Laura D. Marlino

1.6k total citations
20 papers, 379 citations indexed

About

Laura D. Marlino is a scholar working on Electrical and Electronic Engineering, Automotive Engineering and Control and Systems Engineering. According to data from OpenAlex, Laura D. Marlino has authored 20 papers receiving a total of 379 indexed citations (citations by other indexed papers that have themselves been cited), including 19 papers in Electrical and Electronic Engineering, 6 papers in Automotive Engineering and 3 papers in Control and Systems Engineering. Recurrent topics in Laura D. Marlino's work include Silicon Carbide Semiconductor Technologies (11 papers), Advanced DC-DC Converters (6 papers) and Multilevel Inverters and Converters (6 papers). Laura D. Marlino is often cited by papers focused on Silicon Carbide Semiconductor Technologies (11 papers), Advanced DC-DC Converters (6 papers) and Multilevel Inverters and Converters (6 papers). Laura D. Marlino collaborates with scholars based in United States and China. Laura D. Marlino's co-authors include Puqi Ning, Fred Wang, Zhenxian Liang, Hui Li, Michael D. Glover, John M. Miller, Omer C. Onar, S.S. Frank, Ty McNutt and Paul Shepherd and has published in prestigious journals such as IEEE Transactions on Power Electronics, SAE technical papers on CD-ROM/SAE technical paper series and MRS Bulletin.

In The Last Decade

Laura D. Marlino

20 papers receiving 358 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Laura D. Marlino United States 12 346 79 58 33 19 20 379
Asier Matallana Spain 7 272 0.8× 82 1.0× 95 1.6× 25 0.8× 18 0.9× 11 330
Bret Whitaker United States 9 545 1.6× 167 2.1× 43 0.7× 36 1.1× 15 0.8× 14 563
Christopher Mak Canada 6 367 1.1× 102 1.3× 82 1.4× 66 2.0× 28 1.5× 7 415
Zach Cole United States 9 625 1.8× 166 2.1× 48 0.8× 41 1.2× 17 0.9× 20 644
Vikram Immanuel United States 7 404 1.2× 32 0.4× 44 0.8× 41 1.2× 9 0.5× 9 415
Stefan Mollov France 11 345 1.0× 29 0.4× 52 0.9× 32 1.0× 9 0.5× 32 370
Borong Hu United Kingdom 9 338 1.0× 20 0.3× 84 1.4× 30 0.9× 12 0.6× 38 384
Max Poech Germany 7 589 1.7× 39 0.5× 106 1.8× 42 1.3× 13 0.7× 10 626
M. Gerber Netherlands 10 333 1.0× 88 1.1× 51 0.9× 25 0.8× 17 0.9× 27 354

Countries citing papers authored by Laura D. Marlino

Since Specialization
Citations

This map shows the geographic impact of Laura D. Marlino's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Laura D. Marlino with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Laura D. Marlino more than expected).

Fields of papers citing papers by Laura D. Marlino

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Laura D. Marlino. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Laura D. Marlino. The network helps show where Laura D. Marlino may publish in the future.

