Klaus Timmel
- Mechanical Engineering top 5%
- Biomedical Engineering
- Electrical and Electronic Engineering
- Materials Chemistry
- Computational Mechanics top 10%
- Co-authors
- Sven EckertG. GerbethThomas WondrakFrank StefaniWuliang YinAnthony PeytonN TerzijaDirk Lucas
- Topics
- Metallurgical Processes and Thermodynamics (23 papers)Non-Destructive Testing Techniques (11 papers)Electrical and Bioimpedance Tomography (9 papers)
- Journals
- Measurement Science and TechnologyISIJ InternationalMetallurgical and Materials Transactions B
- Partner nations
- GermanyUnited KingdomFrance
In The Last Decade
Klaus Timmel
26 papers receiving 612 citations
Peers
Comparison fields: 5 of 39
- Mechanical Engineering 552
- Biomedical Engineering 188
- Electrical and Electronic Engineering 166
- Materials Chemistry 153
- Computational Mechanics 143
Countries citing papers authored by Klaus Timmel
This map shows the geographic impact of Klaus Timmel's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Klaus Timmel with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Klaus Timmel more than expected).
Fields of papers citing papers by Klaus Timmel
This network shows the impact of papers produced by Klaus Timmel. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Klaus Timmel. The network helps show where Klaus Timmel may publish in the future.
Co-authorship network of co-authors of Klaus Timmel
This figure shows the co-authorship network connecting the top 25 collaborators of Klaus Timmel. A scholar is included among the top collaborators of Klaus Timmel based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Klaus Timmel. Klaus Timmel is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 1 | |
| 2 | 3 | |
| 3 | 33 | |
| 4 | 2 | |
| 5 | 15 | |
| 6 | 3 | |
| 7 | 9 | |
| 8 | 8 | |
| 9 | 8 | |
| 10 | 59 | |
| 11 | 12 | |
| 12 | 11 | |
| 13 | 55 | |
| 14 | 24 | |
| 15 | 75 | |
| 16 | 45 | |
| 17 | 35 | |
| 18 | 92 | |
| 19 | 40 | |
| 20 | 11 |
About Klaus Timmel
Klaus Timmel is a scholar working on Mechanical Engineering, Computational Mechanics and Mechanics of Materials, having authored 26 papers that have together received 637 indexed citations. Recurring topics across this work include Metallurgical Processes and Thermodynamics (23 papers), Non-Destructive Testing Techniques (11 papers) and Electrical and Bioimpedance Tomography (9 papers). The work is most often cited by research in Mechanical Engineering (552 citations), Computational Mechanics (143 citations) and Mechanics of Materials (118 citations). Klaus Timmel has collaborated with scholars based in Germany, United Kingdom and France. Frequent co-authors include Sven Eckert, G. Gerbeth, Thomas Wondrak, Frank Stefani, Wuliang Yin, Anthony Peyton, N Terzija, Dirk Lucas, V. Galindo and Michael Røder. Their work appears in journals such as Measurement Science and Technology, ISIJ International and Metallurgical and Materials Transactions B.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.