Le Luo

1.8k citations

149 papers · 1.1k indexed · h-index 15

Impact in

Electrical and Electronic Engineering top 5%
- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- Chalcogenide Semiconductor Thin Films
- Semiconductor materials and devices
- Advanced MEMS and NEMS Technologies
Electronic, Optical and Magnetic Materials
- Copper Interconnects and Reliability

Papers in ⓘ

Electrical and Electronic Engineering 108
- 3D IC and TSV technologies 67
- Electronic Packaging and Soldering Technologies 63
- Advanced MEMS and NEMS Technologies 16
- Radio Frequency Integrated Circuit Design 9
- Microwave Engineering and Waveguides 9
- Semiconductor materials and devices 7
Electronic, Optical and Magnetic Materials 21
- Copper Interconnects and Reliability 18

Co-authors: Gaowei Xu (54 shared papers)Weidong Xiang (5 shared papers)Xiaojuan Liang (4 shared papers)Jiasong Zhong (4 shared papers)Yuan Yuan (7 shared papers)Jing Wang (2 shared papers)Hailong Yang (2 shared papers)Weidong Huang (8 shared papers)
Journals: Journal of Electronic Materials (9 papers)Microsystem Technologies (6 papers)Journal of Semiconductors (5 papers)Journal of Materials Science Materials in Electronics (4 papers)Journal of Micromechanics and Microengineering (3 papers)
Partner nations: China Germany United States

In The Last Decade

Le Luo

139 papers receiving 1.0k citations

Peers

Countries citing papers authored by Le Luo

Since Specialization

Citations

This map shows the geographic impact of Le Luo's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Le Luo with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Le Luo more than expected).

Fields of papers citing papers by Le Luo

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Le Luo. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Le Luo. The network helps show where Le Luo may publish in the future.

Co-authors

The 25 scholars most cited alongside Le Luo, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.

Border = papers with Le Luo Line = papers co-authored together Le Luo links everyone, so they are left out of the graph.

All Works

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20 of 20 papers shown

Showing the 20 most-cited of 149 papers — load more, or switch the sort, to bring in the rest.