Co-authorship network of co-authors of Laura D. Marlino

This figure shows the co-authorship network connecting the top 25 collaborators of Laura D. Marlino. A scholar is included among the top collaborators of Laura D. Marlino based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Laura D. Marlino. Laura D. Marlino is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Marlino, Laura D., et al.. (2016). Optimized DC Link for Next Generation Power Modules. 1–9. 1 indexed citations
2.
Agarwal, Anant, Laura D. Marlino, Robert W. Ivester, & C. Mark Johnson. (2016). Wide Bandgap power devices and applications; the U.S. initiative. 206–209. 4 indexed citations
3.
Agarwal, Anant, et al.. (2016). Wide Band Gap Semiconductor Technology for Energy Efficiency. Materials science forum. 858. 797–802. 15 indexed citations
4.
Ericson, M.N., S.S. Frank, C.L. Britton, et al.. (2014). An integrated gate driver in 4H-SiC for power converter applications. 66–69. 6 indexed citations
5.
Liang, Zhenxian, Puqi Ning, Fred Wang, & Laura D. Marlino. (2014). A Phase-Leg Power Module Packaged With Optimized Planar Interconnections and Integrated Double-Sided Cooling. IEEE Journal of Emerging and Selected Topics in Power Electronics. 2(3). 443–450. 55 indexed citations
6.
Wereszczak, Andrew A., Zhenxian Liang, Mattison K. Ferber, & Laura D. Marlino. (2014). Uniqueness and Challenges of Sintered Silver as a Bonded Interface Material†. Additional Conferences (Device Packaging HiTEC HiTEN & CICMT). 2014(HITEC). 178–187. 7 indexed citations
7.
Frank, S.S., C.L. Britton, Laura D. Marlino, et al.. (2014). A wide bandgap silicon carbide (SiC) gate driver for high-temperature and high-voltage applications. 414–417. 45 indexed citations
8.
Glover, Michael D., Paul Shepherd, A. Matt Francis, et al.. (2014). A UVLO Circuit in SiC Compatible With Power MOSFET Integration. IEEE Journal of Emerging and Selected Topics in Power Electronics. 2(3). 425–433. 15 indexed citations
9.
Whitaker, Bret, Zach Cole, Brandon Passmore, et al.. (2014). High-temperature SiC power module with integrated SiC gate drivers for future high-density power electronics applications. 36–40. 22 indexed citations
10.
Ericson, Nance, S.S. Frank, C.L. Britton, et al.. (2013). A 4H Silicon Carbide Gate Buffer for Integrated Power Systems. IEEE Transactions on Power Electronics. 29(2). 539–542. 38 indexed citations
11.
Ning, Puqi, et al.. (2013). A compact wireless charging system development. 3045–3050. 41 indexed citations
12.
Liang, Zhenxian, Puqi Ning, Fred Wang, & Laura D. Marlino. (2012). Reducing Parasitic Electrical Parameters with a Planar Interconnection Packaging Structure. 1–6. 16 indexed citations
13.
Liang, Zhenxian, Puqi Ning, Fred Wang, & Laura D. Marlino. (2012). Planar bond all: A new packaging technology for advanced automotive power modules. Zenodo (CERN European Organization for Nuclear Research). 438–443. 26 indexed citations
14.
Ning, Puqi, Zhenxian Liang, Fred Wang, & Laura D. Marlino. (2012). Power module and cooling system thermal performance evaluation for HEV application. 48. 2134–2139. 16 indexed citations
15.
Choi, Gilsu, Zhuxian Xu, Ming Li, et al.. (2011). Development of Integrated Modular Motor Drive for Traction Applications. SAE International Journal of Engines. 4(1). 286–300. 11 indexed citations
16.
Pesaran, Ahmad, et al.. (2008). Road Transportation Vehicles. MRS Bulletin. 33(4). 439–444. 18 indexed citations
17.
Li, Hui, et al.. (2007). Design Of A 6 kW Multiple-Input Bi-directional DC-DC Converter With Decoupled Current Sharing Control For Hybrid Energy Storage Elements. Conference proceedings/Conference proceedings - IEEE Applied Power Electronics Conference and Exposition. 509–513. 27 indexed citations
18.
Hsu, J.S., D.J. Adams, G.W. Ott, et al.. (2002). Low-inertia axial-gap permanent-magnet motors. 1. 479–486. 1 indexed citations
19.
Hsu, J.S., et al.. (2002). Nature and assessments of torque ripples of permanent-magnet adjustable-speed motors. 3. 2696–2702. 8 indexed citations
20.
McKeever, J.W., et al.. (2000). Life-Cycle Cost Sensitivity to Battery-Pack Voltage of an HEV. SAE technical papers on CD-ROM/SAE technical paper series. 1. 7 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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