki Cho, Young Gyu Kim, Youngran Seo, Il Woong Jung and Yoonjae Lee and has published in prestigious journals such as Journal of The Electrochemical Society, Electrochimica Acta and Thin Solid Films.

In The Last Decade

Hoe Chul Kim

19 papers receiving 387 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Hoe Chul Kim South Korea 14 396 163 100 99 76 19 418
S.-K. Kim United States 7 535 1.4× 294 1.8× 156 1.6× 144 1.5× 89 1.2× 8 549
T. P. Moffat United States 10 393 1.0× 187 1.1× 137 1.4× 99 1.0× 48 0.6× 10 407
Zhiqiang Lai China 12 269 0.7× 252 1.5× 57 0.6× 43 0.4× 27 0.4× 23 406
Sobha Jayakrishnan India 12 298 0.8× 205 1.3× 44 0.4× 71 0.7× 37 0.5× 28 365
Julian Schwenzel Germany 14 509 1.3× 89 0.5× 71 0.7× 80 0.8× 28 0.4× 32 591
Hidehiko Enomoto Japan 11 291 0.7× 175 1.1× 36 0.4× 56 0.6× 27 0.4× 37 334
Chun-Kai Lan Taiwan 10 397 1.0× 133 0.8× 149 1.5× 30 0.3× 15 0.2× 13 437
S. Kudelka Germany 11 207 0.5× 214 1.3× 25 0.3× 44 0.4× 36 0.5× 27 353
S. Mukerjee United States 7 368 0.9× 149 0.9× 81 0.8× 38 0.4× 25 0.3× 11 436
Saeid Rafizadeh Germany 5 349 0.9× 234 1.4× 19 0.2× 27 0.3× 85 1.1× 11 394

Countries citing papers authored by Hoe Chul Kim

Since Specialization
Citations

This map shows the geographic impact of Hoe Chul Kim's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Hoe Chul Kim with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Hoe Chul Kim more than expected).

Fields of papers citing papers by Hoe Chul Kim

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Hoe Chul Kim. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Hoe Chul Kim. The network helps show where Hoe Chul Kim may publish in the future.

Co-authorship network of co-authors of Hoe Chul Kim

This figure shows the co-authorship network connecting the top 25 collaborators of Hoe Chul Kim. A scholar is included among the top collaborators of Hoe Chul Kim based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Hoe Chul Kim. Hoe Chul Kim is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

