Marián Drienovský
- Mechanical Engineering top 10%
- Materials Chemistry
- Electrical and Electronic Engineering
- Biomedical Engineering
- Aerospace Engineering
- Co-authors
- Marián PalcutIvona ČerničkováJozef JanovecMartin KusýJozef KrajčovičPavol PriputenMarcela PekarčíkováLibor Ďuriška
- Topics
- Electronic Packaging and Soldering Technologies (8 papers)Aluminum Alloy Microstructure Properties (7 papers)Metal and Thin Film Mechanics (7 papers)
- Journals
- SHILAP Revista de lepidopterologíaMaterials Science and Engineering ARSC Advances
In The Last Decade
Marián Drienovský
39 papers receiving 382 citations
Peers
Comparison fields: 5 of 49
- Mechanical Engineering 205
- Materials Chemistry 128
- Electrical and Electronic Engineering 107
- Biomedical Engineering 86
- Aerospace Engineering 79
Countries citing papers authored by Marián Drienovský
This map shows the geographic impact of Marián Drienovský's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Marián Drienovský with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Marián Drienovský more than expected).
Fields of papers citing papers by Marián Drienovský
This network shows the impact of papers produced by Marián Drienovský. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Marián Drienovský. The network helps show where Marián Drienovský may publish in the future.
Co-authorship network of co-authors of Marián Drienovský
This figure shows the co-authorship network connecting the top 25 collaborators of Marián Drienovský. A scholar is included among the top collaborators of Marián Drienovský based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Marián Drienovský. Marián Drienovský is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 0 | |
| 2 | 0 | |
| 3 | 1 | |
| 4 | 1 | |
| 5 | 4 | |
| 6 | 9 | |
| 7 | 1 | |
| 8 | 5 | |
| 9 | 11 | |
| 10 | 9 | |
| 11 | 13 | |
| 12 | 14 | |
| 13 | 11 | |
| 14 | 13 | |
| 15 | 2 | |
| 16 | 11 | |
| 17 | 16 | |
| 18 | 22 | |
| 19 | 8 | |
| 20 | 14 |
About Marián Drienovský
Marián Drienovský is a scholar working on General Materials Science, Mechanical Engineering and Ceramics and Composites, having authored 41 papers that have together received 394 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (8 papers), Aluminum Alloy Microstructure Properties (7 papers) and Metal and Thin Film Mechanics (7 papers). The work is most often cited by research in General Materials Science (21 citations), Ceramics and Composites (33 citations) and Mechanical Engineering (205 citations). Marián Drienovský has collaborated with scholars based in Slovakia, Czechia and Lithuania. Frequent co-authors include Marián Palcut, Ivona Černičková, Jozef Janovec, Martin Kusý, Jozef Krajčovič, Pavol Priputen, Marcela Pekarčíková, Libor Ďuriška, Peter Krížik and Martin Balog. Their work appears in journals such as SHILAP Revista de lepidopterología, Materials Science and Engineering A and RSC Advances.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.