#	Work
1	Studies on highly luminescent AgInS2 and Ag–Zn–In–S quantum dots Journal of Alloys and Compounds ·Weidong Xiang, Cuiping Xie, Jing Wang, Jiasong Zhong, Xiaojuan Liang, Hailong Yang, Le Luo, Zhaoping Chen	2013	95
2	Microstructure and shear strength evolution of SnAg/Cu surface mount solder joint during aging Journal of Electronic Materials ·Shawkret Ahat, Mei Sheng, Le Luo	2001	83
3	Low temperature PECVD SiNx films applied in OLED packaging Materials Science and Engineering B ·Weidong Huang, Xuhong Wang, Sheng Mei, Liqiang Xu, Frank Stubhan, Le Luo, Tao Feng, Xi Wang, Fumin Zhang, Shichang Zou	2003	79
4	Direct synthesis of highly luminescent Cu–Zn–In–S quaternary nanocrystals with tunable photoluminescence spectra and decay times Journal of Materials Chemistry C ·Weidong Xiang, Hailong Yang, Xiaojuan Liang, Jiasong Zhong, Jing Wang, Le Luo, Cuiping Xie	2013	46
5	In situ observation of nanotwins formation through twin terrace growth in pulse electrodeposited Cu films Scientific Reports ·Gong Cheng, Heng Li, Gaowei Xu, Wei Gai, Le Luo	2017	30
6	Void Evolution in Sub-100-Micron Sn-Ag Solder Bumps during Multi-reflow and Aging and its Effects on Bonding Reliability Journal of Electronic Materials ·Xiaoqin Lin, Le Luo	2007	28
7	A machine learning-based strategy for predicting the mechanical strength of coral reef limestone using X-ray computed tomography Journal of Rock Mechanics and Geotechnical Engineering ·Kai Wu, Qingshan Meng, Ruoxin Li, Le Luo, Ke Qin, Chi Wang, Chenghao Ma	2023	26
8	A Review of Optical Fiber Sensing Technology Based on Thin Film and Fabry–Perot Cavity Coatings ·Chaoqun Ma, Donghong Peng, Xuanyao Bai, Shuangqiang Liu, Le Luo	2023	21
9	Development of indium bumping technology through AZ9260 resist electroplating Journal of Micromechanics and Microengineering ·Qiuping Huang, Gaowei Xu, Yuan Yuan, Xiao Bei Cheng, Le Luo	2010	21
10	Effect of aging on the microstructure and shear strength of SnPbAg/Ni-P/Cu and SnAg/Ni-P/Cu solder joints Journal of Electronic Materials ·Shawkret Ahat, Liguang Du, Mei Sheng, Le Luo, Wolfgang Kempe, J. Freytag	2000	20
11	Wafer level hermetic packaging based on Cu–Sn isothermal solidification technology Journal of Semiconductors ·Yuhan Cao, Le Luo	2009	18
12	The effect and mechanism of Internet use on the physical health of the older people—Empirical analysis based on CFPS Frontiers in Public Health ·Enkai Guo, Jing Li, Le Luo, Yang Gao, Zhaohong Wang	2022	18
13	Stress evolution during thermal cycling of copper/polyimide layered structures Materials Science in Semiconductor Processing ·Chunsheng Zhu, Wenguo Ning, Gaowei Xu, Le Luo	2014	18
14	Packaging effects on the performances of MEMS for high-G accelerometer with double-cantilevers Sensors and Actuators A Physical ·Weidong Huang, Xia Cai, Bulu Xu, Le Luo, Xinxin Li, Zhaonian Cheng	2002	17
15	Experimental identification of warpage origination during the wafer level packaging process Chunsheng Zhu, Wenguo Ning, Heng Lee, Jiaotuo Ye, Gaowei Xu, Le Luo	2014	15
16	Influence of polyimide on thermal stress evolution in polyimide/Cu thick film composite Journal of Materials Science Materials in Electronics ·Heng Li, Gong Cheng, Gaowei Xu, Le Luo	2016	14
17	Cu/Sn Isothermal Solidification Technology for Hermetic Packaging of MEMS Li Li, Jiwei Jiao, Le Luo, Yuelin Wang	2006	14
18	Influence of the Viscoelastic Properties of the Polyimide Dielectric Coating on the Wafer Warpage Journal of Electronic Materials ·Chunsheng Zhu, Wenguo Ning, Gaowei Xu, Le Luo	2014	13
19	Electroplated indium bump arrays and the bonding reliability Journal of Semiconductors ·Qiuping Huang, Gaowei Xu, Gang Quan, Yuan Yuan, Le Luo	2010	13
20	A wafer-level multi-chip module process with thick photosensitive benzocyclobutene as the dielectric for microwave application Journal of Micromechanics and Microengineering ·Jiajie Tang, Xiao Wei Sun, Le Luo	2011	13

About Le Luo

Le Luo is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials, General Materials Science, Biomedical Engineering and Mechanics of Materials, having authored 149 papers that have together received 1.1k indexed citations. Recurring topics across this work include 3D IC and TSV technologies (67 papers), Electronic Packaging and Soldering Technologies (63 papers), Copper Interconnects and Reliability (18 papers), Advanced MEMS and NEMS Technologies (16 papers), Radio Frequency Integrated Circuit Design (9 papers), Microwave Engineering and Waveguides (9 papers), Advanced Welding Techniques Analysis (8 papers) and Semiconductor materials and devices (7 papers). The work is most often cited by research in Electrical and Electronic Engineering (797 citations), Electronic, Optical and Magnetic Materials (113 citations), Materials Chemistry (270 citations), Mechanical Engineering (197 citations) and General Materials Science (16 citations). Le Luo has collaborated with scholars based in China, Germany and United States. Frequent co-authors include Gaowei Xu, Weidong Xiang, Xiaojuan Liang, Jiasong Zhong, Yuan Yuan, Jing Wang, Hailong Yang, Weidong Huang, Gong Cheng and Zhaoping Chen. Their work appears in journals such as Journal of Electronic Materials, Microsystem Technologies, Journal of Semiconductors, Journal of Materials Science Materials in Electronics and Journal of Micromechanics and Microengineering.

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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