19 of 19 papers shown
1.
Kim, Hoe Chul, et al.. (2018). Thermodynamic aspects of bis(3‑sulfopropyl) disulfide and 3‑mercapto‑1‑propanesulfonic acid in Cu electrodeposition. Journal of Electroanalytical Chemistry. 816. 132–137. 20 indexed citations
2.
Kim, Hoe Chul, Myung Jun Kim, & Jae Jeong Kim. (2018). Communication—Acceleration of TSV Filling by Adding Thiourea to PEG-PPG-SPS-I−. Journal of The Electrochemical Society. 165(3). D91–D93. 22 indexed citations
3.
Kim, Hoe Chul, et al.. (2017). Effects of Organic Additives on Grain Growth in Electrodeposited Cu Thin Film during Self-Annealing. Journal of The Electrochemical Society. 164(13). D805–D809. 15 indexed citations
4.
Cho, Sung Ki, Hoe Chul Kim, Myung Jun Kim, & Jae Jeong Kim. (2016). Voltammetric Observation of Transient Catalytic Behavior of SPS in Copper Electrodeposition—Its Interaction with Cuprous Ion from Comproportionation. Journal of The Electrochemical Society. 163(8). D428–D433. 18 indexed citations
5.
Kim, Myung Jun, Youngran Seo, Yoonjae Lee, et al.. (2016). Communication—Halide Ions in TEG-Based Levelers Affecting TSV Filling Performance. Journal of The Electrochemical Society. 163(5). D185–D187. 26 indexed citations
6.
Kim, Myung Jun, Hoe Chul Kim, & Jae Jeong Kim. (2016). The Influences of Iodide Ion on Cu Electrodeposition and TSV Filling. Journal of The Electrochemical Society. 163(8). D434–D441. 31 indexed citations
7.
Kim, Hoe Chul & Jae Jeong Kim. (2016). Through-Silicon-Via Filling Process Using Cu Electrodeposition. Korean Chemical Engineering Research. 54(6). 723–733. 7 indexed citations
8.
Choe, Seunghoe, Myung Jun Kim, Hoe Chul Kim, et al.. (2015). High Accuracy Concentration Analysis of Accelerator Components in Acidic Cu Superfilling Bath. Journal of The Electrochemical Society. 163(2). D33–D39. 13 indexed citations
9.
Choe, Seunghoe, et al.. (2015). Accuracy Improvement in Cyclic Voltammetry Stripping Analysis of Thiourea Concentration in Copper Plating Baths. Journal of The Electrochemical Society. 162(4). H294–H300. 12 indexed citations
10.
Kim, Myung Jun, Seunghoe Choe, Hoe Chul Kim, et al.. (2015). Electrochemical Behavior of Citric Acid and Its Influence on Cu Electrodeposition for Damascene Metallization. Journal of The Electrochemical Society. 162(8). D354–D359. 16 indexed citations
11.
Kim, Myung Jun, Youngran Seo, Hoe Chul Kim, et al.. (2015). Galvanostatic bottom-up filling of TSV-like trenches: Choline-based leveler containing two quaternary ammoniums. Electrochimica Acta. 163. 174–181. 52 indexed citations
12.
Kim, Hoe Chul, Myung Jun Kim, Seunghoe Choe, et al.. (2014). Electrodeposition of Cu Films with Low Resistivity and Improved Hardness Using Additive Derivatization. Journal of The Electrochemical Society. 161(14). D749–D755. 15 indexed citations
13.
Kim, Hoe Chul, Seunghoe Choe, Il Woong Jung, et al.. (2014). Bottom-up Filling of through Silicon Vias Using Galvanostatic Cu Electrodeposition with the Modified Organic Additives. Journal of The Electrochemical Society. 162(3). D109–D114. 25 indexed citations
14.
Kim, Myung Jun, Hoe Chul Kim, Soo‐Hyun Kim, et al.. (2013). Direct Electrodeposition of Cu on Ru-Al2O3Layer. Journal of The Electrochemical Society. 160(12). D3057–D3062. 7 indexed citations
15.
Choe, Seunghoe, et al.. (2013). Degradation of Bis(3-sulfopropyl) Disulfide and Its Influence on Copper Electrodeposition for Feature Filling. Journal of The Electrochemical Society. 160(12). D3179–D3185. 47 indexed citations
16.
Kim, Myung Jun, Hoe Chul Kim, Seunghoe Choe, et al.. (2013). Cu Bottom-Up Filling for Through Silicon Vias with Growing Surface Established by the Modulation of Leveler and Suppressor. Journal of The Electrochemical Society. 160(12). D3221–D3227. 45 indexed citations
17.
Choe, Seunghoe, Myung Jun Kim, Hoe Chul Kim, et al.. (2013). Degradation of poly(ethylene glycol–propylene glycol) copolymer and its influences on copper electrodeposition. Journal of Electroanalytical Chemistry. 714-715. 85–91. 22 indexed citations
18.
Choe, Seunghoe, Myung Jun Kim, Hoe Chul Kim, et al.. (2013). Seed Repair by Electrodeposition in Pyrophosphate Solution for Acid Cu Superfilling. Journal of The Electrochemical Society. 160(4). D202–D205. 12 indexed citations
19.
Kim, Hoe Chul, Myung Jun Kim, Taeho Lim, et al.. (2013). Effects of nitrogen atoms of benzotriazole and its derivatives on the properties of electrodeposited Cu films. Thin Solid Films. 550. 421–427. 13 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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